Fabrication and Evaluation of Lead-Free Piezoelectric Ceramic LF4 Thick Film Deposited by Aerosol Deposition Method

2006 ◽  
Vol 45 (9B) ◽  
pp. 7465-7470 ◽  
Author(s):  
Se-Woong Oh ◽  
Jun Akedo ◽  
Jae-Hyuk Park ◽  
Yoshihiro Kawakami
2016 ◽  
Vol 42 (13) ◽  
pp. 14635-14641 ◽  
Author(s):  
Marllory Isaza-Ruiz ◽  
Joseph Henon ◽  
Olivier Durand-Panteix ◽  
Gregory Etchegoyen ◽  
Fabrice Rossignol ◽  
...  

2004 ◽  
Vol 87 (9) ◽  
pp. 1621-1624 ◽  
Author(s):  
Maxim Lebedev ◽  
Jun Akedo ◽  
Atsushi Iwata ◽  
Satoshi Sugimoto ◽  
Kouichiro Inomata

2017 ◽  
Vol 10 (06) ◽  
pp. 1750073 ◽  
Author(s):  
Michaela Schubert ◽  
Jaroslaw Kita ◽  
Christian Münch ◽  
Ralf Moos

The study compares thick-film NTC thermistor devices, produced by the screen-printing (and firing) technique and by the Aerosol Deposition Method (ADM) at room temperature. The devices are compared with respect to film quality (optical, mechanical) and to the negative temperature coefficient of resistance (NTCR) parameters [Formula: see text] and [Formula: see text]. While the screen-printed films are porous, the Aerosol Deposited (AD) films are characterized by high tightness, mechanical stability, and a production at room temperature. The electrical analysis shows that the AD films reach the [Formula: see text]- and [Formula: see text]-values of bulk NTCRs from literature after a moderate tempering step below 400[Formula: see text]C in air. The screen-printed films show [Formula: see text]-values that are comparable to the values of bulk NTCRs from literature and [Formula: see text]-values that are significantly higher.


2008 ◽  
Vol 143 (2) ◽  
pp. 469-474 ◽  
Author(s):  
Xuan-Yu Wang ◽  
Chi-Yuan Lee ◽  
Cheng-Jien Peng ◽  
Pei-Yen Chen ◽  
Pei-Zen Chang

2003 ◽  
Vol 39 (5) ◽  
pp. 2986-2988 ◽  
Author(s):  
S. Sugimoto ◽  
T. Maeda ◽  
R. Kobayashi ◽  
J. Akedo ◽  
M. Lebedev ◽  
...  

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