High-spatial-resolution sub-surface imaging using a laser-based acoustic microscopy technique

2011 ◽  
Vol 58 (1) ◽  
pp. 226-233 ◽  
Author(s):  
Oluwaseyi Balogun ◽  
Garrett D. Cole ◽  
Robert Huber ◽  
Diane Chinn ◽  
Todd W. Murray ◽  
...  
Keyword(s):  
Spatial Resolution ◽  
High Spatial Resolution ◽  
Acoustic Microscopy ◽  
Surface Imaging ◽  
Microscopy Technique

scholarly journals Enhanced method for High Spatial Resolution surface imaging and analysis of fungal spores using Scanning Electron Microscopy

2018 ◽  
Vol 8 (1) ◽  
Author(s):  
Gopal Venkatesh Babu ◽  
Palani Perumal ◽  
Sakthivel Muthu ◽  
Sridhar Pichai ◽  
Karthik Sankar Narayan ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Spatial Resolution ◽  
High Spatial Resolution ◽  
Fungal Spores ◽  
Surface Imaging ◽  
Scanning Electron

High-resolution picosecond acoustic microscopy for non-invasive characterization of buried interfaces

2006 ◽  
Vol 21 (5) ◽  
pp. 1204-1208 ◽  
Author(s):  
Shriram Ramanathan ◽  
David G. Cahill
Keyword(s):  
High Resolution ◽  
Spatial Resolution ◽  
Integrated Circuit ◽  
Acoustic Waves ◽  
Spot Size ◽  
Acoustic Microscopy ◽  
Microscopy Technique ◽  
Fundamental Limitations ◽  
Buried Interfaces ◽  
Advanced Packaging

Non-destructive investigation of buried interfaces at high-resolution is critical for integrated circuit and advanced packaging research and development. In this letter, we present a novel non-contact microscopy technique using ultrahigh frequency (GHz range) longitudinal acoustic pulses to form images of interfaces and layers buried deep inside a silicon device. This method overcomes fundamental limitations of conventional scanning acoustic microscopy by directly generating and detecting the acoustic waves on the surface of the sample using an ultrafast pump-probe optical technique. We demonstrate our method by imaging copper lines buried beneath a 6-μm silicon wafer; the lateral spatial resolution of 3 μm is limited by the laser spot size. In addition to the high lateral spatial resolution, the technique has picosecond (ps) time resolution and therefore will enable imaging individual interconnect layers in multi-layer stacked devices.

Acoustic Microscopy for Imaging and Characterization

MRS Bulletin ◽  
1996 ◽  
Vol 21 (10) ◽  
pp. 30-35 ◽  
Author(s):  
Andrew Briggs ◽  
Oleg Kolosov
Keyword(s):  
Nondestructive Testing ◽  
Spatial Resolution ◽  
High Spatial Resolution ◽  
Surface Coatings ◽  
Acoustic Microscopy ◽  
Minimum Size ◽  
Structure And Properties ◽  
Acoustic Microscope ◽  
Object A ◽  
Selection Of

Acoustic microscopy is useful for characterizing with high spatial resolution the elastic structure and properties of an object. A range of techniques is now available for doing this, which enables the user to select the method and instrument that is most appropriate for a particular requirement. For imaging the interior of structures such as electronic-component packaging, an acoustic microscope operating at a relatively modest frequency can provide advanced nondestructive testing. For characterizing surface coatings and layers that may be only a fraction of a micrometer thick, higher frequency quantitative techniques are needed. For a given application, three questions should be asked at the outset: (1) What depth of material do I wish to include in my inspection? (2) Do I wish to image structures and/or defects, or do I wish to characterize elastic properties? (3) What is the minimum size of a defect or inhomogeneity that I wish to resolve or characterize (at a given depth) during my inspection? Selection of the appropriate technique will depend on the answers.

High spatial resolution surface imaging and analysis of fungal cells using SEM and AFM

Micron ◽  
2008 ◽  
Vol 39 (4) ◽  
pp. 349-361 ◽  
Author(s):  
Susan G.W. Kaminskyj ◽  
Tanya E.S. Dahms
Keyword(s):  
Spatial Resolution ◽  
High Spatial Resolution ◽  
Surface Imaging

Measurement of elastic impedance with high spatial resolution using acoustic microscopy

1995 ◽  
Vol 67 (6) ◽  
pp. 745-747 ◽  
Author(s):  
S. Hirsekorn ◽  
S. Pangraz ◽  
G. Weides ◽  
W. Arnold
Keyword(s):  
Spatial Resolution ◽  
High Spatial Resolution ◽  
Acoustic Microscopy ◽  
Elastic Impedance

High spatial resolution AEM observations of yttrium segregation in chromia scales grown on Co-45%Cr

1986 ◽  
Vol 44 ◽  
pp. 518-519
Author(s):  
K. Przybylski ◽  
A. J. Garratt-Reed ◽  
G. J. Yurek
Keyword(s):  
Spatial Resolution ◽  
Outer Surface ◽  
Maximum Concentration ◽  
High Spatial Resolution ◽  
Reactive Elements ◽  
Chromia Scales

The addition of so-called “reactive” elements such as yttrium to alloys is known to enhance the protective nature of Cr2O3 or Al2O3 scales. However, the mechanism by which this enhancement is achieved remains unclear. An A.E.M. study has been performed of scales grown at 1000°C for 25 hr. in pure O2 on Co-45%Cr implanted at 70 keV with 2x1016 atoms/cm2 of yttrium. In the unoxidized alloys it was calculated that the maximum concentration of Y was 13.9 wt% at a depth of about 17 nm. SIMS results showed that in the scale the yttrium remained near the outer surface.

Integration of Core-Edge Spectroscopy Methods for the Study of Polymers

1996 ◽  
Vol 54 ◽  
pp. 154-155
Author(s):  
E. G. Rightor
Keyword(s):  
Excited State ◽  
Polymer Blends ◽  
Gas Phase ◽  
Spatial Resolution ◽  
High Spatial Resolution ◽  
Electronic States ◽  
Core Electron ◽  
Bulk Solids ◽  
Development Application

Core edge spectroscopy methods are versatile tools for investigating a wide variety of materials. They can be used to probe the electronic states of materials in bulk solids, on surfaces, or in the gas phase. This family of methods involves promoting an inner shell (core) electron to an excited state and recording either the primary excitation or secondary decay of the excited state. The techniques are complimentary and have different strengths and limitations for studying challenging aspects of materials. The need to identify components in polymers or polymer blends at high spatial resolution has driven development, application, and integration of results from several of these methods.

Sign in / Sign up

Export Citation Format

Share Document