scholarly journals Enhanced Visible Light Sensitivity by Gold Line-and-Space Grating Gate Electrode in Thin Silicon-On-Insulator p-n Junction Photodiode

2013 ◽  
Vol 60 (2) ◽  
pp. 812-818 ◽  
Author(s):  
Hiroaki Satoh ◽  
Atsushi Ono ◽  
Hiroshi Inokawa
Author(s):  
N. David Theodore ◽  
Juergen Foerstner ◽  
Peter Fejes

As semiconductor device dimensions shrink and packing-densities rise, issues of parasitic capacitance and circuit speed become increasingly important. The use of thin-film silicon-on-insulator (TFSOI) substrates for device fabrication is being explored in order to increase switching speeds. One version of TFSOI being explored for device fabrication is SIMOX (Silicon-separation by Implanted OXygen).A buried oxide layer is created by highdose oxygen implantation into silicon wafers followed by annealing to cause coalescence of oxide regions into a continuous layer. A thin silicon layer remains above the buried oxide (~220 nm Si after additional thinning). Device structures can now be fabricated upon this thin silicon layer.Current fabrication of metal-oxidesemiconductor field-effect transistors (MOSFETs) requires formation of a polysilicon/oxide gate between source and drain regions. Contact to the source/drain and gate regions is typically made by use of TiSi2 layers followedby Al(Cu) metal lines. TiSi2 has a relatively low contact resistance and reduces the series resistance of both source/drain as well as gate regions


2017 ◽  
Vol 56 (10) ◽  
pp. 105503
Author(s):  
Kiichi Furukawa ◽  
Akinobu Teramoto ◽  
Rihito Kuroda ◽  
Tomoyuki Suwa ◽  
Keiichi Hashimoto ◽  
...  

2010 ◽  
Vol 61 (11) ◽  
pp. 2863-2871 ◽  
Author(s):  
Wei Zhang ◽  
Linda Zou ◽  
Lianzhou Wang

In present work, visible light sensitive TiO2/adsorbent nanocomposites (TNC) were prepared via a facile wet chemical method. Three types of adsorbents including zeolites (F-9, HSZ-690 and HSZ-930), mesoporous silica (MPS-2.7 and 4) and activated carbon, were used as the porous substrates for nanocomposites. Visible light sensitivity was incorporated to TNCs by nitrogen doping of TiO2, which is obtained through the addition of a nitrogen precursor, triethylamine, within the same wet chemical procedure. The photocatalytic and adsorption ability of as-prepared TNC resultants were studied using solutions of methylene blue (MB) as a model pollutant. Synergistic interactions between adsorption and visible-light photocatalysis were observed, as under the assistance of visible-light irradiation all TNCs achieved higher MB removal rates than those by adsorption process alone. The better performance of the as-prepared N-doped TNC reveals its potential to be used for cost effective solar photocatalytic degradation of dissolved organic compounds.


1985 ◽  
Vol 21 (23) ◽  
pp. 1102 ◽  
Author(s):  
J.P. Colinge ◽  
H.K. Hu ◽  
S. Peng

1997 ◽  
Vol 469 ◽  
Author(s):  
Guénolé C.M. Silvestre

ABSTRACTSilicon-On-Insulator (SOI) materials have emerged as a very promising technology for the fabrication of high performance integrated circuits since they offer significant improvement to device performance. Thin silicon layers of good crystalline quality are now widely available on buried oxide layers of various thicknesses with good insulating properties. However, the SOI structure is quite different from that of bulk silicon. This paper will discuss a study of point-defect diffusion and recombination in thin silicon layers during high temperature annealing treatment through the investigation of stacking-fault growth kinetics. The use of capping layers such as nitride, thin thermal oxide and thick deposited oxide outlines the diffusion mechanisms of interstitials in the SOI structure. It also shows that the buried oxide layer is a very good barrier to the diffusion of point defects and that excess silicon interstitials may be reincorporated at the top interface with the thermal oxide through the formation of SiO species. Finally, from the experimental values of the activation energies for the growth and the shrinkage of stacking-faults, the energy of interstitial creation is evaluated to be 2.6 eV, the energy for interstitial migration to be 1.8 eV and the energy of interstitial generation during oxidation to be 0.2 eV.


Small ◽  
2018 ◽  
Vol 14 (12) ◽  
pp. 1703346 ◽  
Author(s):  
Prashant Kumar ◽  
Jing Liu ◽  
Pranay Ranjan ◽  
Yaowu Hu ◽  
Sharma SRKC Yamijala ◽  
...  

1999 ◽  
Vol 146 (7) ◽  
pp. 2737-2743 ◽  
Author(s):  
S. Hénaux ◽  
F. Mondon ◽  
F. Gusella ◽  
I. Kling ◽  
G. Reimbold

2009 ◽  
Vol 44 (3) ◽  
pp. 861-868 ◽  
Author(s):  
Hiroki Nagai ◽  
Sohei Aoyama ◽  
Hiroki Hara ◽  
Chihiro Mochizuki ◽  
Ichiro Takano ◽  
...  

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