Multiple Fault Models for Timed FSMs

2006 ◽  
Author(s):  
Samrat S. Batth ◽  
M. Umit Uyar ◽  
Yu Wang ◽  
Mariusz A. Fecko
Keyword(s):  
Fault Models ◽  
Multiple Fault

scholarly journals Approximate Model-Based Diagnosis Using Greedy Stochastic Search

2010 ◽  
Vol 38 ◽  
pp. 371-413 ◽  
Author(s):  
A. Feldman ◽  
G. Provan ◽  
A. Van Gemund
Keyword(s):  
Failure Modes ◽  
Approximate Model ◽  
Stochastic Search ◽  
Abnormal Behavior ◽  
Fault Models ◽  
Multiple Fault ◽  
Deterministic Algorithms ◽  
Combinatorial Circuits ◽  
Weak Fault ◽  
Exact Bounds

We propose a StochAstic Fault diagnosis AlgoRIthm, called SAFARI, which trades off guarantees of computing minimal diagnoses for computational efficiency. We empirically demonstrate, using the 74XXX and ISCAS-85 suites of benchmark combinatorial circuits, that SAFARI achieves several orders-of-magnitude speedup over two well-known deterministic algorithms, CDA* and HA*, for multiple-fault diagnoses; further, SAFARI can compute a range of multiple-fault diagnoses that CDA* and HA* cannot. We also prove that SAFARI is optimal for a range of propositional fault models, such as the widely-used weak-fault models (models with ignorance of abnormal behavior). We discuss the optimality of SAFARI in a class of strong-fault circuit models with stuck-at failure modes. By modeling the algorithm itself as a Markov chain, we provide exact bounds on the minimality of the diagnosis computed. SAFARI also displays strong anytime behavior, and will return a diagnosis after any non-trivial inference time.

scholarly journals Fault Diagnosis on Multiple Fault Models by Using Pass/Fail Information

2008 ◽  
Vol E91-D (3) ◽  
pp. 675-682 ◽  
Author(s):  
Y. TAKAMATSU ◽  
H. TAKAHASHI ◽  
Y. HIGAMI ◽  
T. AIKYO ◽  
K. YAMAZAKI
Keyword(s):  
Fault Diagnosis ◽  
Fault Models ◽  
Multiple Fault

Magnetic Current Imaging Power Short Localization

2015 ◽  
Author(s):  
J. Gaudestad ◽  
F. Rusli ◽  
A. Orozco ◽  
M.C. Pun
Keyword(s):  
Thermal Imaging ◽  
Flip Chip ◽  
Optical Microscope ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Multiple Fault ◽  
Defect Location ◽  
Isolation Techniques ◽  
Chip Sample

Abstract A Flip Chip sample failed short between power and ground. The reference unit had 418Ω and the failed unit with the short had 16.4Ω. Multiple fault isolation techniques were used in an attempt to find the failure with thermal imaging and Magnetic Current Imaging being the only techniques capable of localizing the defect. To physically verify the defect location, the die was detached from the substrate and a die cracked was seen using a visible optical microscope.

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