High resolution 3D X-ray microscopy for streamlined failure analysis workflow

Author(s):  
C. Y. Liu ◽  
P. S. Kuo ◽  
C. H. Chu ◽  
Allen Gu ◽  
Jin Yoon
Author(s):  
Tyler Pendleton ◽  
Luke Hunter ◽  
S. H. Lau

Abstract Conventional microCTs or 3D x-ray upgrades from existing 2D x-ray systems have two major drawbacks when they are used for failure analysis of advanced packages: Insufficient resolution to image small (1 to 5 microns) materials and the lack of imaging contrast to visualize cracks, whiskers, and defects within low Z materials. This paper discusses some of the failure analysis (FA) case studies of wireless modules using a high resolution micro x-ray CT (XCT). These examples show the value of high resolution XCT as a novel approach to some common package level defects, including some interesting case examples, where failure mechanisms have been uncovered which could not have been done, using conventional means. The non-invasive FA technique for RF modules technique has been shown to dramatically improve the FA engineers' chances of identifying defects over conventional 2D x-rays and avoid the need for physical and tedious cross sectioning of these devices.


Author(s):  
John Lindsay ◽  
James Sagar ◽  
James Holland ◽  
Jenny Goulden

Abstract Device failure analysis typically requires multiple systems for fault identification, preparation and analysis. In this paper we discuss the practicalities and limits of using a single FIBSEM system for a complete failure analysis workflow. The theoretical requirements of using a nanomanipulator for both lamella lift out and electrical testing are discussed and the current capabilities of windowless X-rays detectors for chemical analysis demonstrated. When the required resolution for failure analysis exceed the limits of a FIBSEM and TEM is required, the combination of the nanomanipulator and X-ray detector for advanced lift out and thickness controlled thinning techniques are demonstrated to prepare exceptional quality lamellae.


Author(s):  
Naoki Seimiya ◽  
Takuhei Watanabe ◽  
Takashi Ichinomiya

Abstract We developed the non-destructive failure analysis method that is combination of Lock-in thermography (LIT) and high resolution 3D oblique CT. It made possible to complete the total analysis efficiently, because we can distinguish the type of failure by this non-destructive method.


Author(s):  
David Scott ◽  
Fred Duewer ◽  
Shashi Kamath ◽  
Alan Lyon ◽  
David Trapp ◽  
...  

Abstract X-ray microscopy has the potential to solve many failure analysis problems associated with advanced package technologies because of its ability to non-destructively inspect advanced multi-layer package designs. In addition, x-ray imaging has the potential to perform fault isolation in 3D using well-established tomographic reconstruction methods. The ability to perform high-resolution, artifact free tomographic reconstructions will be critical to the Advanced Packaging Failure Analysis community. This article discusses the requirements for a high-resolution, three-dimensional tomographic imaging microscope and shows how these requirements pose a problem for conventional projection based x-ray microscopes, specifically the requirement to place the sample in near contact with the x-ray source. The article then discusses the results from the Micro-XCT, an x-ray tomographic imaging microscope designed by Xradia, Inc., whose unique design allows for the required 180 degrees of sample rotation while simultaneously maintaining resolutions as high as 1 micrometer.


2021 ◽  
Vol 11 (17) ◽  
pp. 8148
Author(s):  
Yuan Chen ◽  
Ping Lai ◽  
Hong-Zhong Huang ◽  
Peng Zhang ◽  
Xiaoling Lin

With the development of 3D integrated packaging technology, failure analysis is facing more and more challenges. Defect localization in a 3D package is a key step of failure analysis. The complex structure and materials of 3D package devices demand non-destructive defect localization technology for full packages. Magnetic field imaging and three-dimensional X-ray technology are not affected by package material or form. They are effective methods to realize defect localization on 3D packages. In this paper, magnetic field imaging and high-resolution three-dimensional X-ray microscopy were used to localize the open defect in a 3D package with a TSV daisy chain. A two-probe RF method in magnetic field imaging was performed to resolve isolation of the defect difficulties resulting from many different branches of TSV daisy chains. Additionally, a linear decay method was used to target sub-micron resolution at a long working distance. Multiple partition scans from a high-resolution 3D X-ray microscopy with a two-stage magnification structure were used to achieve sub-micron resolution. The open location identified by magnetic field imaging was consistent with that identified by a three-dimensional X-ray microscope. The opening was located on the top metal in the proximity of the fifth via. Physical failure analysis revealed the presence of a crack in the top metal at the opening location.


