Capillary Self-Assembly for 3D Heterogeneous System Integration and Packaging

MRS Advances ◽  
2016 ◽  
Vol 1 (34) ◽  
pp. 2355-2366 ◽  
Author(s):  
Yuka Ito ◽  
Takafumi Fukushima ◽  
Kang-Wook Lee ◽  
Tetsu Tanaka ◽  
Mitsumasa Koyanagi
Keyword(s):  
Self Assembly ◽  
System Integration ◽  
Heterogeneous System ◽  
Resultant Force ◽  
The Self ◽  
Alignment Accuracy ◽  
High Yield ◽  
Cavity Surface ◽  
Thermal Compression ◽  
Emitting Lasers

ABSTRACTThe self-assembly of known good dies (KGDs) on substrates using the liquid capillary method is shown to be a promising technology to achieve three-dimensional (3D) heterogeneous system integration and packaging. Firstly, the effects of the edge structures of self-assembled substrates and chips on alignment accuracies were investigated. When hydrophobic sidewalls with 10-µm-height steps were applied to both chips and assembly sites formed on substrates, the alignment accuracy within 1.0 µm was realized. The alignment accuracies were within 2.0 µm using either substrates or chips having 10-µm-height step structures with hydrophobic sidewalls. Self-assembly of 12-ch vertical-cavity surface-emitting lasers (VCSELs) with a long rectangle shape on glass substrates were also demonstrated. Separation of assembly sites into twelve areas enhanced the resultant force acting on the VCSEL short edge. The enhanced resultant force provided the high alignment accuracies within 2.0 μm. After the self-assembly of the VCSEL and the subsequent thermal compression, the chips successfully exhibited no degradation of their current–voltage (I–V) characteristics and appropriate 850-nm light emission. We demonstrated self-assembly and microbump bonding using non-conductive film (NCF)-covered dies with Cu/Sn microbumps for high-throughput and high-yield multichip-to-wafer 3D integration. The self-assembly of the NCF-covered dies provided high alignment accuracy within 1.1 μm on average. After the self-assembly of NCF-coved dies and thermal compression, microbump chains composed of 7396 bump joints were successfully obtained, resulting in good electrical properties of 32 mΩ/joint without any bridge shorts and failures. The variations of microbump joint resistance were maintained within 5% of the initial value after thermal cycle testing of even 1000 cycles.

Nanoscale Self-Assembly Using Ion and Electron Beam Techniques: A Rapid Review

MRS Advances ◽  
2020 ◽  
Vol 5 (64) ◽  
pp. 3507-3520
Author(s):  
Chunhui Dai ◽  
Kriti Agarwal ◽  
Jeong-Hyun Cho
Keyword(s):  
Electron Beam ◽  
Self Assembly ◽  
Ion Beam ◽  
Three Dimensional ◽  
The Self ◽  
Stress Generation ◽  
Rapid Review ◽  
High Yield ◽  
3D Nanostructures ◽  
Self Assembled

AbstractNanoscale self-assembly, as a technique to transform two-dimensional (2D) planar patterns into three-dimensional (3D) nanoscale architectures, has achieved tremendous success in the past decade. However, an assembly process at nanoscale is easily affected by small unavoidable variations in sample conditions and reaction environment, resulting in a low yield. Recently, in-situ monitored self-assembly based on ion and electron irradiation has stood out as a promising candidate to overcome this limitation. The usage of ion and electron beam allows stress generation and real-time observation simultaneously, which significantly enhances the controllability of self-assembly. This enables the realization of various complex 3D nanostructures with a high yield. The additional dimension of the self-assembled 3D nanostructures opens the possibility to explore novel properties that cannot be demonstrated in 2D planar patterns. Here, we present a rapid review on the recent achievements and challenges in nanoscale self-assembly using electron and ion beam techniques, followed by a discussion of the novel optical properties achieved in the self-assembled 3D nanostructures.

Three-Dimensional Integration Technology Based on Self-Assembled Chip-to-Wafer Stacking

2008 ◽  
Vol 1112 ◽  
Author(s):  
Takafumi Fukushima ◽  
Tetsu Tanaka ◽  
Mitsumasa Koyanagi
Keyword(s):  
Self Assembly ◽  
Three Dimensional ◽  
The Self ◽  
High Yield ◽  
3D Integration ◽  
Integration Technology ◽  
Pick And Place ◽  
Assembly Technique ◽  
Self Assembled ◽  
Short Time

AbstractWe have demonstrated that a number of known good dies (KGDs) can be precisely aligned in batch and stacked on LSI wafers by our chip-to-wafer three-dimensional (3D) integration technology using an innovative self-assembly technique. Compared with conventional robotic pick-and-place chip assembly, the fluidic self-assembly can provide high-throughput chip alignment and bonding, and the resulting self-assembled chips have high alignment accuracy of approximately 0.3 micron on average. Immediately after chip release, the chips are aligned onto the predetermined hydrophilic bonding areas in a short time within 0.1 sec by the surface tension of aqueous liquid used in our self-assembly. By using the self-assembly, a number of KGDs with different chip sizes, different materials and different devices can be stacked in high yield to give highly integrated 3D chips we call the 3D Super Chip.

scholarly journals Frustrated self-assembly of non-Euclidean crystals of nanoparticles

