Compact and low-loss ESD protection design for V-band RF applications in a 65-nm CMOS technology

Author(s):  
Li-Wei Chu ◽  
Chun-Yu Lin ◽  
Shiang-Yu Tsai ◽  
Ming-Dou Ker ◽  
Ming-Hsiang Song ◽  
...  
2017 ◽  
Vol 14 (5) ◽  
pp. 20170066-20170066 ◽  
Author(s):  
Farooq A. Khaleel ◽  
Mohammed Nadhim Abbas

2004 ◽  
Vol 35 (1) ◽  
pp. 404
Author(s):  
Ming-Dou Ker ◽  
Shih-Hung Chen ◽  
Tang-Kui Tseng

Author(s):  
Sungah Lee ◽  
Chenglin Cui ◽  
Seong-Kyun Kim ◽  
Byung-Sung Kim

2016 ◽  
Vol 26 (02) ◽  
pp. 1750023
Author(s):  
Minoh Son ◽  
Changkun Park

In this study, we propose cell-based diodes which are laid out with a zigzag shape as electrostatic discharge (ESD) protection elements to enhance the ESD survival level of the diodes. Generally, diodes are regarded as simple ESD protection devices in integrated circuits. During ESD events, the P–N junction of the ESD diode acts as a thermal source. In this study, we investigate a distributed layout method which relies on a cell-based ESD diode to prevent an excessive increase in the temperature at the P–N junction. However, although the distributed layout enhances the ESD survival levels of the ESD diode, the required area increases compared that of a typical layout. Thus, we propose a zigzag layout technique for the cell-based diode to reduce the area and obtain a high ESD survival level. To verify the feasibility of the zigzag layout techniques for cell-based diodes, we designed ESD diodes using 110[Formula: see text]nm RF CMOS technology. The experimental results successfully demonstrate the feasibility of the proposed method.


2011 ◽  
Vol 2011 (CICMT) ◽  
pp. 000050-000053
Author(s):  
Alexander Schulz ◽  
Sven Rentsch ◽  
Lei Xia ◽  
Robert Mueller ◽  
Jens Mueller

This paper presents a low loss fully embedded bandpass filter (BPF) using low temperature co-fired ceramic (LTCC) for multilayer System-in-Package (SiP) and Multi-Chip-Module (MCM) applications, e.g. wireless applications for the unlicensed 60 GHz band. The measured insertion loss was 1.5 dB at the center frequency 58 GHz, and a return loss of less than −10 dB was achieved, including two grounded coplanar waveguide transmission line (CPWg) to stripline transitions. The four layers BPF has a 3 dB bandwidth of about 11 GHz which supplies e.g. broadband and high data rate applications. The whole BPF requires a substrate area of 5.6 × 2.1 × 0.42 mm3 with transitions and a shielding via fence. This BPF suits well for V-band applications in a LTCC package because of the compact dimensions and the good performance.


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