Electrical characteristics and reliability of extended drain voltage NMOS devices with multi-RESURF junction

2005 ◽  
Author(s):  
V.A. Vashchenko ◽  
D. Brisbin ◽  
P. Linclorfer ◽  
P. Chaparala ◽  
P. Hopper
Keyword(s):  
Electrical Characteristics ◽  
Drain Voltage

Effects of junction profiles in bottom protection p-well on electrical characteristics of 1.2 kV SiC trench-gate MOSFETs

2019 ◽  
Vol 88 (3) ◽  
pp. 30103
Author(s):  
Ogyun Seok ◽  
Hyoung Woo Kim ◽  
In Ho Kang ◽  
Min-Woo Ha ◽  
Wook Bahng
Keyword(s):  
Electric Field ◽  
Electric Field Distribution ◽  
Dielectric Breakdown ◽  
Energy Band Diagram ◽  
Gate Oxide ◽  
Simulation Methods ◽  
Electrical Characteristics ◽  
Drain Voltage ◽  
Fully Depleted ◽  
Trench Structure

Effects of junction profiles in bottom protection p-well (BPW) on electrical characteristics of 1.2 kV SiC trench-gate MOSFETs were investigated using simulation methods. Breakdown mechanisms of BPW in the device were also elucidated by energy-band diagram and electric-field distribution across trench-gate. Monte Carlo Al-implantation simulation on the trench structure for BPW formation was carried out with variations in peak depth (DBPW), concentration (NBPW), and thickness of SiO2 spacer (Tspacer) on trench sidewall. The SiC trench-gate MOSFETs with deep DBPW, high NBPW, and thin Tspacer are suitable for high drain voltage due to a shielded trench gate by BPW. However, specific on-resistance (Ron,sp) increased because of laterally penetrated Al into p-base and accumulation regions during ion implantation for BPW formation. In case of shallow DBPW, low NBPW, and thick Tspacer, however, the gate oxide at trench bottom corner is considerably vulnerable to the dielectric breakdown due to fully depleted BPW near trench bottom corner and electric-field crowding at gate oxide.

In situ TEM measurements of the electrical properties of interface dislocations

1992 ◽  
Vol 50 (2) ◽  
pp. 1338-1339
Author(s):  
F. M. Ross ◽  
R. Hull ◽  
D. Bahnck ◽  
J. C. Bean ◽  
L. J. Peticolas ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Electronic Device ◽  
In Situ Tem ◽  
Device Performance ◽  
Misfit Dislocations ◽  
Electrical Characteristics ◽  
Strained Layer ◽  
Transmission Electron ◽  
Interfacial Dislocations

We describe an investigation of the electrical properties of interfacial dislocations in strained layer heterostructures. We have been measuring both the structural and electrical characteristics of strained layer p-n junction diodes simultaneously in a transmission electron microscope, enabling us to correlate changes in the electrical characteristics of a device with the formation of dislocations.The presence of dislocations within an electronic device is known to degrade the device performance. This degradation is of increasing significance in the design and processing of novel strained layer devices which may require layer thicknesses above the critical thickness (hc), where it is energetically favourable for the layers to relax by the formation of misfit dislocations at the strained interfaces. In order to quantify how device performance is affected when relaxation occurs we have therefore been investigating the electrical properties of dislocations at the p-n junction in Si/GeSi diodes.

The morphologies and electrical properties of indium contacts on (100) cadmium telluride surfaces

1992 ◽  
Vol 50 (2) ◽  
pp. 1422-1423
Author(s):  
A.M. Letsoalo ◽  
M.E. Lee ◽  
E.O. de Neijs
Keyword(s):  
Electrical Properties ◽  
Cadmium Telluride ◽  
Methanol Solution ◽  
Electrical Characteristics ◽  
Metal Contacts ◽  
Deposition Technique ◽  
Interfacial Layers ◽  
Semiconductor Contacts ◽  
Grown Single Crystal ◽  
Diamond Abrasive

Semiconductor devices require metal contacts for efficient collection of electrical charge. The physics of these metal/semiconductor contacts assumes perfect, abrupt and continuous interfaces between the layers. However, in practice these layers are neither continuous nor abrupt due to poor nucleation conditions and the formation of interfacial layers. The effects of layer thickness, deposition rate and substrate stoichiometry have been previously reported. In this work we will compare the effects of a single deposition technique and multiple depositions on the morphology of indium layers grown on (100) CdTe substrates. The electrical characteristics and specific resistivities of the indium contacts were measured, and their relationships with indium layer morphologies were established.Semi-insulating (100) CdTe samples were cut from Bridgman grown single crystal ingots. The surface of the as-cut slices were mechanically polished using 5μm, 3μm, 1μm and 0,25μm diamond abrasive respectively. This was followed by two minutes immersion in a 5% bromine-methanol solution.

