Board Level Dynamic Response and Solder Ball Joint Reliability Analysis under Drop Impact Test with Various Impact Orientations

2008 10th Electronics Packaging Technology Conference ◽

10.1109/eptc.2008.4763573 ◽

2008 ◽

Cited By ~ 4

Author(s):

Z.J. Xu ◽

T.X. Yu

Keyword(s):

Dynamic Response ◽

Reliability Analysis ◽

Solder Ball ◽

Impact Test ◽

Drop Impact ◽

Ball Joint ◽

Joint Reliability ◽

Board Level ◽

Drop Impact Test

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The effects of response features on failure modes of board level drop impact test

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2010.5582632 ◽

2010 ◽

Cited By ~ 1

Author(s):

Y. Liu ◽

F.L. Sun ◽

F.J.H.D. Kessels ◽

W.D. van Driel ◽

G.Q. Zhang

Keyword(s):

Failure Modes ◽

Impact Test ◽

Drop Impact ◽

Board Level ◽

Drop Impact Test

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Experimental Verification of Drop Impact Test and Analysis for Mobile Electronics

4M/IWMF2016 The Global Conference on Micro Manufacture : Incorporating the 11th International Conference on Multi-Material Micro Manufacture (4M) and the 10th International Workshop on Microfactories (IWMF) ◽

10.3850/978-981-11-0749-8_685 ◽

2016 ◽

Author(s):

Byungjoo Choi ◽

Hyunho Yeom ◽

Yong-Ho Jeon ◽

Moon G. Lee

Keyword(s):

Experimental Verification ◽

Impact Test ◽

Drop Impact ◽

Drop Impact Test

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The examination of the drop impact test method

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) ◽

10.1109/itherm.2004.1318302 ◽

2004 ◽

Cited By ~ 9

Author(s):

Qiang Yu ◽

K. Watanabe ◽

T. Tsurusawa ◽

M. Shiratori ◽

M. Kakino ◽

...

Keyword(s):

Impact Test ◽

Drop Impact ◽

Test Method ◽

Drop Impact Test

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A Study of Component-Level Measure of Board-Level Drop Impact Reliability by Ball Impact Test

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference ◽

10.1109/impact.2008.4783807 ◽

2008 ◽

Cited By ~ 4

Author(s):

Yi-Shao Lai ◽

E. H. Wong ◽

R. Rajoo ◽

S. K. W. Seah ◽

C. S. Selvanayagam ◽

...

Keyword(s):

Impact Test ◽

Drop Impact ◽

Component Level ◽

Ball Impact ◽

Impact Reliability ◽

Board Level

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Influence of electroless PD plating film thickness on solder ball joint reliability

2018 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.23919/panpacific.2018.8319014 ◽

2018 ◽

Author(s):

Yoshinori Ejiri ◽

Takehisa Sakurai ◽

Yoshinori Arayama ◽

Yoshiaki Tsubomatsu ◽

Kiyoshi Hasegawa

Keyword(s):

Film Thickness ◽

Solder Ball ◽

Ball Joint ◽

Joint Reliability

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Board level drop test: exact solution to the problem of the nonlinear dynamic response of a PCB to the drop impact

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-016-4988-1 ◽

2016 ◽

Vol 27 (9) ◽

pp. 9423-9430 ◽

Cited By ~ 2

Author(s):

E. Suhir ◽

R. Ghaffarian

Keyword(s):

Exact Solution ◽

Dynamic Response ◽

Nonlinear Dynamic ◽

Drop Impact ◽

Drop Test ◽

Nonlinear Dynamic Response ◽

Board Level

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Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages

Microelectronics Reliability ◽

10.1016/j.microrel.2004.04.019 ◽

2004 ◽

Vol 44 (12) ◽

pp. 1957-1965 ◽

Cited By ~ 37

Author(s):

Tong Yan Tee ◽

Zhaowei Zhong

Keyword(s):

Solder Joint ◽

Reliability Analysis ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Bga Packages ◽

Board Level

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Performance on the drop impact test of the cone capsule shaped portable tsunami lifeboat using penalty method contact analysis

Istrazivanja i projektovanja za privredu ◽

10.5937/jaes17-19636 ◽

2019 ◽

Vol 17 (2) ◽

pp. 233-244

Author(s):

Fauzan Zakki ◽

Suharto Suharto ◽

Bae Myung ◽

Aulia Windyandari

Keyword(s):

Penalty Method ◽

Impact Test ◽

Drop Impact ◽

Contact Analysis ◽

Drop Impact Test

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Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate

Journal of Welding and Joining ◽

10.5781/jwj.2018.36.2.3 ◽

2018 ◽

Vol 36 (2) ◽

pp. 14-20

Author(s):

Kyung-Yeol Kim ◽

Haksan Jeong ◽

Woo-Ram Myung ◽

Seung-Boo Jung

Keyword(s):

Solder Joint ◽

Impact Test ◽

Drop Impact ◽

Drop Impact Test

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Effects of the Electroless Ni-P Thickness and Assembly Process on Solder Ball Joint Reliability

Journal of Welding and Joining ◽

10.5781/jwj.2014.32.3.60 ◽

2014 ◽

Vol 32 (3) ◽

pp. 60-67 ◽

Cited By ~ 2

Author(s):

Ji-Hye Lee ◽

Seok-Hwan Huh ◽

Gi-Ho Jung ◽

Suk-Jin Ham

Keyword(s):

Solder Ball ◽

Assembly Process ◽

Ball Joint ◽

Joint Reliability ◽

Electroless Ni

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