Industry consensus approach to physics of failure in reliability prediction

2010 ◽  
Author(s):  
Lori E. Bechtold
Keyword(s):  
Reliability Prediction ◽  
Consensus Approach ◽  
Physics Of Failure

Comparative Reliability Prediction Using Physics of Failure Models

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000189-000195
Author(s):  
Milton Watts ◽  
K. Rob Harker
Keyword(s):  
Circuit Complexity ◽  
High Impact ◽  
Reliability Prediction ◽  
Life Test ◽  
Physics Of Failure ◽  
Failure Models ◽  
The Individual ◽  
Aging Models ◽  
Device Test

Quartzdyne Electronics has invested millions of device test hours in life testing of circuits in both powered and un-powered tests. In addition to time at temperature, these tests include thermal cycling and high impact drop testing. Recent projects have required the use of larger packages and components as we have expanded the variety of circuits that we build. It is desirable to predict the effects of these changes on long-term reliability before investing in tooling. In this study we will compare a new design which contains these larger components to the simpler, smaller designs for which we have extensive life-test data. Using a physics-of-failure approach, component mounting stresses will be analyzed using finite element modeling. These results will be compared to pre and post-aging shear strengths of actual components of varying sizes. Aging models will then be developed to predict the reliability of the new design based on the comparative stress margins of the individual components coupled with circuit complexity. Once validated, the aging models will enable reliability prediction and trade-off analysis for future designs.

Physics of failure-based reliability prediction of turbine blades using multi-source information fusion

2018 ◽  
Vol 72 ◽  
pp. 624-635 ◽  
Author(s):  
He Li ◽  
Hong-Zhong Huang ◽  
Yan-Feng Li ◽  
Jie Zhou ◽  
Jinhua Mi
Keyword(s):  
Information Fusion ◽  
Turbine Blades ◽  
Reliability Prediction ◽  
Source Information ◽  
Physics Of Failure

Application of the Physics of Failure Approach to Reliability Prediction for Design Guidance of Commercial Appliance Components

1999 ◽  
Author(s):  
Mark W. Steiner ◽  
Ken Zagray ◽  
Surya Ganti ◽  
Omar Hasan
Keyword(s):  
Reliability Prediction ◽  
Fatigue Wear ◽  
Physics Of Failure ◽  
Accelerated Life Tests ◽  
Design Charts ◽  
Design Changes ◽  
Accelerated Life ◽  
Simplifying Assumptions ◽  
Life Tests ◽  
Design Guidance

Abstract The physics of failure approach to reliability prediction considers fundamental failure mechanisms such as fatigue, wear, corrosion and creep that can shorten the useful life of a product. The work described here uses this approach for commercial appliance components and presents three examples. This paper also outlines a methodology for developing rate modification factors. These rate modification factors can be used for evaluating design changes, early estimation of failure rates, planning accelerated life tests and assessing risks in component application alternatives. Although the physics of failure approach is not new, the application to relatively inexpensive light service commercially based components extends the application beyond the realm of military and heavy industrial equipment. Simplifying assumptions and the use of manufacturer’s material properties are utilized to create a “cookbook” approach for development of design charts useful for improving product reliability. The principal objective of the work presented here is to demonstrate the development of the design charts and their application to commercially based products.

A New Reliability Prediction Method Based on Physics of Failure Method for Product Design and Manufacture

2012 ◽  
Vol 548 ◽  
pp. 521-526 ◽  
Author(s):  
Xing Hao Wang ◽  
Jiang Shao ◽  
Xiao Yu Liu
Keyword(s):  
Monte Carlo ◽  
Monte Carlo Calculation ◽  
Computational Cost ◽  
Prediction Method ◽  
New Method ◽  
Reliability Prediction ◽  
Time To Failure ◽  
Physics Of Failure ◽  
First Order ◽  
Environment Stress

Different from the reliability prediction method on handbook, the reliability prediction method based on Physics of Failure (PoF) model takes failure mechanism as theoretical basis, and combines the design in-formation with the environment stress of the product to predict the time to failure. When the uncertain of the parameters is considered to predict the reliability, Monte-Carlo calculation method is always used here. How-ever, the Monte-Carlo method needs large computational cost, especially for large and complicated electronic systems. A new reliability prediction method which combines the first order reliability with the reliability pre-diction method based on PoF model was proposed. The new method utilized the first order method to calculate the position of design point and reliability index, thus Monte-Carlo calculation process was avoided. Example calculation results showed that the new method improves the prediction efficiency without decreasing the accuracy of reliability, thus it is feasible for reliability prediction of electronic product in engineering.

