Analysis of Delta Iddq Soft Fails on Pass Chips

2006 ◽  
Author(s):  
I. Österreicher ◽  
S. Eckl ◽  
B. Tippelt ◽  
S. Döring ◽  
R. Prang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Failure Mode ◽  
Photon Emission ◽  
Complete Analysis ◽  
Functional Tests ◽  
Analysis Techniques ◽  
Atomic Force ◽  
Current Consumption ◽  
Emission Microscopy ◽  
Failure Localization

Abstract Depending on the field of application the ICs have to meet requirements that differ strongly from product to product, although they may be manufactured with similar technologies. In this paper a study of a failure mode is presented that occurs on chips which have passed all functional tests. Small differences in current consumption depending on the state of an applied pattern (delta Iddq measurement) are analyzed, although these differences are clearly within the usual specs. The challenge to apply the existing failure analysis techniques to these new fail modes is explained. The complete analysis flow from electrical test and Global Failure Localization to visualization is shown. The failure is localized by means of photon emission microscopy, further analyzed by Atomic Force Probing, and then visualized by SEM and TEM imaging.

Inter Layer Dielectric Defect Induced High Contact Resistance

2010 ◽  
Author(s):  
Re-Long Chiu ◽  
Jason Higgins ◽  
Toby Kinder ◽  
Juha Tyni ◽  
Sharon Ying ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Failure Analysis ◽  
Failure Mode ◽  
Phosphorus Content ◽  
Moisture Absorption ◽  
Thermal Processes ◽  
Analysis Methods ◽  
Low Phosphorus

Abstract High contact resistance can be caused by moisture absorption in low phosphorus content BPTEOS. Moisture diffused through the TiN glue layer is absorbed by the BPTEOS during subsequent thermal processes resulting in increased contact resistance. This failure mode was studied by combining different failure analysis methods and was confirmed by duplication on experimental wafers.

scholarly journals Parameters Assessment of the FMEA Method by Means of Fuzzy Logic

2018 ◽  
Vol 2 (Special edition 2) ◽  
pp. 123-132
Author(s):  
Jasminka Bonato ◽  
Martina Badurina ◽  
Julijan Dobrinić
Keyword(s):  
Fuzzy Logic ◽  
Failure Analysis ◽  
Failure Mode ◽  
Mathematical Function ◽  
Analysis Method ◽  
Effect Analysis ◽  
New Approach ◽  
System Failures ◽  
Numerical Indicator ◽  
Fmea Method

The paper aims at presenting the FMEA method based on the fuzzy technique, representing a new approach to the failure analysis and its effects on the observed system. The FMEA (Failure Mode and Effect Analysis) method has assigned the risks a coefficient i.e. a numerical indicator that very clearly defines the degree of risk. The risk is calculated as a mathematical function of RPN which depends on the effects S, probability O that some case will lead to a failure and to a probability that a failure D can not be detected before its effects are realized. RPN = S O D. The FMEA method, based on the fuzzy logic, makes a more reliable evaluation of the observed system failures possible.

Study of Thermal Cycle Induced CPI Failure Mode in a Lidded FC-BGA Package

2019 ◽  
Author(s):  
Muhammad Monzur Morshed ◽  
Esther Chen ◽  
Anita Madan
Keyword(s):  
Failure Analysis ◽  
Failure Mode ◽  
Failure Modes ◽  
Material Selection ◽  
Interfacial Stress ◽  
Analysis Techniques ◽  
Bga Package ◽  
Induced Defects ◽  
Fatigue Failures ◽  
Insight Into

Abstract Dissimilarities of thermal expansion coefficient between chip and package materials results in stress and strain at the solder interconnect leading to fatigue failures. Underfill is used between chip and package to reduce the interfacial stress and hence increase reliability. In this work, four flipchip package test vehicles underwent thermal cycling to accelerate the stress and were investigated systematically with different failure analysis techniques to study their failure modes. The prevalent failure mode was observed to be at the corner area between the chip and package using different advanced failure analysis techniques. This work demonstrates the technical complexity of analyzing stress induced defects and provides insight into CPI-based material selection.

Improved SRAM 6T Bit Cell Failure Analysis Using MCSpice Bit Cell Defect Modeling

2003 ◽  
Author(s):  
Randal Mulder ◽  
Sam Subramanian ◽  
Ed Widener ◽  
Tony Chrastecky
Keyword(s):  
Failure Analysis ◽  
Success Rate ◽  
Case Studies ◽  
Failure Mode ◽  
Failure Mechanisms ◽  
Physical Analysis ◽  
Certification Programs ◽  
Current Voltage ◽  
Electrical Analysis ◽  
Cell Defect

Abstract Single bit failures are the dominant failure mode for SRAM 6T bit cell memory devices. The analysis of failing single bits is aided by the fact that the mechanism is localized to the failing 6T bit cell. After electrically analyzing numerous failing bits, it was observed that failing bit cells were consistently producing specific electrical signatures (current-voltage curves). To help identify subtle bit cell failure mechanisms, this paper discusses an MCSpice program which was needed to simulate a 6T SRAM bit cell and the electrical analysis. It presents four case studies that show how MCSpice modeling of defective 6T SRAM bit cells was successfully used to identify subtle defect types (opens or shorts) and locations within the failing cell. The use of an MCSpice simulation and the appropriate physical analysis of defective bit cells resulted in a >90% success rate for finding failure mechanisms on yield and process certification programs.

