Insights Into Correlation Between Board-Level Drop Reliability and Package-Level Ball Impact Test Characteristics

2007 ◽  
Vol 30 (1) ◽  
pp. 84-91 ◽  
Author(s):  
Chang-Lin Yeh ◽  
Yi-Shao Lai
Keyword(s):  
Impact Test ◽  
Ball Impact ◽  
Test Characteristics ◽  
Board Level

Design Guideline for Ball Impact Test Apparatus

2006 ◽  
Vol 129 (1) ◽  
pp. 98-104 ◽  
Author(s):  
Chang-Lin Yeh ◽  
Yi-Shao Lai
Keyword(s):  
Impact Test ◽  
Test Apparatus ◽  
Design Guideline ◽  
Ball Impact ◽  
Test Methodology ◽  
Force Profile ◽  
Reliability Of Solder Joints ◽  
Board Level ◽  
Board Level Reliability ◽  
Test Process

The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. Following classical structural dynamics principles, the ball impact test process is analyzed to provide insights into transient characteristics of this particular test methodology. A design guideline for the ball impact test apparatus based on characteristics of the measured impact force profile is proposed.

Empirical correlation between package-level ball impact test and board-level drop reliability

2007 ◽  
Vol 47 (7) ◽  
pp. 1127-1134 ◽  
Author(s):  
Chang-Lin Yeh ◽  
Yi-Shao Lai ◽  
Hsiao-Chuan Chang ◽  
Tsan-Hsien Chen
Keyword(s):  
Impact Test ◽  
Empirical Correlation ◽  
Ball Impact ◽  
Board Level

Evaluation of solder joint strengths under ball impact test

2007 ◽  
Vol 47 (12) ◽  
pp. 2179-2187 ◽  
Author(s):  
Yi-Shao Lai ◽  
Hsiao-Chuan Chang ◽  
Chang-Lin Yeh
Keyword(s):  
Solder Joint ◽  
Impact Test ◽  
Ball Impact

Correlation studies for component level ball impact shear test and board level drop test

2008 ◽  
Vol 48 (7) ◽  
pp. 1069-1078 ◽  
Author(s):  
E.H. Wong ◽  
R. Rajoo ◽  
S.K.W. Seah ◽  
C.S. Selvanayagam ◽  
W.D. van Driel ◽  
...  
Keyword(s):  
Shear Test ◽  
Drop Test ◽  
Component Level ◽  
Ball Impact ◽  
Correlation Studies ◽  
Board Level
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