Economic justification of process improvement and automation projects

2002 ◽  
Author(s):  
B. Baldwin
Keyword(s):  
Process Improvement ◽  
Economic Justification

Characterization of sign-out in pediatric acute care wards to inform process improvement

2006 ◽  
Author(s):  
Richard M. D. Sledd ◽  
Ellen J. Bass ◽  
Stephen M. Borowitz ◽  
Linda A. Waggoner-Fountain
Keyword(s):  
Acute Care ◽  
Process Improvement

An emergency medical process improvement for the reduction of service stay time

2009 ◽  
Vol 10 (1) ◽  
pp. 191-224
Author(s):  
송재호 ◽  
배주억 ◽  
송준우 ◽  
김경섭 ◽  
박유섭 ◽  
...  
Keyword(s):  
Process Improvement ◽  
Emergency Medical ◽  
Stay Time ◽  
Medical Process

Failure Types & Analysis In Cu Process Development of Design-Rule 0.18μm CPU

2001 ◽  
Author(s):  
DongKwon Jeong ◽  
JuHyeon Ahn ◽  
SangIn Lee ◽  
JooHyuk Chung ◽  
ByungLyul Park ◽  
...  
Keyword(s):  
Process Improvement ◽  
Process Development ◽  
Metal Corrosion ◽  
Pass Rate ◽  
Design Rule ◽  
The Novel ◽  
Corrosion Loss ◽  
Barrier Metal ◽  
Development State ◽  
Failure Types

Abstract This paper presents the problems, the solutions, and the development state of the novel 0.18 μm Cu Metal Process through failure analysis of the Alpha CPU under development at Samsung Electronics. The presented problems include : “Via Bottom Lifting” induced by the Cu Via void, “Via Bottom dissociation” due to the IMD stress, “Via side dissociation” due to the poor formation of the Barrier Metal, “Via short/not-open failure” due to the IMD lifting, and Cu metal Corrosion/Loss. The analysis was carried out on the Via Contact Test Chain Patterns, using the “Electron (ION) Charge Up” method. After carefully analyzing each of the failure types, process improvement efforts followed. As a result, the pass rate of the via contact Rc was brought up from a mere 20% to 95%, and the device speed higher than 1.1 GHz was achieved, which surpasses the target speed of 1 GHz.

Sign in / Sign up

Export Citation Format

Share Document