Analisis Pengaruh Perubahan Beban Terhadap Kondisi Refraktori Boiler Pembangkit Listrik Tenaga Uap Punagaya

2021 ◽  
Vol 6 (1) ◽  
pp. 68
Author(s):  
Rishan Karangan ◽  
Mustarum Musaruddin ◽  
Agustinus Lolok
Keyword(s):  
Failure Analysis ◽  
Failure Mode ◽  
Flue Gas ◽  
Crushing Strength ◽  
Effect Analysis ◽  
Root Cause ◽  
Cold Crushing Strength ◽  
Root Cause Failure Analysis

Penelitian ini menganalisa kerusakan yang terjadi pada Refraktori Boiler Pembangkit Listrik Tenaga Uap di PLTU Punagaya. Tujuan penelitian ini adalah untuk mengetahui mengapa pola pembebanan unit yang berubah-ubah dapat menyebabkan kerusakan pada refractory boiler. Metode yang digunakan pada penelitian ini ialah Failure Mode and Effect Analysis (FMEA) dan Root Cause Failure Analysis (RCFA) serta pembuktian perhitungan Cold Crushing Strength (CCS). Hasil penelitian menunjukan bahwa data kecepatan aliran flue gas masuk cyclone yang melebihi spesifikasi (<35 m/s) dan data kekuatan CCS refractory aktual yang menunjukan nilai 43 MPa menjadi penyebab dari pembebanan yang tidak stabil yang merupakan salah satu faktor penyebab dari kerusakan refractory boiler. 

Fluorosilicate Glass (FSG) Outgassing Induced Aluminum Bond Pad Corrosion during Post-Fab Wafer Storage

2012 ◽  
Author(s):  
Hua Younan ◽  
Nistala Ramesh Rao ◽  
Chen Shuting
Keyword(s):  
Failure Analysis ◽  
Failure Mode ◽  
Subsequent Removal ◽  
Left Behind ◽  
Gas Chemistry ◽  
Type Of Failure

Abstract A case study of Fluorine (F)-outgassing is presented in this paper that caused the corrosion of Aluminum bond pad. It will be shown that the source of F-contamination is not the typical residue left behind after the passivation etch with Fluorine-based gas chemistry and the subsequent removal of the etch polymer generated with solvent (chemical) clean. Rather, it is introduced as a result of F-outgas over a period of time from the intermetallic dielectric (IMD) film, fluorosilicate glass (FSG), during the post-fab wafer storage. The methodology used in our failure analysis (FA) lab to identify and characterize this type of failure mode is presented in the paper.

Study on Mechanical Mode of Frame Column Underpinning Joint

2011 ◽  
Vol 255-260 ◽  
pp. 624-628 ◽  
Author(s):  
Ai Hua Du ◽  
Xin Zhang
Keyword(s):  
Failure Mode ◽  
Orthogonal Experiment ◽  
Concrete Strength ◽  
Joint Stress ◽  
Shear Span ◽  
Steel Bar ◽  
Moving Beam ◽  
Before And After ◽  
Key Factor ◽  
Two Stages

An orthogonal experiment of sixteen frame column underpinning joints was introduced, experiment was designed by a normal table of “five-factor and four-level”, five factors referred to ratio of shear-span of moving beam, ratio of underpinning beam stirrup steel bar, underpinning beam longitudinal steel bar parameter, concrete strength, and planted reinforcement, in addition every factor had four experiment datum. Then, the underpinning joint stress mechanism and failure mode was determined, based on the experiment the conclusion was drawn that the ratio of shear-span of moving beam was the key factor to the joint failure mode; and the failure course was divided two stages which were before and after interface punching slip by theoretical analysis, for the phase before interface punching slip a space and plane “tension-bar-arch” mechanical model was presented for the underpinning joint, then mechanic analysis was put into the models, and two series theoretical calculation correlations for this underpinning joint were obtained, by comparison with the test result one model and one formula was choose, this theoretical results were agreement with experiments results.

Qualification of SiP Products: Quasi-Static Cyclic Mechanical Bending

2007 ◽  
Author(s):  
D. Farley ◽  
Y. Zhou ◽  
A. Dasgupta ◽  
J. F. J. Caers ◽  
J. W. C. de Vries
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Failure Mode ◽  
Stress Testing ◽  
Flip Chip ◽  
Failure Mechanisms ◽  
Physics Of Failure ◽  
Static Mechanical ◽  
Mechanical Bending ◽  
Solder Joint Fatigue

An LGA (Land Grid Array) laminate-based epoxy-molded RF SiP (system-in-package) containing four wirebonded and three flip-chip dice is qualified for quasi-static mechanical flexure using a PoF (Physics-of-Failure) approach. The process includes: design and execution of accelerated stress testing; failure analysis to identify the failure mode and mechanism; and mechanistic simulations to assess acceleration factors for extrapolation of the failures to field environments for selected failure mechanisms. Illustrative qualification results are presented for solder joint fatigue.

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