Reliability Evaluation System of Electronics Components

2006 ◽  
Vol 326-328 ◽  
pp. 569-572 ◽  
Author(s):  
Seung Woo Lee ◽  
Seung Woo Han ◽  
Jun Yeob Song ◽  
Wan Doo Kim ◽  
Hwa Ki Lee
Keyword(s):  
Evaluation System ◽  
Reference Model ◽  
Reliability Evaluation ◽  
Reliability Prediction ◽  
Service Reliability ◽  
Electronic Components ◽  
Reliability Data ◽  
Physics Of Failure ◽  
Printed Circuits

The reliability, that is long-term quality, requires a different approaching from short-term quality which is used before. As the electronic components are to be easily normalized on the reliability evaluation, many reliability prediction methodologies are used. In this study, integrated reference model of reliability prediction is serviced for existing PRISM and Bellcore which is related on reliability prediction about electronic components, and will service reliability data based on PoF (Physics of Failure) from domestic research center. The constructed frame of reliability evaluation system, which can predict and evaluate reliability of electronic components and MEMS, is designed by using online service of the reliability data accumulated on web. To evaluate proposed system, the reliability evaluation of PCB (Printed Circuits Boards), which is used in NC controller of machine tools, is introduced according to PRISM, the representative reference model of reliability prediction about electronic components based on MIL-HDBK-217F.

TWO-STAGE DESIGN OF EXPERIMENTS APPROACH FOR PREDICTION OF RELIABILITY OF OPTOCOUPLERS

2012 ◽  
Vol 19 (02) ◽  
pp. 1250007 ◽  
Author(s):  
ADITHYA THADURI ◽  
A. K. VERMA ◽  
GOPIKA VINOD ◽  
M. G. RAJESH ◽  
UDAY KUMAR
Keyword(s):  
Design Of Experiments ◽  
Failure Mechanisms ◽  
Operating Conditions ◽  
Reliability Prediction ◽  
Wafer Level ◽  
Electrical Parameters ◽  
Process Technology ◽  
Stage Design ◽  
Physics Of Failure ◽  
Materials Used

Conventionally, reliability prediction of electronic components is carried out using standard handbooks such as MIL STD 217 plus, Telcordia, etc. But these methods fail to provide a realistic estimate of reliability for upcoming technologies. Currently, electronic reliability prediction is moving towards applying the Physics of Failure approach which considers information on process, technology, fabrication techniques, materials used, etc. Industries employ different technologies like CMOS, BJT and BICMOS for various applications. The possibility of chance of failure at interdependencies of materials, processes, and characteristics under operating conditions is the major concern which affects the performance of the devices. They are characterized by several failure mechanisms at various stages such as wafer level, interconnection, etc. For this, the dominant failure mechanisms and stress parameters needs to be identified. Optocouplers are used in input protection of several instrumentation systems providing safety under over-stress conditions. Hence, there is a need to study the reliability and safety aspects of optocouplers. Design of experiments is an efficient and prominent methodology for finding the reliability of the item, as the experiment provides a proof for the hypothesis under consideration. One of the important techniques involved is Taguchi method which is employed for finding the prominent failure mechanisms in semiconductor devices. By physics of failure approach, the factors that are affecting the performance on both environmental and electrical parameters with stress levels for optocouplers are identified. By constructing a 2-stage Taguchi array with these parameters where output parameters decides the effect of top two dominant failure mechanisms and their extent of chance of failure can be predicted. This analysis helps us in making the appropriate modifications considering both the failure mechanisms for the reliability growth of these devices. This paper highlights the application of design of experiments for finding the dominant failure mechanisms towards using physics of failure approach in electronic reliability prediction of optocouplers for application of instrumentation.

scholarly journals Reliability prediction of semiconductor devices using modified physics of failure approach

2013 ◽  
Vol 4 (1) ◽  
pp. 33-47 ◽  
Author(s):  
Adithya Thaduri ◽  
Ajit Kumar Verma ◽  
V. Gopika ◽  
Rajesh Gopinath ◽  
Uday Kumar
Keyword(s):  
Semiconductor Devices ◽  
Reliability Prediction ◽  
Physics Of Failure
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