Session: RMO2B: K-band front-end ICs

Author(s):  
Danilo Manstretta ◽  
Li Lin
Keyword(s):  
2021 ◽  
Author(s):  
Zhong-Lin Xu ◽  
Zheng Dong ◽  
Hong-Tao Liao ◽  
Liang-Feng Qiu ◽  
Sheng-Tuan She ◽  
...  

2014 ◽  
Vol 13 (15) ◽  
pp. 2461-2467 ◽  
Author(s):  
Liping Wang ◽  
Jiarui Liu ◽  
Huaqing Tong ◽  
Ming Hong ◽  
Yiqun Hu ◽  
...  
Keyword(s):  

2018 ◽  
Vol 2018 (1) ◽  
pp. 000384-000388
Author(s):  
Brian Curran ◽  
Jacob Reyes ◽  
Christian Tschoban ◽  
Ivan Ndip ◽  
Klaus-Dieter Lang ◽  
...  

Abstract Increasing demand for high bandwidth wireless satellite connections and telecommunications has resulted in interest in steerable antenna arrays in the GHz frequency range. These applications require cost-effective integration technologies for high frequency and high power integrated circuits (ICs) using GaAs, for example. In this paper, an integration platform is proposed, that enables GaAs ICs to be directly placed on a copper core inside cavities of a high frequency laminate for optimal cooling purposes. The platform is used to integrate a K-Band receiver front-end, composed of four GaAs ICs, with linear IF output power for input powers above −40dBm and a temperature of 42°C during operation.


INMIC ◽  
2013 ◽  
Author(s):  
Ghulam Mehdi ◽  
Hu Anyong ◽  
Yong Fu ◽  
Yu Tongfei ◽  
Jungang Miao ◽  
...  

Author(s):  
Dongsu Kim ◽  
Dong Ho Kim ◽  
Jong In Ryu ◽  
Jun Chul Kim ◽  
Chong Dae Park ◽  
...  

1986 ◽  
Vol 34 (4) ◽  
pp. 412-419 ◽  
Author(s):  
P.J. Meier ◽  
J.A. Calviello ◽  
A.J. Cappello ◽  
R.J. Pomian ◽  
L.D. Cohen ◽  
...  
Keyword(s):  
Ka Band ◽  

Author(s):  
Gitae Pyo ◽  
Jaemo Yang ◽  
Hyunji Ku ◽  
Choul-Young Kim ◽  
Songcheol Hong
Keyword(s):  

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