Polycaprolactone based membranes for the degradation of diclofenac present in water samples using ZnO nanoparticles as the active agent

MRS Advances ◽  
2020 ◽  
Vol 5 (61) ◽  
pp. 3153-3161
Author(s):  
Marco Antonio Juárez Sánchez ◽  
Miguel Ángel Meléndez Lira ◽  
Celestino Odín Rodríguez Nava
Keyword(s):  
Zno Nanoparticles ◽  
Wastewater Treatment Plants ◽  
Active Agent ◽  
Heterogeneous Photocatalysis ◽  
Nano Particles ◽  
Electrical Characteristics ◽  
Unit Operation ◽  
Fields Of Study ◽  
Drug Contamination ◽  
Positive Results

AbstractDrug contamination in water is one of the current fields of study. Since 1990, the presence of drugs in drinking water has been a concern to scientists and public. In Mexico, these organic compounds are not efficiently removed in wastewater treatment plants; therefore, alternative methodologies have been studied that allow these compounds to have a high percentage of degradation or be completely degraded. One example of these techniques is heterogeneous photocatalysis which has obtained positive results in the degradation of drugs using ZnO nanoparticles. These are commonly selected for their electrical characteristics, even though they disperse in water and an additional unit operation is required to separate them from the liquid medium. To eliminate drugs with nano particles in a single stage, polycaprolactone-based membranes with adhered ZnO nanoparticles, by means of electrospinning, were prepared to degrade drugs such as diclofenac. The technique used has shown to efficiently break down diclofenac in 4 hours according to the capillary electrophoresis readings.

Optical and Electrical Characteristics of Amorphous InGaZnO after Thermal Annealing

2008 ◽  
Author(s):  
Satoshi Taniguchi ◽  
Norihiko Yamaguchi ◽  
Takao Miyajima ◽  
Masao Ikeda
Keyword(s):  
Thermal Annealing ◽  
Electrical Characteristics ◽  
Amorphous Ingazno

Structural and Electrical Characterization of Shaped Beam Laser Recrystallized Polysilicon on Amorphous Substrates

1981 ◽  
Vol 4 ◽  
Author(s):  
T. J. Stultz ◽  
J. F. Gibbons
Keyword(s):  
Grain Size ◽  
Electrical Characterization ◽  
Grain Structure ◽  
Electrical Characteristics ◽  
Shaped Beam ◽  
Beam Laser ◽  
Cw Laser ◽  
Amorphous Substrates ◽  
Circular Beam

ABSTRACTStructural and electrical characterization of laser recrystallized LPCVD silicon films on amorphous substrates using a shaped cw laser beam have been performed. In comparing the results to data obtained using a circular beam, it was found that a significant increase in grain size can be achieved and that the surface morphology of the shaped beam recrystallized material was much smoother. It was also found that whereas circular beam recrystallized material has a random grain structure, shaped beam material is highly oriented with a <100> texture. Finally the electrical characteristics of the recrystallized film were very good when measured in directions parallel to the grain boundaries.

Silicon Surface Chemical Treatments in Oxide/Nitride Dielectric Stack Properties

2002 ◽  
Vol 716 ◽  
Author(s):  
D. Jacques ◽  
S. Petitdidier ◽  
J.L. Regolini ◽  
K. Barla
Keyword(s):  
Oxygen Content ◽  
Oxide Thickness ◽  
Morphological Data ◽  
Electrical Characteristics ◽  
Electrical Measurements ◽  
Chemical Cleaning ◽  
Force Microscopy ◽  
Chemical Treatments ◽  
Atomic Force ◽  
Interfacial Oxygen

AbstractOxide/Nitride dielectric stack is widely used as the standard dielectric for DRAM capacitors. The influence of the chemical cleaning prior to the stack formation has been studied in this work. As a result, morphological data such as stack surface roughness (Atomic Force Microscopy) and silicon nitride (SiN) incubation time for growth are comparable for all the studied cases on <Si>. However, Tof-SIMS exhibits different oxygen content at the Si/stack interface following the different chemical treatments. Electrical measurements show comparable C-V and I-V results, for the same Equivalent Oxide Thickness (same capacitance at strong accumulation i.e.-3V) while the different studied interfaces bring different interface states density with lower values for higher interfacial oxygen content. For DRAM applications, a clear improvement in electrical characteristics is obtained under low interfacial oxygen content conditions. Results are compared in embedded-DRAM cells for which we developed an industrially compatible dielectric deposition sequence to obtain minimum leakage current with maximum specific capacitance and no particular linking constraints.

Electrical Characteristics of Atmospheric Air Corona Plasma by Multi-pin Electrodes

2019 ◽  
Vol 14 (3) ◽  
pp. 226
Author(s):  
Khanit Matra ◽  
Yottana Tanakaran ◽  
Teerawat Temponsub ◽  
Suphanat Nimbua ◽  
Phanuwat Thab-in ◽  
...  
Keyword(s):  
Electrical Characteristics ◽  
Atmospheric Air ◽  
Corona Plasma
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