Micro-Scale System Integration Via Molten-Alloy Driven Self-Assembly and Scaling of Metal Interconnects

Author(s):  
Christopher J. Morris ◽  
Babak A. Parviz
Ionics ◽  
2021 ◽  
Vol 27 (4) ◽  
pp. 1611-1618
Author(s):  
Xiaowen Ge ◽  
Xiaomei Du ◽  
Yin Sun ◽  
Junjie Zhang ◽  
Zhongyu Qiu ◽  
...  

Sensors ◽  
2018 ◽  
Vol 18 (9) ◽  
pp. 2824 ◽  
Author(s):  
Kunpeng Feng ◽  
Jiwen Cui ◽  
Xun Sun ◽  
Hong Dang ◽  
Tangjun Shi ◽  
...  

Three-dimensional micro-scale sensors are in high demand in the fields of metrology, precision manufacturing and industry inspection. To extend the minimum measurable dimension and enhance the accuracy, a tapered four-cores fiber Bragg grating (FBG) probe is proposed. The sensing model is built to investigate the micro-scale sensing characteristics of this method and the design of the tapered stylus is found to influence the accuracy. Therefore, a π/2 phase-shift point is introduced into the FBGs comprised in the probe to suppress spectrum distortion and improve accuracy. Then, the manufacturing method based on capillary self-assembly is proposed to form the probe and the critical length to form a square array for four cylindrical fibers is verified to be effective for the tapered fibers. Experimental results indicate that the design of the tapered stylus can extend the minimum measurable dimension by twofold and has nearly no influence on its sensitivity. The three-dimensional measurement repeatability is better than 31.1 nm and the stability is better than 200 nm within once measuring process. Furthermore, the measurement precision of the three-dimensional micro-scale measurement results is less than 150 nm. It would be widely used in measuring micro-scale features for industry inspection or metrology.


2002 ◽  
Vol 739 ◽  
Author(s):  
H. McNally ◽  
S. W. Lee ◽  
D. Guo ◽  
M. Pingle ◽  
D. Bergstrom ◽  
...  

ABSTRACTBio-inspired assembly, through the use of bio-molecules such as DNA and proteins, will play a critical role in the advancement of novel sensing techniques and for the realization of heterogeneous integration of materials. For many of these applications, such as antibody-based biosensor and the study of controlled cell growth, DNA and protein patterning techniques are crucial. We will present an update of our work on protein patterning techniques using microelectronic fabrication, DNA hybridization and biotin-streptavidin pairing. To show its application in biological inspired self-assembly, this technique was used successfully in the self-assembly of 20 nm streptavidin conjugated gold particles. In addition, the integration of nano-and micro-scale heterogeneous materials is very important for novel material synthesis and electro-optic applications. We will present an update on our work to assemble silicon electronic devices using DNA/charged molecules and electric fields. Devices are fabricated, released, charged with molecules, and subsequently manipulated in electric fields. The techniques described can be used to integrate the hybrid devices such as nano- or micro-scale resistors, PN diodes, and MOSFETs on silicon or other substrates such as glass, plastic, etc.


2014 ◽  
Vol 50 (38) ◽  
pp. 4881-4883 ◽  
Author(s):  
Gloria Modugno ◽  
Zois Syrgiannis ◽  
Aurelio Bonasera ◽  
Mauro Carraro ◽  
Gabriele Giancane ◽  
...  

The host–guest chemistry of the POM-tweezer drives self-assembly with carbon nanostructures in the nano- to micro-scale yielding 0-, 1-, and 2-D nano-hybrids.


2016 ◽  
Vol 22 (S3) ◽  
pp. 1912-1913 ◽  
Author(s):  
Shaobo Han ◽  
Wei Liu ◽  
Kai Sun
Keyword(s):  

MRS Advances ◽  
2016 ◽  
Vol 1 (34) ◽  
pp. 2355-2366 ◽  
Author(s):  
Yuka Ito ◽  
Takafumi Fukushima ◽  
Kang-Wook Lee ◽  
Tetsu Tanaka ◽  
Mitsumasa Koyanagi

ABSTRACTThe self-assembly of known good dies (KGDs) on substrates using the liquid capillary method is shown to be a promising technology to achieve three-dimensional (3D) heterogeneous system integration and packaging. Firstly, the effects of the edge structures of self-assembled substrates and chips on alignment accuracies were investigated. When hydrophobic sidewalls with 10-µm-height steps were applied to both chips and assembly sites formed on substrates, the alignment accuracy within 1.0 µm was realized. The alignment accuracies were within 2.0 µm using either substrates or chips having 10-µm-height step structures with hydrophobic sidewalls. Self-assembly of 12-ch vertical-cavity surface-emitting lasers (VCSELs) with a long rectangle shape on glass substrates were also demonstrated. Separation of assembly sites into twelve areas enhanced the resultant force acting on the VCSEL short edge. The enhanced resultant force provided the high alignment accuracies within 2.0 μm. After the self-assembly of the VCSEL and the subsequent thermal compression, the chips successfully exhibited no degradation of their current–voltage (I–V) characteristics and appropriate 850-nm light emission. We demonstrated self-assembly and microbump bonding using non-conductive film (NCF)-covered dies with Cu/Sn microbumps for high-throughput and high-yield multichip-to-wafer 3D integration. The self-assembly of the NCF-covered dies provided high alignment accuracy within 1.1 μm on average. After the self-assembly of NCF-coved dies and thermal compression, microbump chains composed of 7396 bump joints were successfully obtained, resulting in good electrical properties of 32 mΩ/joint without any bridge shorts and failures. The variations of microbump joint resistance were maintained within 5% of the initial value after thermal cycle testing of even 1000 cycles.


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