A Multichip Phase-Leg IGBT Module Using Nanosilver Paste by Pressureless Sintering in Formic Acid Atmosphere

2018 ◽  
Vol 65 (10) ◽  
pp. 4499-4505 ◽  
Author(s):  
Haidong Yan ◽  
Yun-Hui Mei ◽  
Xin Li ◽  
Changsheng Ma ◽  
Guo-Quan Lu
Keyword(s):  
Formic Acid ◽  
Pressureless Sintering ◽  
Igbt Module ◽  
Nanosilver Paste

A Multichip Phase-Leg IGBT Module Bonded by Pressureless Sintering of Nanosilver Paste

2017 ◽  
Vol 17 (1) ◽  
pp. 146-156 ◽  
Author(s):  
Shancan Fu ◽  
Yunhui Mei ◽  
Xin Li ◽  
Changsheng Ma ◽  
Guo-Quan Lu
Keyword(s):  
Pressureless Sintering ◽  
Igbt Module ◽  
Nanosilver Paste

Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications

2019 ◽  
Vol 777 ◽  
pp. 578-585 ◽  
Author(s):  
Xiaomin Wang ◽  
Yunhui Mei ◽  
Xin Li ◽  
Meiyu Wang ◽  
Zhenduo Cui ◽  
...  
Keyword(s):  
Pressureless Sintering ◽  
Die Attachment ◽  
Nanosilver Paste

Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

2014 ◽  
Vol 128 ◽  
pp. 42-45 ◽  
Author(s):  
Shancan Fu ◽  
Yunhui Mei ◽  
Guo-Quan Lu ◽  
Xin Li ◽  
Gang Chen ◽  
...  
Keyword(s):  
Low Temperature ◽  
Electronic Packaging ◽  
Pressureless Sintering ◽  
Large Area ◽  
Nanosilver Paste
Sign in / Sign up

Export Citation Format

Share Document