A high power density multichip phase-leg IGBT module with void-free die attachment using nanosilver paste
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2013 ◽
Vol 303-306
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pp. 1902-1907
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1983 ◽
Vol 44
(C3)
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pp. C3-543-C3-550
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2015 ◽
Vol 135
(7)
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pp. 776-784
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