Dielectric strength testing: Transient over-voltage withstand testing

2015 ◽  
Author(s):  
Richard Nute
Keyword(s):  
Dielectric Strength ◽  
Strength Testing

Clinical Update: Strength Testing–Grip and Pinch

1999 ◽  
Vol 4 (3) ◽  
pp. 9-10
Author(s):  
Margit L. Bleeker ◽  
Sania Amr
Keyword(s):  
Strength Testing

Assessment of Reliability of cap layers used in Cu-Black DiamondTM Interconnects

2003 ◽  
Vol 766 ◽  
Author(s):  
Ahila Krishnamoorthy ◽  
N.Y. Huang ◽  
Shu-Yunn Chong
Keyword(s):  
Dielectric Layer ◽  
Dielectric Breakdown ◽  
Copper Ions ◽  
Dielectric Strength ◽  
Time Dependent ◽  
Breakdown Field ◽  
Field Range ◽  
Time Dependent Dielectric Breakdown ◽  
Voltage Ramp ◽  
Low K

AbstractBlack DiamondTM. (BD) is one of the primary candidates for use in copper-low k integration. Although BD is SiO2 based, it is vastly different from oxide in terms of dielectric strength and reliability. One of the main reliability concerns is the drift of copper ions under electric field to the surrounding dielectric layer and this is evaluated by voltage ramp (V-ramp) and time dependent dielectric breakdown (TDDB). Metal 1 and Metal 2 intralevel comb structures with different metal widths and spaces were chosen for dielectric breakdown studies. Breakdown field of individual test structures were obtained from V-ramp tests in the temperature range of 30 to 150°C. TDDB was performed in the field range 0.5 – 2 MV/cm. From the leakage between combs at the same level (either metal 1 or metal 2) Cu drift through SiC/BD or SiN/BD interface was characterized. It was found that Cu/barrier and barrier/low k interfaces functioned as easy paths for copper drift thereby shorting the lines. Cu/SiC was found to provide a better interface than Cu/SiN.

A Study of Some Mechanical and Physical Properties for Palm Fiber/Polyester Composite

2020 ◽  
Vol 38 (3B) ◽  
pp. 104-114
Author(s):  
Samah M. Hussein
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Date Palm ◽  
Volume Fraction ◽  
Unsaturated Polyester ◽  
Dielectric Strength ◽  
Palm Fiber ◽  
Mechanical And Physical Properties ◽  
Polyester Composite

This research has been done by reinforcing the matrix (unsaturated polyester) resin with natural material (date palm fiber (DPF)). The fibers were exposure to alkali treatment before reinforcement. The samples have been prepared by using hand lay-up technique with fiber volume fraction of (10%, 20% and 30%). After preparation of the mechanical and physical properties have been studied such as, compression, flexural, impact strength, thermal conductivity, Dielectric constant and dielectric strength. The polyester composite reinforced with date palm fiber at volume fraction (10% and 20%) has good mechanical properties rather than pure unsaturated polyester material, while the composite reinforced with 30% Vf present poor mechanical properties. Thermal conductivity results indicated insulator composite behavior. The effect of present fiber polar group induces of decreasing in dielectric strength, and increasing dielectric constant. The reinforcement composite 20% Vf showed the best results in mechanical, thermal and electrical properties.

Crystallization effect on the dielectric strength of fluorinated parylene at high temperature

2012 ◽  
Vol 15 (2-3) ◽  
pp. 157-168 ◽  
Author(s):  
Mireille Bechara ◽  
Rabih Khazaka ◽  
Sombel Diaham ◽  
Marie-Laure Locatelli ◽  
Pierre Bidan
Keyword(s):  
High Temperature ◽  
Dielectric Strength ◽  
Crystallization Effect
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