Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface
2019 ◽
Vol 92
◽
pp. 63-72
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2010 ◽
Vol 54
(5)
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pp. 594-602
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Keyword(s):
2000 ◽
Vol 130
(2-3)
◽
pp. 240-247
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Keyword(s):