Process-induced Warpage in HVQFN Package: Effect of Design Parameters and Processing Conditions

2006 ◽  
Author(s):  
D.G. Yang ◽  
L.J. Ernst ◽  
K.M.B. Jansen ◽  
G.Q. Zhang ◽  
J.H.J. Janssen ◽  
...  
Keyword(s):  
Design Parameters ◽  
Processing Conditions ◽  
Package Effect

Numerical Simulation and Technology Research on the Precision Forging for Inner Ring Gear

2011 ◽  
Vol 88-89 ◽  
pp. 29-33
Author(s):  
Liang Li
Keyword(s):  
Numerical Simulation ◽  
Finite Element Method ◽  
Numerical Models ◽  
Cold Extrusion ◽  
Design Parameters ◽  
Processing Conditions ◽  
Ring Gear ◽  
Technology Research ◽  
Precision Forging ◽  
Forming Defects

Rigid-viscoplastic finite element method was used to analysis the cold extrusion of the external boss and ring gear. Some groups of numerical models were built with different design parameters of die, geometric parameters of gear, processing conditions, and the service loads were investigated. Form the investigation; we predicted the forming defects occurring in the practice. Based on Archard model the lives of dies were predicted. The conclusion above has more guidance to the production.

Dry grinding of waste wood fiberboard: Theoretical and practical aspects affecting the resulting fiber quality

BioResources ◽  
2021 ◽  
Vol 16 (4) ◽  
pp. 8152-8171
Author(s):  
Venera Matygulina ◽  
Natalya Chistova ◽  
Aleksandr Vititnev ◽  
Roman Chistov
Keyword(s):  
Fiber Quality ◽  
Economic Feasibility ◽  
Wood Fibre ◽  
Design Parameters ◽  
Processing Conditions ◽  
Plant Design ◽  
Chemical Additives ◽  
Dry Processing ◽  
Dry Grinding ◽  
Secondary Wood

This paper presents the results of research on the treatment of secondary wood fibre semi-finished materials using a dry-grinding-type rotary cutting mill and the possibility of their use in finished products for various purposes. The physical phenomena, processes, and regularities of the treatment of secondary wood fibre materials in dry processing conditions were determined and evaluated. The influence of grinding plant design parameters on wood fibre quality indices was evaluated. Mechanical effects on wood fibre waste of face-cross cutting (cutting, crumpling, collapsing, and breaking) and the dry grinding environment (breaking, collision, defibering, and fibrillation) was studied. These phenomena contribute to the formation of external and internal fibrillation of secondary wood fibre and an increase in the specific surface area. This is achieved in the absence of high temperatures and pressure, in the absence of chemical additives, and without the application of water and vapour. The effectiveness of secondary wood fibre semi-finished material treatment was demonstrated under dry processing conditions, thus confirming the environmental and economic feasibility of this method.

Formation of defects in implanted hipox-structures

1992 ◽  
Vol 50 (2) ◽  
pp. 1406-1407
Author(s):  
Peter Pegler ◽  
N. David Theodore ◽  
Ming Pan
Keyword(s):  
High Pressure ◽  
Cross Section ◽  
Semiconductor Devices ◽  
Silicon Substrates ◽  
Processing Conditions ◽  
Pressure Oxidation ◽  
Deep Trench ◽  
Local Oxidation ◽  
Trench Isolation ◽  
And Behavior

High-pressure oxidation of silicon (HIPOX) is one of various techniques used for electrical-isolation of semiconductor-devices on silicon substrates. Other techniques have included local-oxidation of silicon (LOCOS), poly-buffered LOCOS, deep-trench isolation and separation of silicon by implanted oxygen (SIMOX). Reliable use of HIPOX for device-isolation requires an understanding of the behavior of the materials and structures being used and their interactions under different processing conditions. The effect of HIPOX-related stresses in the structures is of interest because structuraldefects, if formed, could electrically degrade devices.This investigation was performed to study the origin and behavior of defects in recessed HIPOX (RHIPOX) structures. The structures were exposed to a boron implant. Samples consisted of (i) RHlPOX'ed strip exposed to a boron implant, (ii) recessed strip prior to HIPOX, but exposed to a boron implant, (iii) test-pad prior to HIPOX, (iv) HIPOX'ed region away from R-HIPOX edge. Cross-section TEM specimens were prepared in the <110> substrate-geometry.

