Prevent Auger Analysis Misjudgment on Bond Pad Surface Element Concentration in the SPC Method

2018 ◽  
Author(s):  
Sheng-Min Chen ◽  
Chiu-E Tseng ◽  
Kuan-Chieh Huang
Keyword(s):  
Element Concentration ◽  
Surface Element ◽  
Auger Analysis

Changes in corneocyte element concentrations occur in skin inner stratum corneum

1990 ◽  
Vol 48 (2) ◽  
pp. 146-147
Author(s):  
R. R. Warner
Keyword(s):  
Stratum Corneum ◽  
Human Skin ◽  
Element Concentration ◽  
Skin Barrier ◽  
Barrier Properties ◽  
Brick Wall ◽  
Inorganic Elements ◽  
Dry Skin ◽  
Skin Biopsies ◽  
Intercellular Lipid

Keratinocytes undergo maturation during their transit through the viable layers of skin, and then abruptly transform into flattened, anuclear corneocytes that constitute the cellular component of the skin barrier, the stratum corneum (SC). The SC is generally considered to be homogeneous in its structure and barrier properties, and is often shown schematically as a featureless brick wall, the “bricks” being the corneocytes, the “mortar” being intercellular lipid. Previously we showed the outer SC was not homogeneous in its composition, but contained steep gradients of the physiological inorganic elements Na, K and Cl, likely originating from sweat salts. Here we show the innermost corneocytes in human skin are also heterogeneous in composition, undergoing systematic changes in intracellular element concentration during transit into the interior of the SC.Human skin biopsies were taken from the lower leg of individuals with both “good” and “dry” skin and plunge-frozen in a stirred, cooled isopentane/propane mixture.

Non-Visible Defect Analysis of OTP Device

2011 ◽  
Author(s):  
C.Q. Chen ◽  
G.B. Ang ◽  
Z.X. Xing ◽  
Y.N. Hua ◽  
Z.Q. Mo ◽  
...  
Keyword(s):  
Trap Center ◽  
Data Retention ◽  
Auger Analysis ◽  
Cross Sectional ◽  
Critical Dimensions ◽  
Charge Trap ◽  
Root Cause ◽  
Transmission Electron ◽  
Electrical Analysis ◽  
Visible Defect

Abstract Several product lots were found to suffer from data retention failures in OTP (one time program) devices. PFA (physical failure analysis) was performed on these devices, but nothing abnormal was observed. Cross-sectional TEM (transmission electron microscopy) revealed no physical defects or abnormal CDs (critical dimensions). In order to isolate the failed layer or location, electrical analysis was conducted. Several electrical simulation experiments, designed to test the data retention properties of OTP devices, were preformed. Meilke's method [1] was also used to differentiate between mobile ion contamination and charge trap centers. Besides Meilke's method, a new electrical analysis method was used to verify the analysis results. The results of our analysis suggests that SiN charge trap centers are the root cause for the data retention failures, and the ratio of Si/N is the key to charge trap center formation. Auger analysis was used to physically check the Si/N ratio of OTP devices. The results support our hypothesis. Subsequent DOE (Design Of Experiment) experiments also confirm our analysis results. Key Words: OTP, data retention, Non-visible defect, AFP, charge trap center, mobile ion.

The Investigation of Fluorine Induced Novel Probe Marker Discoloration

2018 ◽  
Author(s):  
W.F. Hsieh ◽  
Henry Lin ◽  
Vincent Chen ◽  
Irene Ou ◽  
Y.S. Lou
Keyword(s):  
Electric Field ◽  
Dark Field ◽  
Inspection System ◽  
Automated Inspection ◽  
Stress Tests ◽  
Auger Analysis ◽  
Corrosion Film ◽  
Scan Data ◽  
Thickness Variations ◽  
One Year

