Erratic Cell Behavior in Channel Hot Electron Programming of NOR Flash Memories

2004 ◽  
Vol 51 (10) ◽  
pp. 1613-1620
Author(s):  
M. Grossi ◽  
M. Lanzoni ◽  
B. Ricco
2006 ◽  
Vol 50 (3) ◽  
pp. 309-315
Author(s):  
Meng-Yi Wu ◽  
Sheng-Huei Dai ◽  
Kung-Hong Lee ◽  
Shu-Fen Hu ◽  
Ya-Chin King

Author(s):  
D. Baderna ◽  
A. Cabrini ◽  
G. De-Sandre ◽  
F. De Santis ◽  
M. Pasotti ◽  
...  

2014 ◽  
Vol 154 (1) ◽  
pp. 50-56
Author(s):  
Xiaonan Yang ◽  
Zongliang Huo ◽  
Zongyong Wang ◽  
Ming Liu

2011 ◽  
Vol 383-390 ◽  
pp. 5851-5854
Author(s):  
Yung Yu Chen

Due to the reduced gate coupling ratio, the channel Fowler-Nordheim (CFN) programming speed of stacked-gate flash memories with high-permittivity (k) tunnel dielectrics (TDs) is helpless in operation voltage reduction. Although the electric field on high-k tunnel dielectrics is lower than SiO2 tunnel oxide, enhanced impact ionization rate and lower barrier height contribute to higher channel hot-electron (CHE) injection current and efficiency. Consequently, high-k TDs are only effective for the memories programmed with hot electron injection rather than FN tunneling, which is suitable for the NOR-type stacked-gate flash memories.


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