Line bonding of wafers using transmission laser bonding technique for microsystem packaging

2006 ◽  
Author(s):  
J. Park ◽  
A.A. Tseng
Keyword(s):  
Laser Bonding ◽  
Transmission Laser Bonding ◽  
Microsystem Packaging ◽  
Bonding Technique

Direct Writing of Spot and Line Bonds for Microsystem Packaging Using Transmission Laser Bonding Technique

2007 ◽  
Vol 22 (1) ◽  
pp. 71-80 ◽  
Author(s):  
Jong-Seung Park ◽  
Han Zhu ◽  
Zhilong Zhao ◽  
Ampere A. Tseng ◽  
T. P. Chen
Keyword(s):  
Direct Writing ◽  
Laser Bonding ◽  
Transmission Laser Bonding ◽  
Microsystem Packaging ◽  
Bonding Technique

Influences of interface oxidation on transmission laser bonding of wafers for microsystem packaging

2006 ◽  
Vol 13 (1) ◽  
pp. 49-59 ◽  
Author(s):  
Ampere A. Tseng ◽  
Jong-Seung Park ◽  
George P. Vakanas ◽  
Hongtao Wu ◽  
Miroslav Raudensky ◽  
...  
Keyword(s):  
Laser Bonding ◽  
Transmission Laser Bonding ◽  
Microsystem Packaging

Chip bonding of low-melting eutectic alloys by transmitted laser radiation

2017 ◽  
Vol 6 (3-4) ◽  
Author(s):  
Christian Hoff ◽  
Arjun Venkatesh ◽  
Friedrich Schneider ◽  
Jörg Hermsdorf ◽  
Sebastian Bengsch ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Radio Frequency Identification ◽  
Bonding Process ◽  
Eutectic Alloys ◽  
Polymer Substrates ◽  
Silicon Chips ◽  
Flexible Polymer ◽  
Laser Bonding ◽  
Frequency Identification ◽  
Transmission Laser Bonding

AbstractPresent-day thermode bond systems for the assembly of radio-frequency identification (RFID) chips are mechanically inflexible, difficult to control, and will not meet future manufacturing challenges sufficiently. Chip bonding, one of the key processes in the production of integrated circuits (ICs), has a high potential for optimization with respect to process duration and process flexibility. For this purpose, the technologies used, so far, are supposed to be replaced by a transmission laser-bonding process using low-melting eutectic alloys. In this study, successful bonding investigations of mock silicon chips and of RFID chips on flexible polymer substrates are presented using the low-melting eutectic alloy, 52In48Sn, and a laser with a wavelength of 2 μm.

Transmission laser bonding of low melting eutectic alloys

2016 ◽  
Author(s):  
C. Hoff ◽  
K. Cromwell ◽  
J. Hermsdorf ◽  
M. Akin ◽  
M. C. Wurz ◽  
...  
Keyword(s):  
Eutectic Alloys ◽  
Laser Bonding ◽  
Transmission Laser Bonding

Transmission Laser Bonding Characteristics of Ti Coated Glass and PET

2012 ◽  
Vol 39 (9) ◽  
pp. 0902008
Author(s):  
刘会霞 Liu Huixia ◽  
王凯 Wang Kai ◽  
李品 Li Pin ◽  
张成 Zhang Cheng ◽  
高阳阳 Gao Yangyang ◽  
...  
Keyword(s):  
Coated Glass ◽  
Laser Bonding ◽  
Transmission Laser Bonding ◽  
Bonding Characteristics
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