A study of the influence of inter-metal dielectrics on electromigration performance

Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits ◽

10.1109/ipfa.1995.487615 ◽

2002 ◽

Author(s):

S. Foley ◽

A. Ryan ◽

D. Martin ◽

A. Mathewson

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