Application of Neural Networks in Optical Inspection and Classification of Solder Joints in Surface Mount Technology

2006 ◽  
Vol 2 (3) ◽  
pp. 200-209 ◽  
Author(s):  
G. Acciani ◽  
G. Brunetti ◽  
G. Fornarelli
Keyword(s):  
Neural Networks ◽  
Solder Joints ◽  
Surface Mount Technology ◽  
Surface Mount ◽  
Optical Inspection

Solder Joint Formation in Surface Mount Technology—Part II: Design

1990 ◽  
Vol 112 (3) ◽  
pp. 219-222 ◽  
Author(s):  
S. M. Heinrich ◽  
N. J. Nigro ◽  
A. F. Elkouh ◽  
P. S. Lee
Keyword(s):  
Surface Tension ◽  
Solder Joint ◽  
Solder Joints ◽  
Cross Sectional Area ◽  
Surface Mount Technology ◽  
Sectional Area ◽  
Cross Sectional ◽  
Joint Formation ◽  
Surface Mount ◽  
Surface Tension Model

In this paper dimensionless design curves relating fillet height and length to joint cross-sectional area are presented for surface-mount solder joints. Based on an analytical surface tension model, the advantage of these dimensionless curves is that they may be used for arbitrary values of solder density and surface tension. The range of applicability of previously developed approximate formulae for predicting joint dimensions is also investigated. A simple example problem is included to illustrate the use of both the design curves and the approximate formulae.

Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

1994 ◽  
Vol 116 (2) ◽  
pp. 89-91 ◽  
Author(s):  
M. K. Schwiebert
Keyword(s):  
Simple Model ◽  
Solder Joint ◽  
Solder Joints ◽  
Reaction Force ◽  
Molten Solder ◽  
Surface Mount Technology ◽  
Surface Mount

This study considers the influence of solder joint voiding and seating plane stability on the lead standoffs of surface mount technology (SMT) solder joints. A model is presented for approximating the reaction force generated by a gas-filled void in molten solder which is compressed under an SMT lead. Seating plane stability is defined with a simple model. The lead standoffs of a component with an unstable seating plane are sensitive to small forces. For some SMT components, the reaction force generated by compressed voids in molten solder can tilt or rock a component, resulting in lead standoffs much greater than the measured lead coplanarity.

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