Very high electrical resistivity and heteroamorphous structure of soft magnetic (Co/sub 35.6/Fe/sub 50/B/sub 14.4/)-(SiO/sub 2/) thin films

2002 ◽  
Vol 38 (5) ◽  
pp. 3147-3149 ◽  
Author(s):  
M. Munakata ◽  
M. Motoyama ◽  
M. Yagi ◽  
T. Ito ◽  
Y. Shimada ◽  
...  
Keyword(s):  
Thin Films ◽  
Electrical Resistivity ◽  
Soft Magnetic ◽  
High Electrical Resistivity ◽  
Very High

HIPERCO 15

Alloy Digest ◽  
2002 ◽  
Vol 51 (10) ◽  
Keyword(s):  
Electrical Resistivity ◽  
Cobalt Content ◽  
Heat Treating ◽  
High Saturation Magnetization ◽  
Soft Magnetic ◽  
Magnetic Alloys ◽  
Soft Magnetic Alloys ◽  
High Electrical Resistivity ◽  
Technology Corporation ◽  
Carpenter Technology Corporation

Abstract Hiperco Alloy 15 is a development in soft magnetic alloys that combines the properties of high saturation, magnetization, high electrical resistivity, and lower cobalt content. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on forming and heat treating. Filing Code: FE-124. Producer or source: Carpenter Technology Corporation.

Lattice Defects in SrRuO3 Thin Films and Their Contribution to film Resistivity

1999 ◽  
Vol 574 ◽  
Author(s):  
N. D. Zakharov ◽  
K. M. Satyalakshmi ◽  
G. Koren ◽  
D. Hesse
Keyword(s):  
Thin Films ◽  
Electrical Resistivity ◽  
Lattice Defects ◽  
Cubic Phase ◽  
Orthorhombic Structure ◽  
Film Resistivity ◽  
High Electrical Resistivity ◽  
Lattice Symmetry ◽  
Transmission Electron ◽  
Substrate Temperatures

AbstractLattice defects present in PLD-grown, epitaxial SrRuO3 thin films on (001) SrTiO3 substrates are analyzed by high resolution transmission electron microscopy (HRTEM). Before the preparation of TEM samples, the electrical resistivity of films grown at different substrate temperatures was determined. Films grown at 775 °C exhibited a low electrical resistivity of only 200 μΩcm. They were found to be of orthorhombic structure and contained only few lattice defects. Films grown at 700 °C showed a high electrical resistivity of 1400 μΩcm. They were of cubic lattice symmetry, while films grown at temperatures above 800 °C showed resistivities between 300 and 900 μΩcm. The latter films mainly consist of an orthorhombic-cubic phase mix and involve lattice defects of high density, such as twins and antiphase boundaries (APBs). These defects are mainly located in between the islands and obviously contribute to the high film resistivity observed. For example, the APBs contain an extra single SrO layer, which is certainly insulating. Moreover, Ru vacancies are present in these films.

TEM of Pyrolytic Al2O3 and Ta-Al2O3 Thin Films on Silicon

1974 ◽  
Vol 32 ◽  
pp. 474-475
Author(s):  
R. M. Anderson
Keyword(s):  
Thin Films ◽  
Electrical Resistivity ◽  
Cross Sections ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Deposition Rates ◽  
Metal Insulator ◽  
Semiconductor Structures ◽  
High Electrical Resistivity ◽  
Amorphous Structures

Pyrolytically deposited Al2O3, thin films are employed as dielectrics in metal-insulator-semiconductor structures used for insulated-gate field-effect transistors. Ideally, very thin Al2O3 films should have smooth surfaces, uniform cross-sections and high electrical resistivity. These requirements are best met by amorphous Al2O3, film microstructures. Pyrolysis of amorphous Al2O3 films must be undertaken at temperatures lower than 700°C with a concomitant low deposition rate. The incorporation of Ta in the Al2O3 yields amorphous structures at deposition tempera tures of about 800-900°C with substantially higher deposition rates.

Influence of Magnetic Field Thermal Annealing on the High- Frequency Performance of the FeCo-Based Granular Thin Films

2011 ◽  
Vol 687 ◽  
pp. 99-105 ◽  
Author(s):  
Guang Duo Lu ◽  
Huai Wu Zhang ◽  
Xiao Li Tang ◽  
Yuan Xun Li ◽  
Zhi Yong Zhong
Keyword(s):  
Magnetic Field ◽  
Thin Films ◽  
Thermal Annealing ◽  
Anisotropy Field ◽  
Soft Magnetic ◽  
High Electrical Resistivity ◽  
Optimal Annealing Temperature ◽  
High Anisotropy ◽  
Field Annealing ◽  
Annealing Method

A series of FeCoHfO granular films were fabricated by reactive DC magnetron reactive sputtering at varying partial pressure of oxygen and annealed by magnetic field thermal annealing. By using magnetic field annealing method suitably, the soft magnetic properties of FeCoHfO granular thin films are improved obviously. The optimal annealing temperature and annealing time are 350 °C and 20 minute, respectively. The films with desired properties of low coercivity, Hc~2Oe, relatively high saturation magnetization, 4pMs~20.5 kG, high anisotropy field Hk~50Oe, and high electrical resistivity r ~ 1875mWcm and natural ferromagnetic resonant frequency about 3 GHz have been obtained.

Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package

2005 ◽  
Vol 2 (3) ◽  
pp. 217-222
Author(s):  
Yasunari Ukita ◽  
Kazuki Tateyama ◽  
Masao Segawa ◽  
Yoshihiko Tojo ◽  
Hideyuki Gotoh ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silver Nanoparticles ◽  
Electrical Resistivity ◽  
High Power ◽  
Lead Free ◽  
Silver Particles ◽  
Power Transistor ◽  
Silver Paste ◽  
High Electrical Resistivity ◽  
Very High

Lead-free materials are required to replace conventional lead-containing solder for environmental protection. The Pb-rich solder die mount material in a high-power transistor package is required to be replaced by a silver adhesive paste. The silver paste has disadvantages such as low thermal conductivity and high electrical resistivity, since conduction paths are achieved only by mechanical contacts between silver particles. Recently, a new conductive paste containing silver particles and silver nanoparticles with a particle size of 3–7 nm in diameter was developed. The paste shows very low electrical resistivity of 6×10−6 ohm.cm, since the silver nanoparticles can be fused at temperatures below 200°C. We have been studying the possibility of the paste as a die mount material for high-power transistor packages. It was confirmed that the paste had a very high thermal conductivity of 51 W/mK. We fabricated a high-power transistor package using this paste. As a result, the package showed lower thermal resistance than that fabricated using silver paste or lead-containing solder. Moreover, the package is sufficiently reliable that it passed the thermal cycle and pressure cooker tests. This paste can be applied to a high-power transistor package in place of lead-containing solder.

scholarly journals Soft Magnetic Property and High-Electrical-Resistivity in Dense Fe Cluster Assemblies

2005 ◽  
Vol 52 (4) ◽  
pp. 249-254 ◽  
Author(s):  
Kenji Sumiyama ◽  
Dong-Liang Peng ◽  
Hirohisa Yamada ◽  
Takehiko Hihara ◽  
Tetsuo Uchida
Keyword(s):  
Electrical Resistivity ◽  
Magnetic Property ◽  
Soft Magnetic Property ◽  
Soft Magnetic ◽  
High Electrical Resistivity
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