Generation and Tracking of Optical Signals inside the IC to Improve Device Security and Failure Analysis

2019 ◽  
Author(s):  
Elham Amini ◽  
Norbert Herfurth ◽  
Anne Beyreuther ◽  
Jean-Pierre Seifert ◽  
Christian Boit
Keyword(s):  
Failure Analysis ◽  
Optical Signals ◽  
Improve Device

Failure Analysis of Polysilicon Micromirror Arrays

2002 ◽  
Author(s):  
Jeremy A. Walraven ◽  
Edward I. Cole ◽  
Danelle M. Tanner ◽  
Seethambal S. Mani ◽  
Ernest J. Garcia ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Optical Switching ◽  
Failure Modes ◽  
Reliability Testing ◽  
Processing Technologies ◽  
Optical Signals ◽  
Home Entertainment ◽  
Micromirror Arrays ◽  
Spectrometer System ◽  
Potential Use

Abstract Surface micromachined micromirror technologies are being employed for various commercial and government applications. One application of micromirror technologies in the commercial sector can be found in Digital Light Projection (DLP™) systems used for theater and home entertainment centers. DLP™ systems developed by Texas Instruments uses DMD™ technology (Digital Mirror Device), an array of micromirrors, to project light onto a screen [1]. This technology is also used by Infocus™ projection systems and widescreen tabletop televisions [2]. Here, the micromirrors act as individual pixels, reflecting light onto the screen with high ¡§digital¡¨ resolution. The most recent application of surface micromachined micromirror technology is optical switching [3], which uses micromirrors to switch optical signals from fiber to fiber for lightwave telecommunications [4]. Companies such as Lucent have fabricated entire optical micromirror switching systems based on their Microstar™ technology [5]. For government applications, surface micromachined micromirror arrays have been developed for potential use in a spectrometer system planned for NASA's Next Generation Space Telescope (NGST) [6]. Various processing technologies are used to fabricate surface micromachined micromirrors. The micromirror arrays developed by TI and Lucent [1,4] uses metal for their structural and reflective components. Micromirrors fabricated at Sandia National Laboratories use the SUMMiT™ (Sandia's Ultra-planar MEMS Multi-level Technology) process with metal deposited on the surface of mechanical polysilicon components to reflect light. Optical micromirror arrays designed and fabricated at Sandia for potential use in the NGST have undergone reliability testing and failure analysis. This paper will discuss the failure modes found in these micromirrors after reliability testing. Suggestions and corrective actions for improvements in device performance will also be discussed.

Failure Analysis With the Scanning Electron Microscope

1972 ◽  
Vol 30 ◽  
pp. 482-483
Author(s):  
John R. Devaney
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
High Reliability ◽  
Military Applications ◽  
Small Structure ◽  
Useful Life ◽  
Insight Into ◽  
Scanning Electron

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.

Using the scanning electron microscope for failure analysis of high density magnetic media

1987 ◽  
Vol 45 ◽  
pp. 392-393
Author(s):  
Evelyn R. Ackerman ◽  
Gary D. Burnett
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Failure Analysis ◽  
High Density ◽  
Magnetic Media ◽  
Specific Data ◽  
Retrieval Systems ◽  
Operating Environments ◽  
The Media ◽  
Scanning Electron

Advancements in state of the art high density Head/Disk retrieval systems has increased the demand for sophisticated failure analysis methods. From 1968 to 1974 the emphasis was on the number of tracks per inch. (TPI) ranging from 100 to 400 as summarized in Table 1. This emphasis shifted with the increase in densities to include the number of bits per inch (BPI). A bit is formed by magnetizing the Fe203 particles of the media in one direction and allowing magnetic heads to recognize specific data patterns. From 1977 to 1986 the tracks per inch increased from 470 to 1400 corresponding to an increase from 6300 to 10,800 bits per inch respectively. Due to the reduction in the bit and track sizes, build and operating environments of systems have become critical factors in media reliability.Using the Ferrofluid pattern developing technique, the scanning electron microscope can be a valuable diagnostic tool in the examination of failure sites on disks.

Receiving phase-keyed optical signals via quantum detector

1999 ◽  
Vol 5 (5-6) ◽  
pp. 71-76
Author(s):  
A.S. Mazmanishvili ◽  
◽  
Keyword(s):  
Optical Signals ◽  
Quantum Detector
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