Temperature effect on reflected laser probing signal of multiple elementary substructures

2014 ◽  
Author(s):  
M. M. Rebai ◽  
F. Darracq ◽  
J-P. Guillet ◽  
D. Lewis ◽  
P. Perdu ◽  
...  
Keyword(s):  
Temperature Effect ◽  
Laser Probing ◽  
Probing Signal

Transient gain-versus-absorption laser probing of spin-orbit states, kinetics and dynamics

1987 ◽  
Vol 84 ◽  
pp. 385-391
Author(s):  
Smedley John E. ◽  
Hess Wayne P. ◽  
Haugen Harold K. ◽  
R. Leone Stephen
Keyword(s):  
Spin Orbit ◽  
Laser Probing ◽  
Kinetics And Dynamics

Analysis of the high temperature effect in conical nozzle

2017 ◽  
Author(s):  
João Felipe de Araujo Martos ◽  
Paulo Toro ◽  
Israel Rêgo ◽  
sergio nicolás pachón laitón ◽  
Bruno Coelho Lima
Keyword(s):  
High Temperature ◽  
Temperature Effect ◽  
Conical Nozzle ◽  
High Temperature Effect

TEMPERATURE EFFECT ON MICROSTRUCTURAL ANALYSIS OF STEEL DURING HEAT TREATMENT

2020 ◽  
Author(s):  
SAMUEL BRITO ◽  
RODOLFO SOBRAL ◽  
Luiz Carlos Sacramento ◽  
Marcos Paulo de Souza Junior
Keyword(s):  
Heat Treatment ◽  
Temperature Effect ◽  
Microstructural Analysis

Study on Temperature Effect of Single Expansion Joint Bridge

2012 ◽  
Vol 18 (5) ◽  
pp. 1619-1626
Author(s):  
Yibin Zhao ◽  
Xudong Shao ◽  
Jia Li ◽  
Xiaoqin Jin ◽  
Jing Ma ◽  
...  
Keyword(s):  
Temperature Effect ◽  
Expansion Joint

VLSI for Space Applications—Single Event Effect Investigation and Optical Analysis on an Integrated Laser Platform

2017 ◽  
Author(s):  
Samuel Chef ◽  
Chung Tah Chua ◽  
Yu Wen Siah ◽  
Philippe Perdu ◽  
Chee Lip Gan ◽  
...  
Keyword(s):  
Pulsed Laser ◽  
Single Event ◽  
Optical Analysis ◽  
Space Applications ◽  
Laser Probing ◽  
Single Event Effect ◽  
Evaluation Time ◽  
Black Boxes ◽  
System Use ◽  
First Time

Abstract Today’s VLSI devices are neither designed nor manufactured for space applications in which single event effects (SEE) issues are common. In addition, very little information about the internal schematic and usually nothing about the layout or netlist is available. Thus, they are practically black boxes for satellite manufacturers. On the other hand, such devices are crucial in driving the performance of spacecraft, especially smaller satellites. The only way to efficiently manage SEE in VLSI devices is to localize sensitive areas of the die, analyze the regions of interest, study potential mitigation techniques, and evaluate their efficiency. For the first time, all these activities can be performed using the same tool with a single test setup that enables a very efficient iterative process that reduce the evaluation time from months to days. In this paper, we will present the integration of a pulsed laser for SEE study into a laser probing, laser stimulation, and emission microscope system. Use of this system will be demonstrated on a commercial 8 bit microcontroller.

Visible Laser Probing (VLP) with GaP Solid Immersion Lens Demonstrating 110 nm Resolution in Common Laser Probing Applications

2016 ◽  
Author(s):  
Travis Eiles ◽  
Patrick Pardy
Keyword(s):  
Gallium Phosphide ◽  
Fault Isolation ◽  
Solid Immersion Lens ◽  
Laser Probing ◽  
Isolation Methods ◽  
Visible Laser ◽  
High Level ◽  
Industry Needs ◽  
Diameter Reduction ◽  
Better Than

Abstract This paper demonstrates a breakthrough method of visible laser probing (VLP), including an optimized 577 nm laser microscope, visible-sensitive detector, and an ultimate-resolution gallium phosphide-based solid immersion lens on the 10 nm node, showing a 110 nm resolution. This is 2x better than what is achieved with the standard suite of probing systems using typical infrared (IR) wavelengths today. Since VLP provides a spot diameter reduction of 0.5x over IR methods, it is reasonable, based simply on geometry, to project that VLP using the 577 nm laser will meet the industry needs for laser probing for both the 10 nm and 7 nm process nodes. Based on its high level of optimization, including high resolution and specialized solid immersion lens, it is highly likely that this VLP technology will be one of the last optically-based fault isolation methods successfully used.

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