scholarly journals Short‐Contact Touch‐Manipulation of Scatterplot Matrices on Wall Displays

2020 ◽  
Vol 39 (3) ◽  
pp. 265-276 ◽  
Author(s):  
P. Riehmann ◽  
G. Molina León ◽  
J. Reibert ◽  
F. Echtler ◽  
B. Froehlich
Keyword(s):  
Short Contact ◽  
Scatterplot Matrices

Non-Premixed Reactive Volatilization Reactor for Catalytic Partial Oxidation of Low Volatility Fuels at a Short Contact Time

2021 ◽  
Author(s):  
Ying Lin ◽  
Xuesong Li ◽  
Martyn Twigg ◽  
William F Northrop
Keyword(s):  
Partial Oxidation ◽  
Contact Time ◽  
Catalytic Partial Oxidation ◽  
Liquid Hydrocarbons ◽  
Short Contact ◽  
Short Contact Time ◽  
Opposed Flow

This work presents a novel non-premixed opposed-flow reactive volatilization reactor that simultaneously vaporizes and partially oxidizes low volatility liquid hydrocarbons at a short contact time (<12 ms). In the reactor,...

Short contact time oxidative dehydrogenation of propane

2001 ◽  
Vol 64 (1-2) ◽  
pp. 113-120 ◽  
Author(s):  
M Fathi ◽  
R Lødeng ◽  
E.S Nilsen ◽  
B Silberova ◽  
A Holmen
Keyword(s):  
Oxidative Dehydrogenation ◽  
Contact Time ◽  
Oxidative Dehydrogenation Of Propane ◽  
Short Contact ◽  
Short Contact Time

Novel co-crystals with π-hole interactions between iodide anions and quinoid rings involving charge transfer

CrystEngComm ◽  
2021 ◽  
Author(s):  
Valentina Milasinovic ◽  
Kresimir Molcanov
Keyword(s):  
Charge Transfer ◽  
Quinoid Ring ◽  
Organic Cations ◽  
Short Contact ◽  
Iodide Anion

Six novel co-crystals of tetrabromoquinone with iodide salts of organic cations displaying short contact between iodide anion and the quinoid ring have been structurally characterised. Sandwich-like groups I−∙∙∙quinone∙∙∙I− are present...

Short-contact dithranol therapy—a comparison with the Ingram regime

1984 ◽  
Vol 110 (6) ◽  
pp. 703-708 ◽  
Author(s):  
B.N. STATHAM ◽  
K.S. RYATT ◽  
N.R. ROWELL
Keyword(s):  
Short Contact

scholarly journals Resolution of Damaged Metallization on Highly Complex Semiconductor Device

2020 ◽  
pp. 7-12
Author(s):  
Antonio Sumagpang Jr. ◽  
Frederick Ray Gomez
Keyword(s):  
Design Of Experiments ◽  
Semiconductor Device ◽  
Electrostatic Discharge ◽  
Test Design ◽  
Functional Testing ◽  
Assembly Process ◽  
Short Contact ◽  
Contact Test ◽  
Corrective Actions ◽  
Complex Semiconductor

The paper focused on the resolution of damaged metallization during assembly process that lead to gross open-short (O/S) rejections during functional testing of a highly complex semiconductor package. Numerous batches were put on hold due to not meeting the specification assigned for the short contact test. Design of experiments (DOE) on assembly processes were conducted and eventually identified the reject as an electrostatic discharge (ESD) related failure. Corrective actions and ESD controls significantly reduced the occurrence of damaged metallization with around 85% reduction.

scholarly journals Strength of Bonds between Ice Grains after Short Contact Times

1982 ◽  
Vol 28 (100) ◽  
pp. 457-473 ◽  
Author(s):  
H. Gubler
Keyword(s):  
Plastic Deformation ◽  
Sharp Increase ◽  
Maximum Rate ◽  
Load Capacity ◽  
Tensile Force ◽  
Tensile Load ◽  
Surface Flow ◽  
Initial State ◽  
Short Contact ◽  
Rate Of Increase

AbstractThe tensile force required to break bonds between ice grains after short contact times (1–500 s) is measured as a function of temperature and contact pressure. The results indicate a sharp increase of the tensile load capacity of bonds alter short contact times near the melting point and a maximum rate of increase of the load capacity at −5 °C. The initial state or sintering is modelled, assuming viscous surface flow and plastic deformation as the main mechanisms.

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