Electrical Activation and Impurity Redistribution During Pulsed Laser Annealing of BF<inf>2</inf><sup>+</sup>Implanted Amorphized Silicon

1981 ◽  
Vol 4 (4) ◽  
pp. 425-428 ◽  
Author(s):  
A. Bhattacharyya ◽  
V. Iyer ◽  
B. Streetman ◽  
J. Baker ◽  
P. Williams
Keyword(s):  
Laser Annealing ◽  
Pulsed Laser ◽  
Electrical Activation ◽  
Pulsed Laser Annealing ◽  
Impurity Redistribution

PN Junction Formation for High-Performance Insulated Gate Bipolar Transistors (IGBT); Double-Pulsed Green Laser Annealing Technique

2006 ◽  
Vol 912 ◽  
Author(s):  
Toshio Joshua Kudo ◽  
Naoki Wakabayashi
Keyword(s):  
Delay Time ◽  
Laser Annealing ◽  
Pulsed Laser ◽  
Electrical Activation ◽  
Time Increase ◽  
Pulsed Laser Annealing ◽  
Pn Junction ◽  
Activation Ratio ◽  
Overlap Ratio ◽  
Delay Time Increase

AbstractIn order to form the deep PN junction demanded for the next generation IGBTs, the double-pulsed laser annealing technique as the low-thermal budget heat treatment has been introduced to activate a B-implant layer and a P-implant layer within the wafer surface to the depth 2μm. The double-pulsed laser annealing is characterized by the deep penetration depth due to a green wavelength of DPSS lasers and precisely and widely controlling of the annealing temperature and time. In the IGBT's structure the deep PN junction at a collector (the rear face) should be formed without damaging thermally circuit elements made of low melting point materials at a gate and an emitter (the front face).Ion-implant samples using eight-inch (100) Si wafers were prepared as follows: Boron (B) implant was performed at a dose of 1E+15/cm2 at an energy of 40keV and/or phosphorus (P) implant at 1E+13/cm2 at an energy of 400keV. The double-pulsed laser irradiation was carried out at the constant first and second pulse energy density E1=E2=1.8J/cm2 at the delay time td= 0-500ns and the overlap ratio OR=67-90%. The melt depth was up to about 0.3μm. The electrical activation ratio of the B-implant layer within the depth of about 0.6μm was improved from 91% to about 100% with the delay time increase of 0ns to 500ns. The activation ratio of the P-implant layer within the depth of about 2μm was drastically improved from 48% to 82% with the same delay time increase and the carriers in the P-implant layer were distributed deeply from the depth 1.1μm to 1.8μm. Furthermore, with the overlap ratio increase of 67% to 90% the carriers in the P-implant layer were distributed deeply from the depth 1.8μm to 1.9μm and the high activation ratio of 82% was maintained. The high ratio of electrical activation is supported by the defect-free epitaxial regrowth where the majority of the B dopants was diffused in the liquid phase and that of the P dopants in the solid phase.

Pulsed laser annealing of zinc implanted GaAs

1978 ◽  
Vol 14 (4) ◽  
pp. 85 ◽  
Author(s):  
S.S. Kular ◽  
B.J. Sealy ◽  
K.G. Stephens ◽  
D.R. Chick ◽  
Q.V. Davis ◽  
...  
Keyword(s):  
Laser Annealing ◽  
Pulsed Laser ◽  
Pulsed Laser Annealing

Ferroelectric Hf 0.5 Zr 0.5 O 2 Thin Films Crystallized by Pulsed Laser Annealing

2021 ◽  
Author(s):  
Natalia Volodina ◽  
Anna Dmitriyeva ◽  
Anastasia Chouprik ◽  
Elena Gatskevich ◽  
Andrei Zenkevich
Keyword(s):  
Thin Films ◽  
Laser Annealing ◽  
Pulsed Laser ◽  
Pulsed Laser Annealing

scholarly journals Devitrification of thin film Cu-Zr metallic glass via ultrashort pulsed laser annealing

2021 ◽  
pp. 161437
Author(s):  
J. Antonowicz ◽  
P. Zalden ◽  
K. Sokolowski-Tinten ◽  
K. Georgarakis ◽  
R. Minikayev ◽  
...  
Keyword(s):  
Thin Film ◽  
Metallic Glass ◽  
Laser Annealing ◽  
Pulsed Laser ◽  
Pulsed Laser Annealing ◽  
Ultrashort Pulsed Laser

Dynamic behaviors of pulsed-laser annealing in ion-implanted silicon studied by measuring the optical reflectance

1979 ◽  
Author(s):  
Kouichi Murakami ◽  
Kenji Gamo ◽  
Susumu Namba ◽  
Mitsuo Kawabe ◽  
Yoshinobu Aoyagi ◽  
...  
Keyword(s):  
Laser Annealing ◽  
Pulsed Laser ◽  
Optical Reflectance ◽  
Dynamic Behaviors ◽  
Pulsed Laser Annealing ◽  
Ion Implanted

Extended defect structure induced by pulsed laser annealing in Ge implanted Si crystal

2001 ◽  
Vol 328 (1-2) ◽  
pp. 242-247 ◽  
Author(s):  
D. Klinger ◽  
M. Lefeld-Sosnowska ◽  
J. Auleytner ◽  
D. Żymierska ◽  
L. Nowicki ◽  
...  
Keyword(s):  
Defect Structure ◽  
Laser Annealing ◽  
Pulsed Laser ◽  
Extended Defect ◽  
Pulsed Laser Annealing

Superconducting V3Si produced by pulsed laser annealing

1982 ◽  
Vol 41 (4) ◽  
pp. 321-324 ◽  
Author(s):  
B. Stritzker ◽  
B.R. Appleton ◽  
C.W. White ◽  
S.S. Lau
Keyword(s):  
Laser Annealing ◽  
Pulsed Laser ◽  
Pulsed Laser Annealing

Pulsed Laser Annealing of R.F.Sputtered Amorphous Si : H.Films, Doped with Arsenic

1981 ◽  
Vol 4 ◽  
Author(s):  
E. Fogarassy ◽  
R. Stuck ◽  
M. Toulemonde ◽  
P. Siffert ◽  
J.F. Morhange ◽  
...  
Keyword(s):  
Ruby Laser ◽  
Laser Annealing ◽  
Pulsed Laser ◽  
Amorphous Layer ◽  
High Concentration ◽  
Topographic Analysis ◽  
Pulsed Laser Annealing ◽  
Residual Hydrogen ◽  
Silicon Target ◽  
Amorphous Si

Arsenic doped amorphous silicon layers have been deposited on silicon single crystals by R.F.cathodic sputtering of a silicon target in a reactive argon-hydrogen mixture, and annealed with a Q-switched Ruby laser. Topographic analysis of the irradiated layers has shown the formation of a crater, due to an evaporation effect of material which could be related to the presence of a high concentration of Ar in the amorphous layer. RBS and Raman Spectroscopy showed that the remaining layer is not recrystallised probably due to inhibition by the residual hydrogen. However, it was found that arsenic diffuses into the monocrystalline substrate by laser induced diffusion of dopant from the surface solid source, leading to the formation of good quality P-N junctions.

Sign in / Sign up

Export Citation Format

Share Document