DRAM scaling-down to 0.1 μm generation using bitline spacerless storage node SAC and RIR capacitor with TiN contact plug

2002 ◽  
Author(s):  
Beom-Jun Jin ◽  
Young-Pil Kim ◽  
Byeong-Yun Nam ◽  
Hyoung-Joon Kim ◽  
Young-Wook Park ◽  
...  
Keyword(s):  
Storage Node ◽  
Scaling Down

Chaplaincies in a “Post-Secular” Multicultural University

2015 ◽  
Vol 9 (2) ◽  
pp. 147-165 ◽  
Author(s):  
Adam Possamai ◽  
Arathi Sriprakash ◽  
Ellen Brackenreg ◽  
John McGuire
Keyword(s):  
Public Institutions ◽  
Religion And Spirituality ◽  
Scaling Down ◽  
The University

As universities in Australia are faced with a growth in diversity and intensity of religion and spirituality on campus, this article explores the work of chaplains and its reception by students on a multi-campus suburban university. It finds that the religious work of these professionals is not the primary emphasis in the university context; what is of greater significance to students and the university institution is the broader pastoral and welfare-support role of chaplains. We discuss these findings in relation to post-secularism theory and the scaling down of state-provided welfare in public institutions such as universities.

Analysis of Retention Time Degradation Caused by Electrostatic Potential Variation between Adjacent Bit-Line and Adjacent Contact Node in DRAM

2016 ◽  
Author(s):  
Jungil Mok ◽  
Byungki Kang ◽  
Daesun Kim ◽  
Hongsun Hwang ◽  
Sangjae Rhee ◽  
...  
Keyword(s):  
Electric Field ◽  
Electrostatic Potential ◽  
Critical Dimension ◽  
Data Retention ◽  
Signal Line ◽  
Adjacent Node ◽  
Storage Node ◽  
Retention Characteristics ◽  
Node Voltage ◽  
The Relationship

Abstract Systematic retention failure related on the adjacent electrostatic potential is studied with sub 20nm DRAM. Unlike traditional retention failures which are caused by gate induced drain leakage or junction leakage, this failure is influenced by the combination of adjacent signal line and adjacent contact node voltage. As the critical dimension between adjacent active and the adjacent signal line and contact node is scaled down, the effect of electric field caused by adjacent node on storage node is increased gradually. In this paper, we will show that the relationship between the combination electric field of adjacent nodes and the data retention characteristics and we will demonstrate the mechanism based on the electrical analysis and 3D TCAD simulation simultaneously.

Application of AFP Nanoprobing Light-Induced Photovoltaic Current in the Failure Analysis

2017 ◽  
Author(s):  
C.Q. Chen ◽  
P.T. Ng ◽  
G.B. Ang ◽  
Francis Rivai ◽  
S.L. Ting ◽  
...  
Keyword(s):  
Image Analysis ◽  
Failure Analysis ◽  
Photovoltaic Effect ◽  
Electrical Characterization ◽  
Fault Isolation ◽  
Device Performance ◽  
Semiconductor Technology ◽  
Current Image ◽  
Scaling Down ◽  
Detailed Circuit

Abstract As semiconductor technology keeps scaling down, failure analysis and device characterizations become more and more challenging. Global fault isolation without detailed circuit information comprises the majority of foundry EFA cases. Certain suspected areas can be isolated, but further narrow-down of transistor and device performance is very important with regards to process monitoring and failure analysis. A nanoprobing methodology is widely applied in advanced failure analysis, especially during device level electrical characterization. It is useful to verify device performance and to prove the problematic structure electrically. But sometimes the EFA spot coverage is too big to do nanoprobing analysis. Then further narrow-down is quite critical to identify the suspected structure before nanoprobing is employed. That means there is a gap between global fault isolation and localized device analysis. Under these kinds of situation, PVC and AFP current image are offen options to identify the suspected structure, but they still have their limitation for many soft defect or marginal fails. As in this case, PVC and AFP current image failed to identify the defect in the spot range. To overcome the shortage of PVC and AFP current image analysis, laser was innovatively applied in our current image analysis in this paper. As is known to all, proper wavelength laser can induce the photovoltaic effect in the device. The photovoltaic effect induced photo current can bring with it some information of the device. If this kind of information was properly interpreted, it can give us some clue of the device performance.

scholarly journals Selected Aspects of Electrochemical Micromachining Technology Development

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2248
Author(s):  
Sebastian Skoczypiec ◽  
Piotr Lipiec ◽  
Wojciech Bizoń ◽  
Dominik Wyszyński
Keyword(s):  
Technology Development ◽  
Electrochemical Machining ◽  
Electrochemical Micromachining ◽  
Cylindrical Electrode ◽  
Electrode Tool ◽  
Geometrical Features ◽  
Tool Trajectory ◽  
Scaling Down ◽  
Sidewall Surface ◽  
Selection Of

The paper focuses on the fundamentals of electrochemical machining technology de-elopement with special attention to applications for micromachining. In this method, a material is removed during an anodic electrochemical dissolution. The method has a number of features which make it attractive technology for shaping parts with geometrical features in range of micrometres. The paper is divided into two parts. The first one covers discussion on: general characteristics of electrochemical machining, phenomena in the gap, problems resulting from scaling down the process and electrochemical micromachining processes and variants. The second part consists of synthetic overview of the authors’ research on localization of pulse electrochemical micromachining process and case studies connected with application of this method with use of universal cylindrical electrode-tool for shaping cavities in 1.4301 stainless steel. The latter application was conducted in two following variants: electrochemical contour milling and shaping carried out with sidewall surface of rotating tool. In both cases, the obtained shape is a function of electrode tool trajectory. Selection of adequate machining strategy allows to obtain desired shape and quality.

Development of resin transfer molding process using scaling down strategy

2013 ◽  
Vol 35 (9) ◽  
pp. 1683-1689 ◽  
Author(s):  
Raghu Raja Pandiyan Kuppusamy ◽  
Swati Neogi
Keyword(s):  
Resin Transfer Molding ◽  
Molding Process ◽  
Transfer Molding ◽  
Scaling Down

Scaling-down the CSA recoupling in S-CODEX 1D-MAS exchange experiments

2003 ◽  
Vol 380 (5-6) ◽  
pp. 583-588 ◽  
Author(s):  
D. Reichert ◽  
O. Pascui ◽  
T.J. Bonagamba ◽  
E.R. deAzevedo ◽  
A. Schmidt
Keyword(s):  
Scaling Down
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