Applications of semiconductor test economics, and multisite testing to lower cost of test

2003 ◽  
Author(s):  
A.C. Evans
Keyword(s):  
Lower Cost ◽  
Semiconductor Test ◽  
Test Economics

Morphometric analysis of cellular interactions with the endothelium during the development of arterial lesions using Scanning Electron Microscopy and digital image analysis

1987 ◽  
Vol 45 ◽  
pp. 918-919
Author(s):  
M.E. Rosenfeld ◽  
C. Karboski ◽  
M.F. Prescott ◽  
P. Goodwin ◽  
R. Ross
Keyword(s):  
Electron Microscopy ◽  
Image Analysis ◽  
Quantitative Data ◽  
Digital Image Analysis ◽  
Lower Cost ◽  
Matched Control ◽  
Digital Analysis ◽  
Cellular Interactions ◽  
Arterial Lesions ◽  
Scanning Electron

Previous research documenting the chronology of the cellular interactions that occur on or below the surface of the endothelium during the initiation and progression of arterial lesions, primarily consisted of descriptive studies. The recent development of lower cost image analysis hardware and software has facilitated the collection of high resolution quantitative data from microscopic images. In this report we present preliminary quantitative data on the sequence of cellular interactions that occur on the endothelium during the initiation of atherosclerosis or vasculitis utilizing digital analysis of images obtained directly from the scanning electron microscope. Segments of both atherosclerotic and normal arteries were obtained from either diet-induced or endogenously (WHHL) hypercholesterolemic rabbits following 1-4 months duration of hypercholesterolemia and age matched control rabbits. Vasculitis was induced in rats following placement of an endotoxin soaked thread adjacent to the adventitial surface of arteries.

Global Restructuring, Knowledge and Learning

2004 ◽  
pp. 66-76
Author(s):  
E. Hershberg
Keyword(s):  
Economic Growth ◽  
Developing Countries ◽  
Political Institutions ◽  
Lower Cost ◽  
International Competitiveness ◽  
Value Chains ◽  
Global Competitiveness ◽  
Global Restructuring ◽  
Intensive Exploitation ◽  
High Road

The influence of globalization on international competitiveness is considered in the article. Two strategies of economic growth are pointed out: the low road, that is producing more at lower cost and lower wages, with increasingly intensive exploitation of labor and environment, and the high road, that is upgrading capabilities in order to produce better basing on knowledge. Restrictions for developing countries trying to reach global competitiveness are formulated. Special attention is paid to the concept of upgrading and opportunities of joining transnational value chains. The importance of learning and forming social and political institutions for successful upgrading of the economy is stressed.

USE OF ENERGOPROTEIN CONCENTRATES BASED ON LUPINE IN FEEDING DAIRY COWS IN THE CONDITIONS OF THE KALININGRAD REGION

2020 ◽  
Author(s):  
Zinaida Fedorova ◽  
Yuri Tkachenko ◽  
Vasily Bliadze
Keyword(s):  
Heat Treatment ◽  
Dairy Cows ◽  
Milk Production ◽  
Lower Cost ◽  
Protein Concentrate ◽  
Biological Value ◽  
Kaliningrad Region

The data on feeding dairy cows of an energy protein concentrate (EPC) are presented. EPC consists of grain of narrow-leaved lupine, flax, triticale, subjected to heat treatment on a press extruder. The effect of EPC on the change in milk production of cows was determined. The inclusion of extruded concentrate based on lupine grains in the diets of cows made it possible to obtain an increase in milk. Concentrate based on lupine, flax, triticale is equal in biological value to full-fat soy, and at a much lower cost.

Dual Damascene Process for FatWires in Copper/FSG Technology

2003 ◽  
Vol 766 ◽  
Author(s):  
J. Gambino ◽  
T. Stamper ◽  
H. Trombley ◽  
S. Luce ◽  
F. Allen ◽  
...  
Keyword(s):  
Line Width ◽  
Lower Cost ◽  
Process Window ◽  
Cmos Process ◽  
Dual Damascene ◽  
Damascene Process ◽  
Interconnect Technology

AbstractA trench-first dual damascene process has been developed for fat wires (1.26 μm pitch, 1.1 μm thickness) in a 0.18 μm CMOS process with copper/fluorosilicate glass (FSG) interconnect technology. The process window for the patterning of vias in such deep trenches depends on the trench depth and on the line width of the trench, with the worse case being an intermediate line width (lines that are 3X the via diameter). Compared to a single damascene process, the dual damascene process has comparable yield and reliability, with lower via resistance and lower cost.

