High power CW DUV coherent light sources for metrology applications

Author(s):  
Jun Sakuma ◽  
T. Sumiyoshi ◽  
Y. Asakawa ◽  
H. Sekita ◽  
M. Obara
Author(s):  
Alexander Chamorovskiy ◽  
Stepan N. Il'chenko ◽  
Andrey S. Anikeev ◽  
Vladimir R. Shidlovski ◽  
Sergei D. Yakubovich

Author(s):  
Alexey V. Kavokin ◽  
Jeremy J. Baumberg ◽  
Guillaume Malpuech ◽  
Fabrice P. Laussy

Polariton devices offer multiple advantages compared to conventional semiconductor devices. The bosonic nature of exciton polaritons offers opportunity of realisation of polariton lasers: coherent light sources based on bosonic condensates of polaritons. The final state stimulation of any transition feeding a polariton condensate has been used in many proposals such as for terahertz lasers based on polariton lasers. Furthermore, large coherence lengths of exciton-polaritons in microcavities open the way to realisation of polariton transport devices including transistors and logic gates. Being bosonic spin carriers, exciton-polaritons may be used in spintronic devices and polarisation switches. This chapter offers an overview on the existing proposals for polariton devices.


2021 ◽  
Vol 11 (9) ◽  
pp. 4035
Author(s):  
Jinsheon Kim ◽  
Jeungmo Kang ◽  
Woojin Jang

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.


CrystEngComm ◽  
2021 ◽  
Author(s):  
Mingming Jiang ◽  
Fupeng Zhang ◽  
Kai Tang ◽  
Peng Wan ◽  
Caixia Kan

Achieving electrically-driven exciton-polaritons has drawn substantial attention toward developing ultralow-threshold coherent light sources, containing polariton laser devices and high-performance light-emitting diodes (LEDs). In this work, we demonstrate an electrically driven...


2014 ◽  
Vol 3 (5-6) ◽  
Author(s):  
Roland Lachmayer ◽  
Alexander Wolf ◽  
Gerolf Kloppenburg

AbstractFor many lighting applications, light-emitting diodes (LEDs) are replacing traditional light sources providing the possibility for smart and efficient systems as well as a reduction in the product weight. A next step in this development is the integration of laser-based light sources to increase luminance and to further scale down the optics possibly leading to a reduction of necessary resources. This article reviews the possibilities and challenges arising from the use of laser diodes especially compared to current high-power LED systems in terms of efficiency, color-rendering properties, and thermal management.


2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.


2018 ◽  
Vol 27 (11) ◽  
pp. 114208 ◽  
Author(s):  
Yu-Hsun Chou ◽  
Chia-Jui Chang ◽  
Tzy-Rong Lin ◽  
Tien-Chang Lu

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