The influence of confocal microscope design on imaging performance

1993 ◽  
Vol 51 ◽  
pp. 144-145
Author(s):  
C J R Sheppard
Keyword(s):  
Image Quality ◽  
Fluorescence Imaging ◽  
Confocal Microscope ◽  
Industrial Applications ◽  
Three Dimensions ◽  
Design Parameters ◽  
Weak Signals ◽  
Size And Shape ◽  
Imaging Performance ◽  
Fundamental Limitation

The confocal microscope is now widely used in both biomedical and industrial applications for imaging, in three dimensions, objects with appreciable depth. There are now a range of different microscopes on the market, which have adopted a variety of different designs. The aim of this paper is to explore the effects on imaging performance of design parameters including the method of scanning, the type of detector, and the size and shape of the confocal aperture.It is becoming apparent that there is no such thing as an ideal confocal microscope: all systems have limitations and the best compromise depends on what the microscope is used for and how it is used. The most important compromise at present is between image quality and speed of scanning, which is particularly apparent when imaging with very weak signals. If great speed is not of importance, then the fundamental limitation for fluorescence imaging is the detection of sufficient numbers of photons before the fluorochrome bleaches.

Design Parameters Of A Comfortable Living Environment In The Normative Documentation

2020 ◽  
pp. 51-56
Keyword(s):  
Russian Federation ◽  
Living Environment ◽  
National Standards ◽  
Design Parameters ◽  
Internal Space ◽  
Environment Quality ◽  
Indoor Environment Quality ◽  
Community Information ◽  
Normative Documentation ◽  
The Russian Federation

Currently, the professional construction community information field is largely filled with the topic of creating a comfortable living environment. However, architectural and engineering design that corresponds to the concept of sustainable development is currently hindered due to the lack of a formed conceptual framework that reveals the meaning of the term "comfort", as well as a criteria list that determines the indoor environment quality in the Russian Federation regulatory and technical framework. The article offers some components of a comfortable living environment, within which the parameters of designing the internal environment of premises are highlighted. A comparative analysis of the national standards of the Russian Federation regulating the design of the internal space of residential and public buildings, with international "green" standards for a number of parameters was carried out. It is concluded that it is necessary to update the Russian regulatory and technical base taking into account the international experience of "green" standards.

Effiecency criterion for selection of design parameters of aerospace system

2016 ◽  
Vol 22 (2(99)) ◽  
pp. 48-51
Author(s):  
D.S. Kalynychenko ◽  
◽  
Ye.Yu. Baranov ◽  
M.V. Poluian ◽  
◽  
...  
Keyword(s):  
Design Parameters ◽  
Selection Of

Progressive Debonding of Multilayer Interconnect Structures

1997 ◽  
Vol 473 ◽  
Author(s):  
Michael Lane ◽  
Robert Ware ◽  
Steven Voss ◽  
Qing Ma ◽  
Harry Fujimoto ◽  
...  
Keyword(s):  
Thin Films ◽  
Crack Growth ◽  
Driving Force ◽  
Adhesion Energy ◽  
Time Dependent ◽  
Multilayer Thin Films ◽  
Processing Conditions ◽  
Interface Morphology ◽  
Entire Sample ◽  
Crack Growth Velocity

ABSTRACTProgressive (or time dependent) debonding of interfaces poses serious problems in interconnect structures involving multilayer thin films stacks. The existence of such subcriticai debonding associated with environmentally assisted crack-growth processes is examined for a TiN/SiO2 interface commonly encountered in interconnect structures. The rate of debond extension is found to be sensitive to the mechanical driving force as well as the interface morphology, chemistry, and yielding of adjacent ductile layers. In order to investigate the effect of interconnect structure, particularly the effect of an adjacent ductile Al-Cu layer, on subcriticai debonding along the TiN/SiO2 interface, a set of samples was prepared with Al-Cu layer thicknesses varying from 0.2–4.0 μm. All other processing conditions remained the same over the entire sample run. Results showed that for a given crack growth velocity, the debond driving force scaled with Al-Cu layer thickness. Normalizing the data by the critical adhesion energy allowed a universal subcriticai debond rate curve to be derived.

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