Wafer bonding of polycrystalline spinel with LiNbO3/LiTaO3 for temperature compensation of RF surface acoustic wave devices
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2006 ◽
Vol 45
(5B)
◽
pp. 4500-4504
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2012 ◽
Vol 59
(1)
◽
pp. 135-138
◽
Keyword(s):
Keyword(s):
Keyword(s):
1985 ◽
Vol 78
(5)
◽
pp. 1932-1932