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Francesco Serafin ◽  
Jun Lu ◽  
Nicholas Kotov ◽  
Kai Sun ◽  
Xiaoming Mao
Keyword(s):  
Self Assembly ◽  
Three Dimensional ◽  
Building Blocks ◽  
The Self ◽  
High Yield ◽  
Complex Structures ◽  
Interparticle Interactions ◽  
Viral Capsids ◽  
Self Organized ◽  
New Material

AbstractSelf-organized complex structures in nature, e.g., viral capsids, hierarchical biopolymers, and bacterial flagella, offer efficiency, adaptability, robustness, and multi-functionality. Can we program the self-assembly of three-dimensional (3D) complex structures using simple building blocks, and reach similar or higher level of sophistication in engineered materials? Here we present an analytic theory for the self-assembly of polyhedral nanoparticles (NPs) based on their crystal structures in non-Euclidean space. We show that the unavoidable geometrical frustration of these particle shapes, combined with competing attractive and repulsive interparticle interactions, lead to controllable self-assembly of structures of complex order. Applying this theory to tetrahedral NPs, we find high-yield and enantiopure self-assembly of helicoidal ribbons, exhibiting qualitative agreement with experimental observations. We expect that this theory will offer a general framework for the self-assembly of simple polyhedral building blocks into rich complex morphologies with new material capabilities such as tunable optical activity, essential for multiple emerging technologies.

Fluidic self-assembly of InGaAs vertical cavity surface emitting lasers onto silicon

1995 ◽  
Vol 31 (17) ◽  
pp. 1448-1449 ◽  
Author(s):  
J.K. Tu ◽  
J.S. Smith ◽  
M.A. Hadley ◽  
J.J. Talghader
Keyword(s):  
Self Assembly ◽  
Cavity Surface ◽  
Surface Emitting Lasers ◽  
Vertical Cavity Surface ◽  
Emitting Lasers ◽  
Vertical Cavity

Improved performances of 850nm vertical cavity surface emitting lasers utilizing the self-planar mesa structure

2014 ◽  
Vol 56 ◽  
pp. 343-347 ◽  
Author(s):  
Jianwei Zhang ◽  
Yongqiang Ning ◽  
Xing Zhang ◽  
Yugang Zeng ◽  
Jian Zhang ◽  
...  
Keyword(s):  
The Self ◽  
Cavity Surface ◽  
Mesa Structure ◽  
Surface Emitting Lasers ◽  
Vertical Cavity Surface ◽  
Emitting Lasers ◽  
Vertical Cavity

The Nature of Rapidly Extracted Phycocyanin from the Blue-Green Alga Plectonema Boryanum

1971 ◽  
Vol 29 ◽  
pp. 366-367
Author(s):  
M. Kessel ◽  
R. MacColl
Keyword(s):  
Self Assembly ◽  
Analytical Ultracentrifugation ◽  
Uranyl Acetate ◽  
The Self ◽  
Major Protein ◽  
Subunit Structure ◽  
Blue Green Alga ◽  
Thin Sections ◽  
Blue Green Algae ◽  
Cacodylate Buffer

The major protein of the blue-green algae is the biliprotein, C-phycocyanin (Amax = 620 nm), which is presumed to exist in the cell in the form of distinct aggregates called phycobilisomes. The self-assembly of C-phycocyanin from monomer to hexamer has been extensively studied, but the proposed next step in the assembly of a phycobilisome, the formation of 19s subunits, is completely unknown. We have used electron microscopy and analytical ultracentrifugation in combination with a method for rapid and gentle extraction of phycocyanin to study its subunit structure and assembly.To establish the existence of phycobilisomes, cells of P. boryanum in the log phase of growth, growing at a light intensity of 200 foot candles, were fixed in 2% glutaraldehyde in 0.1M cacodylate buffer, pH 7.0, for 3 hours at 4°C. The cells were post-fixed in 1% OsO4 in the same buffer overnight. Material was stained for 1 hour in uranyl acetate (1%), dehydrated and embedded in araldite and examined in thin sections.

Interrelationship of the cellular distribution and secretion of regular structure (RS) protein in Bacillus licheniformis nm 105

1992 ◽  
Vol 50 (1) ◽  
pp. 712-713
Author(s):  
Xiaorong Zhu ◽  
Richard McVeigh ◽  
Bijan K. Ghosh
Keyword(s):  
Alkaline Phosphatase ◽  
Bacillus Licheniformis ◽  
Self Assembly ◽  
Gel Electrophoresis ◽  
Culture Supernatant ◽  
Regular Structure ◽  
The Self ◽  
Cellular Distribution ◽  
Structural Protein ◽  
Laboratory Cultures

A mutant of Bacillus licheniformis 749/C, NM 105 exhibits some notable properties, e.g., arrest of alkaline phosphatase secretion and overexpression and hypersecretion of RS protein. Although RS is known to be widely distributed in many microbes, it is rarely found, with a few exceptions, in laboratory cultures of microorganisms. RS protein is a structural protein and has the unusual properties to form aggregate. This characteristic may have been responsible for the self assembly of RS into regular tetragonal structures. Another uncommon characteristic of RS is that enhanced synthesis and secretion which occurs when the cells cease to grow. Assembled RS protein with a tetragonal structure is not seen inside cells at any stage of cell growth including cells in the stationary phase of growth. Gel electrophoresis of the culture supernatant shows a very large amount of RS protein in the stationary culture of the B. licheniformis. It seems, Therefore, that the RS protein is cotranslationally secreted and self assembled on the envelope surface.

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