An internal electrostatic charging test of circuit boards under electron beam

2011 ◽  
Author(s):  
Wousik Kim ◽  
Ira Katz ◽  
Nelson W. Green ◽  
Insoo Jun
Keyword(s):  
Electron Beam ◽  
Circuit Boards ◽  
Electrostatic Charging

Control of electrostatic charging of solids in channels filled with electron beam plasma

2021 ◽  
Vol 13 (1) ◽  
pp. 65-70
Author(s):  
Hlaing Tun Ye ◽  
Kyaw Oo Aung ◽  
M.N. Vasiliev ◽  
Ko Ko Zaw Htet ◽  
Min Maung Zin ◽  
...  
Keyword(s):  
Electron Beam ◽  
Beam Plasma ◽  
Electrostatic Charging ◽  
Electron Beam Plasma

Electrostatic charging and arc discharges on satellite dielectrics simulated by electron beam

1986 ◽  
Author(s):  
H. FUJII ◽  
Y. SHIBUYA ◽  
T. ABE ◽  
R. KASAI ◽  
H. NISHIMOTO
Keyword(s):  
Electron Beam ◽  
Electrostatic Charging ◽  
Arc Discharges

Packaging Technology of Multi Deflection Arrays for Multi-Shaped Beam Lithography

2011 ◽  
Vol 2011 (1) ◽  
pp. 000600-000607 ◽  
Author(s):  
T. Burkhardt ◽  
M. Mohaupt ◽  
M. Hornaff ◽  
B. Zaage ◽  
E. Beckert ◽  
...  
Keyword(s):  
Electron Beam ◽  
Degrees Of Freedom ◽  
Printed Circuit Boards ◽  
Electrical Signal ◽  
Beam Deflection ◽  
Circuit Boards ◽  
Direct Writing ◽  
Soldering Process ◽  
Flexible Printed Circuit ◽  
Silicon Based

Multi-Shaped electron beam lithography is considered a promising approach for high throughput mask and direct writing. Providing multiple apertures and individually controlled electrodes it allows for massive parallelization of exposure shots, thus significantly decreasing write time. A silicon-based micro-structured MEMS multi-beam deflection array (MDA) featuring 8×8 apertures is presented. The hybrid integration of MDA devices in ceramic system carriers utilizing a laser-based Solderjet Bumping process is demonstrated. This flux-free soldering process provides adhesive-free, long term stable and vacuum compatible joints and is used for both mechanical fixation and electrical connection. Electron beam deflection in two perpendicular directions requires the highly accurate placement of two crossed MDA devices, which is carried out by three degrees of freedom alignment procedures and solder joining. Electrical signal routing within the electron optical column using flexible printed circuit boards and flux-free soldering is also reported. The precision adjustment of two carriers is accomplished by fiducial mark detection using image processing. Results on alignment accuracy in the sub-micron range, mechanical and electrical testing of such assemblies are reported.

Electrostatic charging and arc discharges on satellite dielectrics simulated by electron beam

1988 ◽  
Vol 25 (2) ◽  
pp. 156-161 ◽  
Author(s):  
Haruhisa Fujii ◽  
Yoshikazu Shibuya ◽  
Toshio Abe ◽  
Ritaroh Kasai ◽  
Hironobu Nishimoto
Keyword(s):  
Electron Beam ◽  
Electrostatic Charging ◽  
Arc Discharges

Techniques for Transmission Electron Microscopy of Fiber-Matrix Interfaces in Aluminum Alloy-Boron Composites by Ion Erosio

1971 ◽  
Vol 29 ◽  
pp. 204-205
Author(s):  
G. G. Shaw
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Aluminum Alloy ◽  
Electron Beam ◽  
Pure Aluminum ◽  
Ion Milling ◽  
Transmission Electron ◽  
Fiber Matrix ◽  
Ion Erosion ◽  
Row Of Fibers

The morphology and composition of the fiber-matrix interface can best be studied by transmission electron microscopy and electron diffraction. For some composites satisfactory samples can be prepared by electropolishing. For others such as aluminum alloy-boron composites ion erosion is necessary.When one wishes to examine a specimen with the electron beam perpendicular to the fiber, preparation is as follows: A 1/8 in. disk is cut from the sample with a cylindrical tool by spark machining. Thin slices, 5 mils thick, containing one row of fibers, are then, spark-machined from the disk. After spark machining, the slice is carefully polished with diamond paste until the row of fibers is exposed on each side, as shown in Figure 1.In the case where examination is desired with the electron beam parallel to the fiber, preparation is as follows: Experimental composites are usually 50 mils or less in thickness so an auxiliary holder is necessary during ion milling and for easy transfer to the electron microscope. This holder is pure aluminum sheet, 3 mils thick.

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