Regioselective Gas-Phase n-Butane Transfer Dehydrogenation via Silica-Supported Pincer-Iridium Complexes

2020 ◽  
Author(s):  
Boris Sheludko ◽  
Cristina Castro ◽  
Chaitanya Khalap ◽  
Thomas Emge ◽  
Alan Goldman ◽  
...  
Keyword(s):  
Gas Phase ◽  
Active Site ◽  
Lower Cost ◽  
Open Systems ◽  
Iridium Complexes ◽  
Terminal Olefin ◽  
Molecular Precursors ◽  
Sterically Demanding ◽  
Olefin Production ◽  
Steam Cracking

<b>Abstract:</b> The production of olefins via on-purpose dehydrogenation of alkanes allows for a more efficient, selective and lower cost alternative to processes such as steam cracking. Silica-supported pincer-iridium complexes of the form [(≡SiO-<sup>R4</sup>POCOP)Ir(CO)] (<sup>R4</sup>POCOP = κ<sup>3</sup>-C<sub>6</sub>H<sub>3</sub>-2,6-(OPR<sub>2</sub>)<sub>2</sub>) are effective for acceptorless alkane dehydrogenation, and have been shown stable up to 300 °C. However, while solution-phase analogues of such species have demonstrated high regioselectivity for terminal olefin production under transfer dehydrogenation conditions at or below 240 °C, in open systems at 300 °C, regioselectivity under acceptorless dehydrogenation conditions is consistently low. In this work, complexes <a>[(≡SiO-<i><sup>t</sup></i><sup>Bu4</sup>POCOP)Ir(CO)] </a>(<b>1</b>) and [(≡SiO-<i><sup>i</sup></i><sup>Pr4</sup>PCP)Ir(CO)] (<b>2</b>) were synthesized via immobilization of molecular precursors. These complexes were used for gas-phase butane transfer dehydrogenation using increasingly sterically demanding olefins, resulting in observed selectivities of up to 77%. The results indicate that the active site is conserved upon immobilization.

CARLSON ALLOY NITRONIC 60

Alloy Digest ◽  
2009 ◽  
Vol 58 (2) ◽  
Keyword(s):  
Stainless Steel ◽  
Wear Resistance ◽  
Nickel Alloys ◽  
High Temperature Oxidation ◽  
Lower Cost ◽  
Impact Resistance ◽  
Corrosion And Wear ◽  
Temperature Oxidation ◽  
High Nickel ◽  
Temperature Impact

Abstract CARLSON ALLOY NITRONIC 60 is a galling- and wear-resistant austenitic stainless steel that provides a significantly lower-cost alternative to cobalt-bearing and high-nickel alloys. Corrosion resistance is superior to 304 in most media. Approximately twice the yield strength of 340 and 316. Possesses excellent high-temperature oxidation resistance and low-temperature impact resistance. This datasheet provides information on composition, physical properties, hardness, and tensile properties. It also includes information on corrosion and wear resistance as well as forming. Filing Code: SS-1029. Producer or source: G.O. Carlson Inc.

LDX 2101

Alloy Digest ◽  
2015 ◽  
Vol 64 (8) ◽  
Keyword(s):  
Stainless Steel ◽  
Corrosion Resistance ◽  
Physical Properties ◽  
Duplex Stainless Steel ◽  
Tensile Properties ◽  
Lower Cost ◽  
Heat Treating ◽  
General Purpose ◽  
Research Centre ◽  
Excellent Performance

Abstract LDX 2101 is a low-alloyed duplex stainless designed as a general-purpose duplex stainless steel. Designed for excellent performance at lower cost. This datasheet provides information on composition, physical properties, microstructure, hardness, and tensile properties as well as fatigue. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: SS-1220. Producer or source: Outokumpu Stainless AB, Avesta Research Centre.

Backward Unlinkability and Verifier-Local Revocation Group Signature Scheme with Lower Cost

2010 ◽  
Vol 20 (7) ◽  
pp. 1977-1985
Author(s):  
Ling-Bo WEI ◽  
Chuan-Kun WU ◽  
Ting-Ge ZHU
Keyword(s):  
Lower Cost ◽  
Group Signature ◽  
Signature Scheme
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