Power Delivery System Integration and Automation at Overton Power District No. 5 Overton, Nevada

2006 ◽  
Author(s):  
Kevin Streett ◽  
Kevin Leech ◽  
Greg Rauch
Keyword(s):  
Delivery System ◽  
System Integration ◽  
Power Delivery

Feasibility Implementation of Voltage-Current Waveform Telemetry System in Power Delivery System

2011 ◽  
Vol 131 (4) ◽  
pp. 288-294 ◽  
Author(s):  
Tatsuya Furukawa ◽  
Keita Akagi ◽  
Hisao Fukumoto ◽  
Hideaki Itoh ◽  
Hiroshi Wakuya ◽  
...  
Keyword(s):  
Delivery System ◽  
Power Delivery ◽  
Telemetry System ◽  
Current Waveform

scholarly journals The SideWinder for powering a hand-coring auger in drilling and lifting

2007 ◽  
Vol 47 ◽  
pp. 101-104 ◽  
Author(s):  
Jay Kyne ◽  
Joe McConnell
Keyword(s):  
Delivery System ◽  
High Strength ◽  
Drill String ◽  
Power Delivery ◽  
Synthetic Fiber ◽  
Single Operator ◽  
Electric Drill

AbstractThe SideWinder is a power delivery system for a hand-coring ice auger. It not only greatly increases the rate of drilling, it also makes it possible for a single operator to drill to depths difficult and cumbersome for hand-coring systems. The SideWinder power is delivered by an electric drill that is used for both the drilling and the lifting of the drill string. A high-strength low-stretch synthetic-fiber rope lifts and lowers the drill string as it winds around a tube attached to the electric drill. During winding, the synthetic-fiber rope is guided onto the winding tube by rope cleats that also serve as a quick way to secure the rope for drilling. The end of the winding tube connects directly to the protruding extension of the drill string for drilling. The rope always remains attached to the drill string by a rope-pin that replaces the bottommost connecting pin; the winding tube holds the rope and always stays attached to the electric drill. For lifting and lowering the drill string, cradle arms on a frame that hinges on a plywood platform hold the winding tube.

Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration

2012 ◽  
Vol 2012 (1) ◽  
pp. 000561-000567
Author(s):  
Rabindra N. Das ◽  
Frank D. Egitto ◽  
Barry Bonitz ◽  
Erich Kopp ◽  
Mark D. Poliks ◽  
...  
Keyword(s):  
System Integration ◽  
Integrated Approach ◽  
Power Delivery ◽  
Solder Paste ◽  
3D Integration ◽  
Electrically Conductive ◽  
Reflow Temperature ◽  
Electrically Conductive Adhesive ◽  
The Stability ◽  
Electrical Connections

Package on Package (PoP) stacking has become an attractive method for 3D integration to meet the demands of higher functionality in ever smaller packages, especially when coupled with the use of stacked die. To accomplish this, new packaging designs need to be able to integrate more dies with greater function, higher I/O counts, smaller pitches, and greater heat densities, while being pushed into smaller and smaller footprints. A new 3D “Package Interposer Package” (PIP) solution is suitable for combining multiple memory, ASICs, stacked die, stacked packaged die, etc., into a single package. This approach also favors system integration with high density power delivery by appropriate interposer design and thermal management. Traditional Package on Package (PoP) approaches use direct solder connections between the substrates and are limited to use of single (or minimum) die on the bottom substrate, to reduce warpage and improve stability. For PIP, the stability imparted by the interposer reduces warpage, allowing assemblers of the PIP to select the top and bottom components (substrates, die, stacked die, modules) from various suppliers. This mitigates the problem of variation in warpage trends from room temperature to reflow temperature for different substrates/modules when combined with other packages. PIP facilitates more space-efficient designs, and can accommodate any stacked die height without compromising warpage and stability. PIP can accommodate modules with stacked die on organic, ceramic, or silicon board substrates, where each can be detached and replaced without affecting the rest of the package. Thus, PIP will be economical for high-end electronics, since a damaged, non-factional part of the package can be selectively removed and replaced. A variety of interposer structures were used to fabricate Package Interposer Package (PIP) modules. Electrical connections were formed during reflow using a tin-lead eutectic solder paste. Interconnection among substrates (packages) in the stack was achieved using interposers. Plated through holes in the interposers, formed by laser or mechanical drilling and having diameters ranging from 50 μm to 250 μm, were filled with an electrically conductive adhesive and cured. The adhesive-filled and cured interposers were reflowed with circuitized substrates to produce a PIP structure. In summary, the present work describes an integrated approach to develop 3D PIP constructions on various stacked die or stacked packaged die configurations.

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