A 3D-Layout Aware Binding Algorithm for High-Level Synthesis of Three-Dimensional Integrated Circuits
2016 ◽
pp. 219-265
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2016 ◽
Vol 40
(3)
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pp. 2274-2290
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Keyword(s):
1993 ◽
Vol 20
(8)
◽
pp. 845-856
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2011 ◽
Vol 20
(05)
◽
pp. 915-925
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Keyword(s):
2015 ◽
Vol 5
(2)
◽
pp. 790-794