Novel De-Embedding Methodology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer
2017 ◽
Vol 59
(5)
◽
pp. 1565-1575
◽
2017 ◽
Vol E100.C
(12)
◽
pp. 1108-1117
◽
Keyword(s):
Keyword(s):
2014 ◽
Vol 56
(3)
◽
pp. 646-652
◽
2012 ◽
Vol 217-219
◽
pp. 2183-2186