scholarly journals Low Cost FPGA Implementation of a SPI over High Speed Optical SerDes

2018 ◽  
Author(s):  
Saket Srivastava ◽  
Peter Hobden
Keyword(s):  
High Speed ◽  
Low Cost ◽  
Fpga Implementation

AES-128 Cipher. High Speed, Low Cost FPGA Implementation

2007 ◽  
Author(s):  
Monica Liberatori ◽  
Fernando Otero ◽  
J. C. Bonadero ◽  
Jorge Castineira
Keyword(s):  
High Speed ◽  
Low Cost ◽  
Fpga Implementation

Development and production experience of the multilayer curtain-coated linerboard of Ji’an PM No. 3,

TAPPI Journal ◽  
2014 ◽  
Vol 13 (2) ◽  
pp. 17-25
Author(s):  
JUNMING SHU ◽  
ARTHAS YANG ◽  
PEKKA SALMINEN ◽  
HENRI VAITTINEN
Keyword(s):  
Titanium Dioxide ◽  
High Speed ◽  
Food Packaging ◽  
Production Efficiency ◽  
Positive Impact ◽  
Low Cost ◽  
Board Structure ◽  
Flexographic Printing ◽  
Curtain Coating ◽  
Coating Formulations

The Ji’an PM No. 3 is the first linerboard machine in China to use multilayer curtain coating technology. Since successful startup at the end of 2011, further development has been carried out to optimize running conditions, coating formulations, and the base paper to provide a product with satisfactory quality and lower cost to manufacture. The key challenges include designing the base board structure for the desired mechanical strength, designing the surface properties for subsequent coating operations, optimizing the high-speed running of the curtain coater to enhance production efficiency, minimizing the amount of titanium dioxide in the coating color, and balancing the coated board properties to make them suitable for both offset and flexographic printing. The pilot and mill scale results show that curtain coating has a major positive impact on brightness, while smoothness is improved mainly by the blade coating and calendering conditions. Optimization of base board properties and the blade + curtain + blade concept has resulted in the successful use of 100% recycled fiber to produce base board. The optical, mechanical, and printability properties of the final coated board meet market requirements for both offset and flexographic printing. Machine runnability is excellent at the current speed of 1000 m/min, and titanium dioxide has been eliminated in the coating formulations without affecting the coating coverage. A significant improvement in the total cost of coated white liner production has been achieved, compared to the conventional concept of using virgin fiber in the top ply. Future development will focus on combining low cost with further quality improvements to make linerboard suitable for a wider range of end-use applications, including frozen-food packaging and folding boxboard.

Low-Cost High-Speed Techniques for Real-Time Simulation of Power Electronic Systems

2007 ◽  
Author(s):  
R. E. Crosbie ◽  
J. J. Zenor ◽  
R. Bednar ◽  
D. Word ◽  
N. G. Hingorani
Keyword(s):  
Real Time ◽  
High Speed ◽  
Low Cost ◽  
Electronic Systems ◽  
Power Electronic ◽  
Real Time Simulation ◽  
Time Simulation

High-speed electro-optic switch using buried electrode structure in polymer Mach–Zehnder waveguide

2016 ◽  
Vol 30 (06) ◽  
pp. 1650063 ◽  
Author(s):  
Jingwen Sun ◽  
Jian Sun ◽  
Yunji Yi ◽  
Lucheng Qv ◽  
Shiqi Sun ◽  
...  
Keyword(s):  
Insertion Loss ◽  
Rise Time ◽  
High Speed ◽  
Low Cost ◽  
Characteristic Parameters ◽  
Electrode Structure ◽  
Processing Cost ◽  
Electro Optic ◽  
Disperse Red 1 ◽  
Excellent Photostability

A low-cost and high-speed electro-optic (EO) switch using the guest–host EO material Disperse Red 1/Polymethyl Methacrylate (DR1/PMMA) was designed and fabricated. The DR1/PMMA material presented a low processing cost, an excellent photostability and a large EO coefficient of 13.1 pm/V. To improve the performance of the switch, the in-plane buried electrode structure was introduced in the polymer Mach–Zehnder waveguide to improve the poling and modulating efficiency. The characteristic parameters of the waveguide and the electrodes were carefully designed and the fabrication process was strictly controlled. Under 1550 nm, the insertion loss of the device was 12.7 dB. The measured switching rise time and fall time of the switch were 50.00 ns and 54.29 ns, respectively.

scholarly journals Towards a Glass New World: The Role of Ion-Exchange in Modern Technology

2021 ◽  
Vol 11 (10) ◽  
pp. 4610
Author(s):  
Simone Berneschi ◽  
Giancarlo C. Righini ◽  
Stefano Pelli
Keyword(s):  
Ion Exchange ◽  
Communication Networks ◽  
High Speed ◽  
High Performance ◽  
Low Cost ◽  
Modern Technology ◽  
Historical Background ◽  
Wide Range ◽  
Happy Marriage

Glasses, in their different forms and compositions, have special properties that are not found in other materials. The combination of transparency and hardness at room temperature, combined with a suitable mechanical strength and excellent chemical durability, makes this material indispensable for many applications in different technological fields (as, for instance, the optical fibres which constitute the physical carrier for high-speed communication networks as well as the transducer for a wide range of high-performance sensors). For its part, ion-exchange from molten salts is a well-established, low-cost technology capable of modifying the chemical-physical properties of glass. The synergy between ion-exchange and glass has always been a happy marriage, from its ancient historical background for the realisation of wonderful artefacts, to the discovery of novel and fascinating solutions for modern technology (e.g., integrated optics). Getting inspiration from some hot topics related to the application context of this technique, the goal of this critical review is to show how ion-exchange in glass, far from being an obsolete process, can still have an important impact in everyday life, both at a merely commercial level as well as at that of frontier research.

scholarly journals In-Plane Monolithic Integration of Scaled III-V Photonic Devices

2021 ◽  
Vol 11 (4) ◽  
pp. 1887
Author(s):  
Markus Scherrer ◽  
Noelia Vico Triviño ◽  
Svenja Mauthe ◽  
Preksha Tiwari ◽  
Heinz Schmid ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
High Speed ◽  
Low Cost ◽  
Photonic Devices ◽  
Monolithic Integration ◽  
Light Emitters ◽  
Fully Integrated ◽  
Large Lattice ◽  
Hybrid Iii ◽  
Gain Material

It is a long-standing goal to leverage silicon photonics through the combination of a low-cost advanced silicon platform with III-V-based active gain material. The monolithic integration of the III-V material is ultimately desirable for scalable integrated circuits but inherently challenging due to the large lattice and thermal mismatch with Si. Here, we briefly review different approaches to monolithic III-V integration while focusing on discussing the results achieved using an integration technique called template-assisted selective epitaxy (TASE), which provides some unique opportunities compared to existing state-of-the-art approaches. This method relies on the selective replacement of a prepatterned silicon structure with III-V material and thereby achieves the self-aligned in-plane monolithic integration of III-Vs on silicon. In our group, we have realized several embodiments of TASE for different applications; here, we will focus specifically on in-plane integrated photonic structures due to the ease with which these can be coupled to SOI waveguides and the inherent in-plane doping orientation, which is beneficial to waveguide-coupled architectures. In particular, we will discuss light emitters based on hybrid III-V/Si photonic crystal structures and high-speed InGaAs detectors, both covering the entire telecom wavelength spectral range. This opens a new path towards the realization of fully integrated, densely packed, and scalable photonic integrated circuits.

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