Two- and three-dimensional polymer directional coupler for high-density optical interconnects at 1550 nm

2018 ◽  
Author(s):  
Xiao Xu ◽  
Lin Ma ◽  
Zuyuan He
Keyword(s):  
Optical Interconnects ◽  
Directional Coupler ◽  
Three Dimensional ◽  
High Density

scholarly journals Evidence of Three-Dimensional Asymmetries Seeded by High-Density Carbon-Ablator Nonuniformity in Experiments at the National Ignition Facility

2021 ◽  
Vol 126 (2) ◽  
Author(s):  
D. T. Casey ◽  
B. J. MacGowan ◽  
J. D. Sater ◽  
A. B. Zylstra ◽  
O. L. Landen ◽  
...  
Keyword(s):  
Three Dimensional ◽  
High Density ◽  
National Ignition Facility

Three-dimensional polymer mode (de)multiplexer with cascaded tapered couplers for on-board optical interconnects

2021 ◽  
Author(s):  
Yuling Shang ◽  
Wenjie Guo ◽  
Xiang He ◽  
Jinzhuo Zhou ◽  
Yaya Yan ◽  
...  
Keyword(s):  
Optical Interconnects ◽  
Three Dimensional

High-density and wide-bandwidth optical interconnects with silicon optical interposers [Invited]

2014 ◽  
Vol 2 (3) ◽  
pp. A1 ◽  
Author(s):  
Yutaka Urino ◽  
Tatsuya Usuki ◽  
Junichi Fujikata ◽  
Masashige Ishizaka ◽  
Koji Yamada ◽  
...  
Keyword(s):  
Optical Interconnects ◽  
High Density ◽  
Wide Bandwidth

1‐to‐12 surface normal three‐dimensional optical interconnects

1993 ◽  
Vol 63 (14) ◽  
pp. 1883-1885 ◽  
Author(s):  
Ray T. Chen ◽  
Suning Tang ◽  
Maggie M. Li ◽  
David Gerald ◽  
Srikanth Natarajan
Keyword(s):  
Optical Interconnects ◽  
Three Dimensional ◽  
Surface Normal

scholarly journals A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-Via and Solder Bumping Process

Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1664
Author(s):  
Do Hoon Cho ◽  
Seong Min Seo ◽  
Jang Baeg Kim ◽  
Sri Harini Rajendran ◽  
Jae Pil Jung
Keyword(s):  
High Speed ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Density ◽  
Internal Stresses ◽  
Deep Reactive Ion Etching ◽  
Fifth Generation ◽  
Precise Understanding ◽  
Fabrication Defects

With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging.

A Compact 310-Gb/s Optical Transceiver for High-Density Optical Interconnects

2017 ◽  
Vol 29 (3) ◽  
pp. 334-337 ◽  
Author(s):  
Yasunobu Matsuoka ◽  
Naohiro Kohmu ◽  
Yong Lee ◽  
Hideo Arimoto ◽  
Toshiaki Takai ◽  
...  
Keyword(s):  
Optical Interconnects ◽  
High Density
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