Enhanced Heat Dissipation of High-Power Light-Emitting Diodes by Cu Nanoparticle Paste

2019 ◽  
Vol 40 (6) ◽  
pp. 949-952 ◽  
Author(s):  
Yun Mou ◽  
Hao Wang ◽  
Yang Peng ◽  
Hao Cheng ◽  
Qinglei Sun ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diodes ◽  
Light Emitting ◽  
Cu Nanoparticle

scholarly journals High-Power GaN-Based Vertical Light-Emitting Diodes on 4-Inch Silicon Substrate

Nanomaterials ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 1178 ◽  
Author(s):  
Qiang Zhao ◽  
Jiahao Miao ◽  
Shengjun Zhou ◽  
Chengqun Gui ◽  
Bin Tang ◽  
...  
Keyword(s):  
High Power ◽  
Silicon Substrate ◽  
Flip Chip ◽  
Heat Dissipation ◽  
Light Emitting Diodes ◽  
Light Output ◽  
Current Spreading ◽  
Light Emitting ◽  
Fabry Perot ◽  
Lift Off

We demonstrate high-power GaN-based vertical light-emitting diodes (LEDs) (VLEDs) on a 4-inch silicon substrate and flip-chip LEDs on a sapphire substrate. The GaN-based VLEDs were transferred onto the silicon substrate by using the Au–In eutectic bonding technique in combination with the laser lift-off (LLO) process. The silicon substrate with high thermal conductivity can provide a satisfactory path for heat dissipation of VLEDs. The nitrogen polar n-GaN surface was textured by KOH solution, which not only improved light extract efficiency (LEE) but also broke down Fabry–Pérot interference in VLEDs. As a result, a near Lambertian emission pattern was obtained in a VLED. To improve current spreading, the ring-shaped n-electrode was uniformly distributed over the entire VLED. Our combined numerical and experimental results revealed that the VLED exhibited superior heat dissipation and current spreading performance over a flip-chip LED (FCLED). As a result, under 350 mA injection current, the forward voltage of the VLED was 0.36 V lower than that of the FCLED, while the light output power (LOP) of the VLED was 3.7% higher than that of the FCLED. The LOP of the FCLED saturated at 1280 mA, but the light output saturation did not appear in the VLED.

Effective Heat Dissipation from Color-Converting Plates in High-Power White Light Emitting Diodes by Transparent Graphene Wrapping

ACS Nano ◽  
2015 ◽  
Vol 10 (1) ◽  
pp. 238-245 ◽  
Author(s):  
Eden Kim ◽  
Hyeon Woo Shim ◽  
Sanjith Unithrattil ◽  
Yoon Hwa Kim ◽  
Hojin Choi ◽  
...  
Keyword(s):  
White Light ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diodes ◽  
Light Emitting ◽  
Effective Heat ◽  
White Light Emitting Diodes

Glass-ceramic composites for high-power white-light-emitting diodes

2021 ◽  
Author(s):  
Alessandro Longato ◽  
Sebastiano Picco ◽  
Lorenzo Moro ◽  
Matteo Buffolo ◽  
Carlo De Santi ◽  
...  
Keyword(s):  
White Light ◽  
High Power ◽  
Glass Ceramic ◽  
Light Emitting Diodes ◽  
Ceramic Composites ◽  
Light Emitting ◽  
White Light Emitting Diodes

High Power and Stable High Coupling Efficiency (66%) Superluminescent Light Emitting Diodes by Using Active Multi-Mode Interferometer

2011 ◽  
Vol E94-C (5) ◽  
pp. 862-864 ◽  
Author(s):  
Zhigang ZANG ◽  
Keisuke MUKAI ◽  
Paolo NAVARETTI ◽  
Marcus DUELK ◽  
Christian VELEZ ◽  
...  
Keyword(s):  
High Power ◽  
Light Emitting Diodes ◽  
Coupling Efficiency ◽  
Light Emitting ◽  
Multi Mode
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