The reaction mechanism of cupric oxide reduction under hydrogen plasma treatment for epoxy molding compound / lead-frames adhesion improve
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2019 ◽
Vol 92
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pp. 63-72
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2020 ◽
Vol 25
(2)
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pp. 171-185
2019 ◽
Vol 11
(5)
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pp. 05002-1-05002-7
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1977 ◽
Vol 42
(4)
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pp. 1266-1277
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