Multi-site test of RF transceivers on low-cost digital ATE

2011 ◽  
Author(s):  
Ivo Kore ◽  
Ben Schuffenhauer ◽  
Frank Demmerle ◽  
Frank Neugebauer ◽  
Gert Pfahl ◽  
...  
Keyword(s):  
Low Cost ◽  
Rf Transceivers ◽  
Site Test ◽  
Digital Ate

Advanced SiP Packaging Technologies of IPD for Mobile Applications

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 1-20
Author(s):  
Geun Sik Kim ◽  
Kai Liu ◽  
Flynn Carson ◽  
Seung Wook Yoon ◽  
Meenakshi Padmanathan
Keyword(s):  
High Performance ◽  
Low Cost ◽  
Autonomous Systems ◽  
System Level ◽  
Design And Technology ◽  
Wafer Level ◽  
Future Technology ◽  
Rf Transceivers ◽  
And Performance ◽  
3D Stacking

IPD technology was originally developed as a way to replace bulky discrete passive components, but it¡¯s now gaining popularity in ESD/EMI protection applications, as well as in RF, high-brightness LED silicon sub-mounts, and digital and mixed-signal devices. Already well known as a key enabler of system-in-packages (SiPs), IPDs enable the assembly of increasingly complete and autonomous systems with the integration of diverse electronic functions such as sensors, RF transceivers, MEMS, power amplifiers, power management units, and digital processors. The application area for IPD will continue to evolve, especially as new packaging technology, such as flipchip, 3D stacking, wafer level packaging become available to provide vertical interconnections within the IPD. New applications like silicon interposers will become increasingly significant to the market. Currently the IPD market is being driven primarily by RF or wireless packages and applications including, but not limited to, cell phones, WiFi, GPS, WiMAX, and WiBro. In particular, applications and products in the emerging RF CMOS market that require a low cost, smaller size, and high performance are driving demand. In order to get right products in size and performance, packaging design and technology should be considered in device integration and implemented together in IPD designs. In addition, a comprehensive understanding of electrical and mechanical properties in component and system level design is important. This paper will highlight some of the recent advancements in SiP technology for IPD and integration as well as what is developed to address future technology requirements in IPD SiP solutions. The advantage and applications of SiP solution for IPD will be presented with several examples of IPD products. The design, assembly and packaging challenges and performance characteristics will be also discussed.

Low Cost Parametric Failure Diagnosis of RF Transceivers

2006 ◽  
Author(s):  
Donghoon Han ◽  
S. Goyal ◽  
S. Bhattacharya ◽  
A. Chatterjee
Keyword(s):  
Low Cost ◽  
Failure Diagnosis ◽  
Rf Transceivers ◽  
Parametric Failure

Low-cost EVM built-in test of RF transceivers

2014 ◽  
Author(s):  
Ayssar Serhan ◽  
Louay Abdallah ◽  
Haralampos-G. Stratigopoulos ◽  
Salvador Mir
Keyword(s):  
Low Cost ◽  
Rf Transceivers

scholarly journals Built-In Measurements in Low-Cost Digital-RF Transceivers

2011 ◽  
Vol E94-C (6) ◽  
pp. 930-937 ◽  
Author(s):  
Oren ELIEZER ◽  
Robert Bogdan STASZEWSKI
Keyword(s):  
Low Cost ◽  
Rf Transceivers ◽  
Digital Rf

Low-cost phase noise testing of complex RF ICs using standard digital ATE

2014 ◽  
Author(s):  
Stephane David-Grignot ◽  
Florence Azais ◽  
Laurent Latorre ◽  
Francois Lefevre
Keyword(s):  
Phase Noise ◽  
Low Cost ◽  
Digital Ate ◽  
Rf Ics
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