2021 ◽  
Author(s):  
Allen Gu ◽  
Andriy Andreyev ◽  
Masako Terada ◽  
Bernice Zee ◽  
Syahirah Mohammad-Zulkifli ◽  
...  

Abstract Over the past decade, 3D X-ray technique has played a critical role in semiconductor package failure analysis (FA), primarily owing to its non-destructive nature and high resolution capability [1,2]. As novel complex IC packages soar in recent years [3,4], X-ray failure analysis faces increasing challenges in imaging new advanced packages because IC interconnects are more densely packed in larger platforms. It takes several hours to overnight to image fault regions at high resolution or the crucial details of a defect remain undetected. A high-productivity X-ray solution is required to substantially speed up data acquisition while maintaining image quality. In this paper, we propose a new deep learning high-resolution reconstruction (DLHRR) method, capable of speeding up data acquisition by at least a factor of four through the implementation of pretrained neural networks. We will demonstrate that DLHRR extracts signals from low-dose data more efficiently than the conventional Feldkamp-Davis-Kress (FDK) method, which is sensitive to noise and prone to the aliasing image artifacts. Several semiconductor packages and a commercial smartwatch battery module will be analyzed using the proposed technique. Up to 10x scan throughput improvement was demonstrated on a commercial IC package. Without the need of any additional X-ray beam-line hardware, the proposed method can provide a viable and affordable solution to turbocharge X-ray failure analysis.


Author(s):  
Pim Kaskes ◽  
Thomas Déhais ◽  
Sietze J. de Graaff ◽  
Steven Goderis ◽  
Philippe Claeys

ABSTRACT Quantitative insights into the geochemistry and petrology of proximal impactites are fundamental to understand the complex processes that affected target lithologies during and after hypervelocity impact events. Traditional analytical techniques used to obtain major- and trace-element data sets focus predominantly on either destructive whole-rock analysis or laboratory-intensive phase-specific micro-analysis. Here, we present micro–X-ray fluorescence (µXRF) as a state-of-the-art, time-efficient, and nondestructive alternative for major- and trace-element analysis for both small and large samples (up to 20 cm wide) of proximal impactites. We applied µXRF element mapping on 44 samples from the Chicxulub, Popigai, and Ries impact structures, including impact breccias, impact melt rocks, and shocked target lithologies. The µXRF mapping required limited to no sample preparation and rapidly generated high-resolution major- and trace-element maps (~1 h for 8 cm2, with a spatial resolution of 25 µm). These chemical distribution maps can be used as qualitative multi-element maps, as semiquantitative single-element heat maps, and as a basis for a novel image analysis workflow quantifying the modal abundance, size, shape, and degree of sorting of segmented components. The standardless fundamental parameters method was used to quantify the µXRF maps, and the results were compared with bulk powder techniques. Concentrations of most major elements (Na2O–CaO) were found to be accurate within 10% for thick sections. Overall, we demonstrate that µXRF is more than only a screening tool for heterogeneous impactites, because it rapidly produces bulk and phase-specific geochemical data sets that are suitable for various applications within the earth sciences.


Author(s):  
Robert A. Grant ◽  
Laura L. Degn ◽  
Wah Chiu ◽  
John Robinson

Proteolytic digestion of the immunoglobulin IgG with papain cleaves the molecule into an antigen binding fragment, Fab, and a compliment binding fragment, Fc. Structures of intact immunoglobulin, Fab and Fc from various sources have been solved by X-ray crystallography. Rabbit Fc can be crystallized as thin platelets suitable for high resolution electron microscopy. The structure of rabbit Fc can be expected to be similar to the known structure of human Fc, making it an ideal specimen for comparing the X-ray and electron crystallographic techniques and for the application of the molecular replacement technique to electron crystallography. Thin protein crystals embedded in ice diffract to high resolution. A low resolution image of a frozen, hydrated crystal can be expected to have a better contrast than a glucose embedded crystal due to the larger density difference between protein and ice compared to protein and glucose. For these reasons we are using an ice embedding technique to prepare the rabbit Fc crystals for molecular structure analysis by electron microscopy.


Author(s):  
G. Van Tendeloo ◽  
J. Van Landuyt ◽  
S. Amelinckx

Polytypism has been studied for a number of years and a wide variety of stacking sequences has been detected and analysed. SiC is the prototype material in this respect; see e.g. Electron microscopy under high resolution conditions when combined with x-ray measurements is a very powerful technique to elucidate the correct stacking sequence or to study polytype transformations and deviations from the ideal stacking sequence.


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