Wafer bonding of polycrystalline spinel with LiNbO3/LiTaO3 for temperature compensation of RF surface acoustic wave devices

Author(s):  
K. Geshi ◽  
K. Teraoka ◽  
S. Kinoshita ◽  
M. Nakayama ◽  
Y. Imagawa ◽  
...  
2006 ◽  
Vol 45 (5B) ◽  
pp. 4500-4504 ◽  
Author(s):  
Takuya Nakatsukasa ◽  
Shingo Akao ◽  
Tsuneo Ohgi ◽  
Noritaka Nakaso ◽  
Takuji Abe ◽  
...  

2017 ◽  
Vol 9 (28) ◽  
pp. 4112-4134 ◽  
Author(s):  
David B. Go ◽  
Massood Z. Atashbar ◽  
Zeinab Ramshani ◽  
Hsueh-Chia Chang

Surface acoustic wave sensors and microfluidic platforms enable effective chemical detection and sample manipulation.


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