Characteristic study of anand and modified anand creep models for area array type WLCSP

2016 ◽  
Author(s):  
Velsankar Ramachandran ◽  
Kuo-Ning Chiang
Keyword(s):  
Array Type ◽  
Area Array ◽  
Creep Models

A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads

1999 ◽  
Vol 123 (2) ◽  
pp. 127-131 ◽  
Author(s):  
Kuo-Ning Chiang ◽  
Chang-Ming Liu
Keyword(s):  
Thermal Stress ◽  
Solder Joint ◽  
Solder Joints ◽  
Numerical Models ◽  
Ball Grid Array ◽  
Stress Strain ◽  
Restoring Force ◽  
Array Type ◽  
Finite Element Software ◽  
Area Array

As electronic packaging technology moving to the CSP, wafer level packaging, fine pitch BGA (ball grid array) and high density interconnections, the wireability of the PCB/substrate and soldering technology are as important as reliability issues. In this work, a comparison of elliptical/round pads of area array type packages has been studied for soldering, reliability, and wireability requirements. The objective of this research is to develop numerical models for predicting reflow shapes of solder joint under elliptical/round pad boundary conditions and to study the reliability issue of the solder joint. In addition, a three-dimensional solder liquid formation model is developed for predicting the geometry, the restoring force, the wireability, and the reliability of solder joints in an area array type interconnections (e.g., ball grid array, flip chip) under elliptical and round pad configurations. In general, the reliability of the solder joints is highly dependent on the thermal-mechanical behaviors of the solder and the geometry configuration of the solder ball. These reliability factors include standoff height/contact angle of the solder joint, and the geometry layout/material properties of the package. An optimized solder pad design cannot only lead to a good reliability life of the solder joint but also can achieve a better wireability of the substrate. Furthermore, the solder reflow simulation used in this study is based on an energy minimization engine called Surface Evolver and the finite element software ABAQUS is used for thermal stress/strain nonlinear analysis.

Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects

2000 ◽  
Author(s):  
George M. Wenger ◽  
Richard J. Coyle ◽  
Patrick P. Solan ◽  
John K. Dorey ◽  
Courtney V. Dodd ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Failure Modes ◽  
Electroless Nickel ◽  
Electrical Performance ◽  
Printed Wiring Board ◽  
Solder Interconnects ◽  
Area Array ◽  
Surface Finishes ◽  
Soldering Reaction

Abstract A common pad finish on area array (BGA or CSP) packages and printed wiring board (PWB) substrates is Ni/Au, using either electrolytic or electroless deposition processes. Although both Ni/Au processes provide flat, solderable surface finishes, there are an increasing number of applications of the electroless nickel/immersion gold (ENi/IAu) surface finish in response to requirements for increased density and electrical performance. This increasing usage continues despite mounting evidence that Ni/Au causes or contributes to catastrophic, brittle, interfacial solder joint fractures. These brittle, interfacial fractures occur early in service or can be generated under a variety of laboratory testing conditions including thermal cycling (premature failures), isothermal aging (high temperature storage), and mechanical testing. There are major initiatives by electronics industry consortia as well as research by individual companies to eliminate these fracture phenomena. Despite these efforts, interfacial fractures associated with Ni/Au surface finishes continue to be reported and specific failure mechanisms and root cause of these failures remains under investigation. Failure analysis techniques and methodologies are crucial to advancing the understanding of these phenomena. In this study, the scope of the fracture problem is illustrated using three failure analysis case studies of brittle interfacial fractures in area array solder interconnects. Two distinct failure modes are associated with Ni/Au surface finishes. In both modes, the fracture surfaces appear to be relatively flat with little evidence of plastic deformation. Detailed metallography, scanning electron microscopy (SEM), energy dispersive x-ray analysis (EDX), and an understanding of the metallurgy of the soldering reaction are required to avoid misinterpreting the failure modes.

scholarly journals An Improved Mechanistic-Empirical Creep Model for Unsaturated Soft and Stabilized Soils

Materials ◽  
2021 ◽  
Vol 14 (15) ◽  
pp. 4146
Author(s):  
Xunli Jiang ◽  
Zhiyi Huang ◽  
Xue Luo
Keyword(s):  
Water Content ◽  
Unsaturated Soils ◽  
Simulation Analysis ◽  
Soft Soil ◽  
Creep Model ◽  
Subgrade Soils ◽  
Stabilized Soil ◽  
Deformation Behaviors ◽  
Creep Models ◽  
Moisture Conditions

Soft soils are usually treated to mitigate their engineering problems, such as excessive deformation, and stabilization is one of most popular treatments. Although there are many creep models to characterize the deformation behaviors of soil, there still exist demands for a balance between model accuracy and practical application. Therefore, this paper aims at developing a Mechanistic-Empirical creep model (MEC) for unsaturated soft and stabilized soils. The model considers the stress dependence and incorporates moisture sensitivity using matric suction and shear strength parameters. This formulation is intended to predict the soil creep deformation under arbitrary water content and arbitrary stress conditions. The results show that the MEC model is in good agreement with the experimental data with very high R-squared values. In addition, the model is compared with the other classical creep models for unsaturated soils. While the classical creep models require a different set of parameters when the water content is changed, the MEC model only needs one set of parameters for different stress levels and moisture conditions, which provides significant facilitation for implementation. Finally, a finite element simulation analysis of subgrade soil foundation is performed for different loading levels and moisture conditions. The MEC model is utilized to predict the creep behavior of subgrade soils. Under the same load and moisture level, the deformation of soft soil is largest, followed by lime soil and RHA–lime-stabilized soil, respectively.

scholarly journals Observational manifestations of ‘cosmological dinosaurs’ at redshifts z ∼ 20

2021 ◽  
Vol 503 (2) ◽  
pp. 3081-3088
Author(s):  
V K Dubrovich ◽  
Yu N Eroshenko ◽  
S I Grachev
Keyword(s):  
Black Hole ◽  
Atomic Hydrogen ◽  
Radiation Transfer ◽  
Ring Width ◽  
High Mass ◽  
Primordial Black Hole ◽  
Array Type ◽  
Local Sources ◽  
Order Of Magnitude ◽  
Very High

ABSTRACT We consider a primordial black hole of very high mass, $10^9\!-\!10^{10}\, \mathrm{M}_\odot$, surrounded by the dark matter and bayonic halo at redshifts z ∼ 20 without any local sources of energy release. Such heavy and concentrated objects in the early Universe were previously called ‘cosmological dinosaurs’. Spectral distribution and spatial variation of the brightness in the 21-cm line of atomic hydrogen are calculated with the theory of radiation transfer. It is shown that a narrow and deep absorption arises in the form of the spherical shell around the primordial black hole at the certain radius. The parameters of this shell depend almost exclusively on the mass of the black hole. The angular diameter 18 arcsec of the absorption ring at z ∼ 20 is well within the current technical possibilities of the Square Kilometre Array type telescopes. But the observation of the ring width itself requires an order of magnitude better resolution.

Numerically controlled sacrificial plasma oxidation using array-type electrode toward high-throughput deterministic machining

2011 ◽  
Vol 7 (3/4) ◽  
pp. 289
Author(s):  
Yasuhisa Sano ◽  
Keinosuke Yoshinaga ◽  
Shohei Kamisaka ◽  
Hidekazu Mimura ◽  
Satoshi Matsuyama ◽  
...  
Keyword(s):  
High Throughput ◽  
Plasma Oxidation ◽  
Array Type
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