Thermal resistance degradation of alloy die attached power devices during thermal cycling

1998 ◽  
Author(s):  
J. Naderman ◽  
F.W. Ragay ◽  
D.G. De Vries ◽  
A. Van Eck ◽  
J. Van de Water
Keyword(s):  
Thermal Resistance ◽  
Thermal Cycling ◽  
Power Devices ◽  
Resistance Degradation

Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces

2009 ◽  
Vol 38 (12) ◽  
pp. 2470-2478 ◽  
Author(s):  
H.Y. Guo ◽  
J.D. Guo ◽  
J.K. Shang
Keyword(s):  
Thermal Resistance ◽  
Thermal Cycling

Reliability Analysis for Power Devices Which Undergo Fast Thermal Cycling

2016 ◽  
Vol 16 (3) ◽  
pp. 336-344 ◽  
Author(s):  
Dan Simon ◽  
Cristian Boianceanu ◽  
Gilbert De Mey ◽  
Vasile Topa ◽  
Andreas Spitzer
Keyword(s):  
Thermal Cycling ◽  
Reliability Analysis ◽  
Power Devices

Causes of Degradation of Thermal Performance of Ball Grid Arrays After Thermal Cycling

2007 ◽  
Author(s):  
Roy W. Knight ◽  
Yasser Elkady ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Solder Joint ◽  
Thermal Resistance ◽  
Thermal Cycling ◽  
Thermal Performance ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Element Analysis ◽  
Solder Balls ◽  
Ball Grid Array Packages ◽  
The Impact

The thermal performance of Ball Grid Array packages depends upon many parameters including die size, use of thermal balls, number of perimeter balls, use of underfill, and printed circuit board heat spreader and thermal via design. Thermal cycling can affect the integrity of thermal paths in and around the BGA as a result of the cracking of solder balls and delamination of the package, including at underfill interfaces. In this study, the impact of thermal cycling on the thermal performance of BGA’s was investigated and quantified. A number of test boards which included a range of the parameters cited above were experimentally examined. A baseline thermal resistance was measured for each case, which was verified with numerical thermal modeling. The boards were then subjected to thermal cycling from −40°C to 125°C. Every 250 cycles the thermal performance was measured. Packages expected to be least reliable (with large die and no underfill), showed an increase in thermal resistance after 750 thermal cycles. Further increases in thermal resistance were observed with continuous thermal cycling until solder joint failure occurred at 1250 cycles, preventing additional measurements. Finite element analysis identified critical thermal and perimeter solder balls as the most likely sites for cracking. Boards were cross-sectioned and examined for solder joint cracks and delamination to identify the cause for the observed increases in thermal resistance. Cracking was found in the critical thermal and perimeter solder balls.

scholarly journals Discrete-Pulsed Current Time Method to Estimate Channel Thermal Resistance of GaN-Based Power Devices

2018 ◽  
Vol 65 (12) ◽  
pp. 5301-5306 ◽  
Author(s):  
Zheng Xu ◽  
Saptarshi Mandal ◽  
Jianyi Gao ◽  
Harshad Surdi ◽  
Wenwen Li ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Pulsed Current ◽  
Power Devices ◽  
Current Time
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