Microfabrication Process of PZT Thick Film by Aerosol Deposition Method

2006 ◽  
Author(s):  
Xuan-Yu Wang ◽  
Chi-Yuan Lee ◽  
Pei-Yen Chen ◽  
Cheng-Jien Peng ◽  
Pei-Zen Chang
Keyword(s):  
Thick Film ◽  
Aerosol Deposition ◽  
Deposition Method ◽  
Aerosol Deposition Method ◽  
Pzt Thick Film

scholarly journals A micrometer scale and low temperature PZT thick film MEMS process utilizing an aerosol deposition method

2008 ◽  
Vol 143 (2) ◽  
pp. 469-474 ◽  
Author(s):  
Xuan-Yu Wang ◽  
Chi-Yuan Lee ◽  
Cheng-Jien Peng ◽  
Pei-Yen Chen ◽  
Pei-Zen Chang
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Aerosol Deposition ◽  
Deposition Method ◽  
Aerosol Deposition Method ◽  
Micrometer Scale ◽  
Mems Process ◽  
Pzt Thick Film

NiZnCu Ferrite Thick Film with Nano Scale Crystallites Formed by the Aerosol Deposition Method

2004 ◽  
Vol 87 (9) ◽  
pp. 1621-1624 ◽  
Author(s):  
Maxim Lebedev ◽  
Jun Akedo ◽  
Atsushi Iwata ◽  
Satoshi Sugimoto ◽  
Kouichiro Inomata
Keyword(s):  
Thick Film ◽  
Aerosol Deposition ◽  
Deposition Method ◽  
Nano Scale ◽  
Aerosol Deposition Method

Analysis of the characteristics of thick-film NTC thermistor devices manufactured by screen-printing and firing technique and by room temperature aerosol deposition method (ADM)

2017 ◽  
Vol 10 (06) ◽  
pp. 1750073 ◽  
Author(s):  
Michaela Schubert ◽  
Jaroslaw Kita ◽  
Christian Münch ◽  
Ralf Moos
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Room Temperature ◽  
Mechanical Stability ◽  
Negative Temperature ◽  
Aerosol Deposition ◽  
Deposition Method ◽  
Aerosol Deposition Method ◽  
Ntc Thermistor ◽  
Screen Printed

The study compares thick-film NTC thermistor devices, produced by the screen-printing (and firing) technique and by the Aerosol Deposition Method (ADM) at room temperature. The devices are compared with respect to film quality (optical, mechanical) and to the negative temperature coefficient of resistance (NTCR) parameters [Formula: see text] and [Formula: see text]. While the screen-printed films are porous, the Aerosol Deposited (AD) films are characterized by high tightness, mechanical stability, and a production at room temperature. The electrical analysis shows that the AD films reach the [Formula: see text]- and [Formula: see text]-values of bulk NTCRs from literature after a moderate tempering step below 400[Formula: see text]C in air. The screen-printed films show [Formula: see text]-values that are comparable to the values of bulk NTCRs from literature and [Formula: see text]-values that are significantly higher.

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