Abstract This paper describes the investigation of donut-shaped probe marker discolorations found on Al bondpads. Based on SEM/EDS, TEM/EELS, and Auger analysis, the corrosion product is a combination of aluminum, fluorine, and oxygen, implying that the discolorations are due to the presence of fluorine. Highly accelerated stress tests simulating one year of storage in air resulted in no new or worsening discolorations in the affected chips. In order to identify the exact cause of the fluorine-induced corrosion, the authors developed an automated inspection system that scans an entire wafer, recording and quantifying image contrast and brightness variations associated with discolorations. Dark field TEM images reveal thickness variations of up to 5 nm in the corrosion film, and EELS line scan data show the corresponding compositional distributions. The findings indicate that fluorine-containing gases used in upstream processes leave residues behind that are driven in to the Al bondpads by probe-tip forces and activated by the electric field generated during CP testing. The knowledge acquired has proven helpful in managing the problem.

Studies and Application of Auger Monitoring System for Quality Control and Assurance of Al Bondpads

2016 ◽  
Author(s):  
Hua Younan
Keyword(s):  
Quality Control ◽  
Sample Preparation ◽  
Monitoring System ◽  
Failure Mechanisms ◽  
Wafer Fabrication ◽  
Contamination Level ◽  
Auger Analysis ◽  
Low Level ◽  
Monitoring Frequency ◽  
Control Procedures

Abstract In wafer fabrication (Fab), Fluorine (F) based gases are used for Al bondpad opening process. Thus, even on a regular Al bondpad, there exists a low level of F contamination. However, the F level has to be controlled at a lower level. If the F level is higher than the control/spec limits, it could cause F-induced corrosion and Al-F defects, resulting in pad discoloration and NSOP problems. In our previous studies [1-5], the theories, characteristics, chemical and physical failure mechanisms and the root causes of the F-induced corrosion and Al-F defects on Al bondpads have been studied. In this paper, we further study F-induced corrosion and propose to establish an Auger monitoring system so as to monitor the F contamination level on Al bondpads in wafer fabrication. Auger monitoring frequency, sample preparation, wafer life, Auger analysis points, control/spec limits and OOC/OOS quality control procedures are also discussed.

scholarly journals A New Approach to Quantifying Bioaccumulation of Elements in Biological Processes

Biology ◽  
2021 ◽  
Vol 10 (4) ◽  
pp. 345
Author(s):  
Kinga Proc ◽  
Piotr Bulak ◽  
Monika Kaczor ◽  
Andrzej Bieganowski
Keyword(s):  
Element Concentration ◽  
Experimental System ◽  
Small Scale ◽  
New Approach ◽  
Realistic Situation ◽  
Initial Load ◽  
Test Elements ◽  
Organism Growth ◽  
Bioaccumulation Index ◽  
Phosphorous Concentration

Bioaccumulation, expressed as the bioaccumulation factor (BAF), is a phenomenon widely investigated in the natural environment and at laboratory scale. However, the BAF is more suitable for ecological studies, while in small-scale experiments it has limitations, which are discussed in this article. We propose a new indicator, the bioaccumulation index (BAI). The BAI takes into account the initial load of test elements, which are added to the experimental system together with the biomass of the organism. This offers the opportunity to explore the phenomena related to the bioaccumulation and, contrary to the BAF, can also reveal the dilution of element concentration in the organism. The BAF can overestimate bioaccumulation, and in an extremal situation, when the dilution of element concentration during organism growth occurs, the BAF may produce completely opposite results to the BAI. In one of the examples presented in this work (Tschirner and Simon, 2015), the concentration of phosphorous in fly larvae was lower after the experiment than in the younger larvae before the experiment. Because the phosphorous concentration in the feed was low, the BAF indicated a high bioaccumulation of this element (BAF = 14.85). In contrast, the BAI showed element dilution, which is a more realistic situation (BAI = −0.32). By taking more data into account, the BAI seems to be more valid in determining bioaccumulation, especially in the context of entomoremediation research.

Auger analysis of thick silver films and of silver layers grown on copper

1981 ◽  
Vol 82 (2) ◽  
pp. 165-177 ◽  
Author(s):  
Y. Namba ◽  
R.W. Vook
Keyword(s):  
Auger Analysis ◽  
Silver Films
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