Scaling of Data Retention Statistics in Phase-Change Random Access Memory

2015 ◽  
Vol 36 (5) ◽  
pp. 454-456 ◽  
Author(s):  
Yongwoo Kwon ◽  
Byoungnam Park ◽  
Dae-Hwan Kang
2013 ◽  
Vol 367 ◽  
pp. 26-31
Author(s):  
Su Yuan Bai ◽  
Zhe Nan Tang ◽  
Zheng Xing Huang ◽  
Yi Feng Gu

The Ge doped Sb2Te thin films (Ge2Sb2Te5, Ge0.15Sb2Te and Ge0.61Sb2Te) were deposited by magnetron co-sputtering using Ge and Sb2Te targets. Ge doping effect on the phase transition behaviors and thermal conductivity of the composite films was investigated. Ge0.61Sb2Te thin films have higher crystallization temperature (~200°C), larger crystallization activation energy (~3.28 eV) , better data retention (~120.8 °Cfor 10 years) and lower thermal conductivity (~0.23 W/mK). Ge0.61Sb2Te thin films is considered to be a promising storage medium for phase change random access memory due to its better thermal stability and lower power consumption.


2010 ◽  
Vol 257 (3) ◽  
pp. 949-953 ◽  
Author(s):  
Changzhou Wang ◽  
Jiwei Zhai ◽  
Zhitang Song ◽  
Fei Shang ◽  
Xi Yao

2015 ◽  
Vol 120 (2) ◽  
pp. 537-542 ◽  
Author(s):  
Le Li ◽  
Sannian Song ◽  
Zhonghua Zhang ◽  
Zhitang Song ◽  
Yan Cheng ◽  
...  

2016 ◽  
Vol 120 ◽  
pp. 52-55 ◽  
Author(s):  
Le Li ◽  
Sannian Song ◽  
Zhonghua Zhang ◽  
Liangliang Chen ◽  
Zhitang Song ◽  
...  

Nanoscale ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 4678-4684
Author(s):  
Yan Cheng ◽  
Yonghui Zheng ◽  
Zhitang Song

A 3D nano-bicontinuous structure consisting of a reversible Sb2Te3 phase and amorphous Si phase is visualized. The amorphous Si frame is stable and the Sb2Te3 nano areas switch between the a- and f-structure.


2010 ◽  
Vol 13 (2) ◽  
pp. K8 ◽  
Author(s):  
Dongbok Lee ◽  
Sung-Soo Yim ◽  
Ho-Ki Lyeo ◽  
Min-Ho Kwon ◽  
Dongmin Kang ◽  
...  

2006 ◽  
Vol 45 (5A) ◽  
pp. 3955-3958 ◽  
Author(s):  
X. S. Miao ◽  
L. P. Shi ◽  
H. K. Lee ◽  
J. M. Li ◽  
R. Zhao ◽  
...  

2005 ◽  
Vol 98 (1) ◽  
pp. 013520 ◽  
Author(s):  
V. Giraud ◽  
J. Cluzel ◽  
V. Sousa ◽  
A. Jacquot ◽  
A. Dauscher ◽  
...  

2008 ◽  
Vol 1072 ◽  
Author(s):  
Jianming Li ◽  
L.P. Shi ◽  
H.X. Yang ◽  
K.G. Lim ◽  
X.S. Miao ◽  
...  

ABSTRACTThree-dimensional finite element method (FEM) is used to solve the thermal strain-stress fields of phase-change random access memory (PCRAM) cells. Simulation results show that thermal stress concentrates at the interfaces between electrodes and phase change layer and it is significantly larger than that within the phase change layer. It has been found that the peak thermal stress is linearly related to the voltage of electrical pulse in the reset process but once amorphous state is produced in the cell, a nonlinear relationship between thermal stress and electrical power exists. This paper reported the change of thermal stress during set process. It was found that the stress decreases significantly due to the amorphous active region during set processes.


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