Electrical characterization of SiO/sub x/N/sub y//Ta/sub 2/O/sub 5/ stacked gate oxides on strained-Si

Author(s):  
C.K. Maiti ◽  
S.K. Samanta ◽  
G.K. Dalapati ◽  
S. Chatterjee
2004 ◽  
Vol 72 (1-4) ◽  
pp. 253-256 ◽  
Author(s):  
C.K. Maiti ◽  
S.K. Samanta ◽  
G.K. Dalapati ◽  
S.K. Nandi ◽  
S. Chatterjee

1998 ◽  
Vol 525 ◽  
Author(s):  
A. Srivastava ◽  
H. H. Heinisch ◽  
E. Vogel ◽  
C. Parker ◽  
C. M. Osburn ◽  
...  

ABSTRACTThe quality and composition of ultra-thin 2.0 nm gate dielectrics advocated for the 0.1 μm technology regime is expected to significantly impact gate tunneling currents, P+-gate dopant depletion effects and boron penetration into the substrate in PMOSFETs. This paper presents a comparative assessment of alternative grown and deposited gate dielectrics in sub-micron fabricated devices. High quality rapid-thermal CVD oxides and oxynitrides are examined as alternatives to conventional furnace grown gate oxides. An alternative gate process using in-situ boron doped and RTCVD deposited poly-Si is explored. PMOSFETs with Leff down to 0.06 μm were fabricated using a 0.1 μm technology. Electrical characterization of fabricated devices revealed excellent control of gate-boron depletion with the in-situ gate deposition process in all devices. Boron penetration of 2.0 nm gate oxides was effectively controlled by the use of a lower temperature RTA process. The direct tunneling leakage, although significant at these thicknesses, was less than 1 mA/cm2 at Vd = −1.2 V for all dielectrics. MOSFETs with comparable drive currents and excellent junction and off-state leakages were obtained with each dielectric.


2000 ◽  
Vol 15 (7) ◽  
pp. 761-765 ◽  
Author(s):  
S Maikap ◽  
S K Ray ◽  
S John ◽  
S K Banerjee ◽  
C K Maiti

2012 ◽  
Vol 717-720 ◽  
pp. 797-800
Author(s):  
J. Jay McMahon ◽  
Liang Chun Yu ◽  
Jody Fronheiser ◽  
J.T. Elson ◽  
Roger Kovalec ◽  
...  

We describe fabrication of Van der Pauw (VDP) structures for characterization of gate oxides grown on 4H SiC epi surfaces. Implementation of sub-resolvable features (SRF) as a corner compensation mechanism is analyzed with challenges and advantages presented. Results of on-wafer screening tests suggest that implementation of SRFs widens tolerance for misalignment, producing similar yield between uncompensated VDPs with 0.2 micron overlap and compensated VDPs with 0.1 micron overlap for structures with best alignment. Optimization of SRFs for SiC could be an attractive option for extending lithographic capability in advanced devices.


2002 ◽  
Vol 46 (7) ◽  
pp. 991-995 ◽  
Author(s):  
Alok Sareen ◽  
Ann-Chatrin Lindgren ◽  
Per Lundgren ◽  
Stefan Bengtsson

2008 ◽  
Vol 23 (7) ◽  
pp. 075032
Author(s):  
Young-Joo Song ◽  
Vetpany Sivongsay ◽  
Khampone Mounphoumy ◽  
Bounmy Phanthavong ◽  
Vathsana Khanmvongsa ◽  
...  

2007 ◽  
Vol 54 (6) ◽  
pp. 1891-1897 ◽  
Author(s):  
M. Porti ◽  
S. Gerardin ◽  
M. NafrÍa ◽  
X. Aymerich ◽  
A. Cester ◽  
...  

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