Beam-lead partially-depleted-absorber photodiode

2012 IEEE International Topical Meeting on Microwave Photonics ◽

10.1109/mwp.2012.6474106 ◽

2012 ◽

Cited By ~ 4

Author(s):

A. Chizh ◽

S. Malyshev ◽

A. Tepteev ◽

V. Andrievski ◽

E. Guszhinskaya ◽

...

Keyword(s):

Beam Lead

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Fatigue failure of encapsulated gold-beam lead and TAB devices

Microelectronics Reliability ◽

10.1016/0026-2714(78)90456-0 ◽

1978 ◽

Vol 18 (4) ◽

pp. 308

Keyword(s):

Fatigue Failure ◽

Beam Lead

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Band widening of NRD guide beam-lead diode devices and their applications to integrated transceivers at 60 GHz

1999 Asia Pacific Microwave Conference. APMC'99. Microwaves Enter the 21st Century. Conference Proceedings (Cat. No.99TH8473) ◽

10.1109/apmc.1999.829795 ◽

2003 ◽

Cited By ~ 1

Author(s):

F. Kuroki ◽

T. Mukai ◽

T. Yoneyama

Keyword(s):

60 Ghz ◽

Nrd Guide ◽

Beam Lead

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ChemInform Abstract: ELECTROLESS GOLD BEAM LEAD PLATING

Chemischer Informationsdienst ◽

10.1002/chin.197415058 ◽

1974 ◽

Vol 5 (15) ◽

pp. no-no

Author(s):

R. SARD ◽

Y. OKINAKA ◽

H. A. WAGGENER

Keyword(s):

Electroless Gold ◽

Beam Lead

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The design and analysis of a 350 GHz wide band beam-lead varistor quadrupler

Twenty Seventh International Conference on Infrared and Millimeter Waves ◽

10.1109/icimw.2002.1076191 ◽

2003 ◽

Author(s):

Qun Xiao ◽

K. Wade Nye ◽

J.L. Hester ◽

T.W. Crowe

Keyword(s):

Wide Band ◽

Beam Lead

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Optimum geometrical dimensions of beam lead Schottky barrier mixer diode

[Conference Digest] International Conference on Millimeter Wave and Far-Infrared Technology: ICMWFT '90 ◽

10.1109/icmwft.1989.763826 ◽

2005 ◽

Author(s):

Dong Zheng ◽

Liangchen Wang ◽

Puming Feng

Keyword(s):

Schottky Barrier ◽

Geometrical Dimensions ◽

Beam Lead

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Effects of substrate temperature on silicon nitride cracking of beam lead devices during thermocompression wobble bonding

10.2172/7273190 ◽

1976 ◽

Cited By ~ 1

Author(s):

D.W. Bushmire ◽

E.L. Chavez ◽

M.H. Finley

Keyword(s):

Silicon Nitride ◽

Substrate Temperature ◽

Beam Lead

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Analysis of thermal impedance for conventional and beam lead IC chips

IEEE Transactions on Electron Devices ◽

10.1109/t-ed.1971.17344 ◽

1971 ◽

Vol 18 (12) ◽

pp. 1139-1146 ◽

Cited By ~ 2

Author(s):

J. Ebrahimi

Keyword(s):

Thermal Impedance ◽

Beam Lead

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The use of acoustic emission in a test for beam lead bond integrity

Microelectronics Reliability ◽

10.1016/0026-2714(77)90060-9 ◽

1977 ◽

Vol 16 (1) ◽

pp. 19

Keyword(s):

Acoustic Emission ◽

Beam Lead

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Thermal analysis of beam-lead transistor chip

Microelectronics Reliability ◽

10.1016/0026-2714(72)90755-x ◽

1972 ◽

Vol 11 (1) ◽

pp. 20

Keyword(s):

Thermal Analysis ◽

Beam Lead

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Air-gap isolated microcircuits—Beam-lead devices

IEEE Transactions on Electron Devices ◽

10.1109/t-ed.1968.16421 ◽

1968 ◽

Vol 15 (9) ◽

pp. 640-644 ◽

Cited By ~ 1

Author(s):

W.C. Rosvold ◽

W.H. Legat ◽

R.L. Holden

Keyword(s):

Air Gap ◽

Beam Lead

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