Equivalent Single Conductor Modeling of Carbon Nanotube Bundles for Transient Analysis of High-Speed Interconnects

2008 ◽  
Author(s):  
M. D'Amore ◽  
M. Ricci ◽  
A. Tamburrano
Keyword(s):  
Carbon Nanotube ◽  
High Speed ◽  
Transient Analysis ◽  
Nanotube Bundles ◽  
High Speed Interconnects

scholarly journals Analysis of the Propagation in High-Speed Interconnects for MIMICs by Means of the Method of Analytical Preconditioning: A New Highly Efficient Evaluation of the Coefficient Matrix

2021 ◽  
Vol 11 (3) ◽  
pp. 933
Author(s):  
Mario Lucido
Keyword(s):  
Integral Equation ◽  
Integrated Circuits ◽  
High Speed ◽  
Coefficient Matrix ◽  
Single Step ◽  
Integral Theorem ◽  
Acceleration Technique ◽  
Cauchy Integral Theorem ◽  
Integral Equation Formulation ◽  
High Speed Interconnects

The method of analytical preconditioning combines the discretization and the analytical regularization of a singular integral equation in a single step. In a recent paper by the author, such a method has been applied to a spectral domain integral equation formulation devised to analyze the propagation in polygonal cross-section microstrip lines, which are widely used as high-speed interconnects in monolithic microwave and millimeter waves integrated circuits. By choosing analytically Fourier transformable expansion functions reconstructing the behavior of the fields on the wedges, fast convergence is achieved, and the convolution integrals are expressed in closed form. However, the coefficient matrix elements are one-dimensional improper integrals of oscillating and, in the worst cases, slowly decaying functions. In this paper, a novel technique for the efficient evaluation of such kind of integrals is proposed. By means of a procedure based on Cauchy integral theorem, the general coefficient matrix element is written as a linear combination of fast converging integrals. As shown in the numerical results section, the proposed technique always outperforms the analytical asymptotic acceleration technique, especially when highly accurate solutions are required.

Unzipping Carbon Nanotube Bundles through NH−π Stacking for Enhanced Electrical and Thermal Transport

2021 ◽  
Author(s):  
Shuiliang Wang ◽  
Zhequn Huang ◽  
Wenbo Shi ◽  
Dongwook Lee ◽  
Qixiang Wang ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Thermal Transport ◽  
Nanotube Bundles ◽  
Π Stacking

scholarly journals The heat capacity of nitrogen chain in grooves of single-walled carbon nanotube bundles

2013 ◽  
Vol 39 (5) ◽  
pp. 441-445 ◽  
Author(s):  
M. I. Bagatskii ◽  
M. S. Barabashko ◽  
V. V. Sumarokov
Keyword(s):  
Heat Capacity ◽  
Carbon Nanotube ◽  
Single Walled Carbon Nanotube ◽  
Single Walled Carbon ◽  
Nanotube Bundles
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